EVALUATION KIT AVAILABLE MAX11102/03/05/06/10/11/15/16/17 2Msps/3Msps, Low-Power, Serial 12-/10-/8-Bit ADCs General Description Features The MAX11102/MAX11103/MAX11105/MAX11106/ S 2Msps/3Msps Conversion Rate, No Pipeline Delay MAX11110/MAX11111/MAX11115/MAX11116/ S 12-/10-/8-Bit Resolution MAX11117 are 12-/10-/8-bit, compact, high-speed, low- S 1-/2-Channel, Single-Ended Analog Inputs power, successive approximation analog-to-digital con- S Low-Noise 73dB SNR verters (ADCs). These high-performance ADCs include a high-dynamic range sample-and-hold and a high-speed S Variable I/O: 1.5V to 3.6V (Dual-Channel Only) serial interface. These ADCs accept a full-scale input Allows the Serial Interface to Connect Directly from 0V to the power supply or to the reference voltage. to 1.5V, 1.8V, 2.5V, or 3V Digital Systems The MAX11102/MAX11103/MAX11106/MAX11111 fea- S 2.2V to 3.6V Supply Voltage ture dual, single-ended analog inputs connected to the S Low Power ADC core using a 2:1 MUX. The devices also include a 3.7mW at 2Msps separate supply input for data interface and a dedicated 5.2mW at 3Msps input for reference voltage. In contrast, the single-chan- Very Low Power Consumption at 2.5A/ksps nel devices generate the reference voltage internally S External Reference Input (Dual-Channel Devices Only) from the power supply. S 1.3A Power-Down Current These ADCs operate from a 2.2V to 3.6V supply and consume only 5.2mW at 3Msps and 3.7mW at 2Msps. S SPI-/QSPI-/MICROWIRE-Compatible Serial The devices include full power-down mode and fast Interface wake-up for optimal power management and a high- S 10-Pin, 3mm x 3mm TDFN Package speed 3-wire serial interface. The 3-wire serial interface S 10-Pin, 3mm x 5mm MAX Package directly connects to SPI, QSPIK, and MICROWIRE devices without external logic. S 6-Pin, 2.8mm x 2.9mm SOT23 Package Excellent dynamic performance, low voltage, low power, S Wide -40NC to +125NC Operation ease of use, and small package size make these con- verters ideal for portable battery-powered data-acquisi- Applications tion applications, and for other applications that demand Data Acquisition low-power consumption and minimal space. Portable Data Logging These ADCs are available in a 10-pin TDFN package, Medical Instrumentation 10-pin FMAX package, and a 6-pin SOT23 package. Battery-Operated Systems These devices operate over the -40NC to +125NC tem- perature range. Communication Systems Automotive Systems Ordering Information PART PIN-PACKAGE BITS SPEED (Msps) NO. OF CHANNELS TOP MARK MAX11102AUB+ 10 FMAX-EP* 12 2 2 +ABBA MAX11102AUB/V+ 10 FMAX-EP* 12 2 2 +ABBR MAX11102ATB+ 10 TDFN-EP* 12 2 2 +AWI MAX11103AUB+ 10 FMAX-EP* 12 3 2 +AAAU MAX11103ATB+ 10 TDFN-EP* 12 3 2 +AWV Ordering Information continued at end of data sheet. Note: All devices are specified over the -40C to +125C operating temperature range. +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. QSPI is a trademark of Motorola, Inc. MICROWIRE is a registered trademark of National Semiconductor Corp. MAX is a registered trademark of Maxim Integrated Products, Inc. For pricing, delivery, and ordering information, please contact Maxim Direct 19-5245 Rev 8 7/13 at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com.MAX11102/03/05/06/10/11/15/16/17 2Msps/3Msps, Low-Power, Serial 12-/10-/8-Bit ADCs ABSOLUTE MAXIMUM RATINGS V to GND ............................................................-0.3V to +4V 10-Pin TDFN (derate 24.4mW/NC above +70NC) .......1951mW DD REF, OVDD, AIN1, AIN2, AIN to GND ........-0.3V to the lower of 10-Pin FMAX (derate 8.8mW/NC above +70NC)........707.3mW (V + 0.3V) and +4V Operating Temperature Range ......................-40NC to +125NC DD CS, SCLK, CHSEL, DOUT TO GND ............-0.3V to the lower of Junction Temperature .....................................................+150NC (V + 0.3V) and +4V Storage Temperature Range ............................ -65NC to +150NC OVDD AGND to GND ......................................................-0.3V to +0.3V Lead Temperature (soldering, 10s) ................................+300NC Input/Output Current (all pins) ...........................................50mA Soldering Temperature (reflow) ......................................+260NC Continuous Power Dissipation (T = +70NC) A 6-Pin SOT23 (derate 8.7mW/NC above +70NC) ...........696mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (MAX11102/MAX11103) (V = 2.2V to 3.6V, V = V , V = V . MAX11102: f = 32MHz, 50% duty cycle, 2Msps. MAX11103: f = 48MHz, DD REF DD OVDD DD SCLK SCLK 50% duty cycle, 3Msps. C = 10pF, T = -40NC to +125NC, unless otherwise noted. Typical values are at T = +25NC.) DOUT A A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY Resolution 12 Bits Integral Nonlinearity INL Q1 LSB Differential Nonlinearity DNL No missing codes Q1 LSB Offset Error OE Q0.3 Q3 LSB Gain Error GE Excluding offset and reference errors Q1 Q3 LSB Total Unadjusted Error TUE Q1.5 LSB Channel-to-Channel Offset Q0.4 LSB Matching Channel-to-Channel Gain Q0.05 LSB Matching DYNAMIC PERFORMANCE (MAX11103: f = 1MHz, MAX11102: f = 0.5MHz) AIN AIN MAX11103 70 72 Signal-to-Noise and Distortion SINAD dB MAX11102 70 72.5 MAX11103 70.5 72 Signal-to-Noise Ratio SNR dB MAX11102 70.5 73 MAX11103 -85 -75 Total Harmonic Distortion THD dB MAX11102 -85 -76 MAX11103 76 85 Spurious-Free Dynamic Range SFDR dB MAX11102 77 85 MAX11103: f = 1.0003MHz, f = 0.99955MHz 1 2 Intermodulation Distortion IMD -84 dB MAX11102: f = 500.15kHz, f = 499.56kHz 1 2 Full-Power Bandwidth -3dB point 40 MHz Full-Linear Bandwidth SINAD > 68dB 2.5 MHz Small-Signal Bandwidth 45 MHz Crosstalk -90 dB 2 Maxim Integrated