MAX13046E/MAX13047E 19-4149 Rev 1 8/08 Single- and Dual-Bidirectional Low-Level Translator General Description Features Bidirectional Level Translation The MAX13046E/MAX13047E 15kV ESD-protected bidirectional level translators provide level shifting for Operation Down to +1.1V on V L data transfer in a multivoltage system. The MAX13046E Ultra-Low Supply Current in Shutdown Mode is a single-channel translator, and the MAX13047E is a 1A (max) dual-channel translator. Externally applied voltages, Guaranteed Push-Pull Driving Data Rate V and V , set the logic level on either side of the CC L 8Mbps (+1.2V V +3.6V, V +5.5V) L CC device. The MAX13046E/MAX13047E utilize a transmis- 16Mbps (+1.8V V V +3.3V) L CC sion-gate-based design to allow data translation in Extended ESD Protection on the I/O V Lines CC either direction (V V ) on any single data line. The L CC 15kV Human Body Model MAX13046E/MAX13047E accept V from +1.1V to the L 15kV IEC61000-4-2 Air-Gap Discharge Method minimum of either +3.6V or (V + 0.3V), and V from CC CC 8kV IEC61000-4-2 Contact Discharge +1.65V to +5.5V, making these devices ideal for data Low Supply Current transfer between low-voltage ASICs/PLDs and higher Short-Circuit Protection voltage systems. Space-Saving DFN and UTQFN Packages The MAX13046E/MAX13047E feature a shutdown mode that reduces supply current to less than 1A thermal Pin Configurations short-circuit protection, and 15kV ESD protection on the V side for enhanced protection in applications that CC TOP VIEW route signals externally. The MAX13046E/MAX13047E MAX13046E operate at a guaranteed data rate of 8Mbps when push- V I/O V CC SHDN CC pull driving is used. 6 5 4 The MAX13046E is available in a 6-pin DFN package, and the MAX13047E is available in a 10-pin UTQFN. Both devices are specified over the extended -40C to +85C operating temperature range. + 1 2 3 V GND I/O V L1 L Applications DFN 1mm 1.5mm 2 I C and 1-Wire Level Translation CMOS Logic-Level Translation MAX13047E V N.C. CC Cell Phones 7 6 Portable Devices I/O V 8 5 I/O V CC1 CC2 GND 9 4 SHDN I/O VL1 10 3 N.C. 1-Wire is a registered trademark of Maxim Integrated Products, Inc. + 1 2 I/O V V L2 L Typical Application Circuits appear at end of data sheet. UTQFN 1.4mm 1.8mm Ordering Information/Selector Guide PART PIN-PACKAGE NUMBER OF CHANNELS TOP MARK MAX13046EELT+ 6 DFN (1mm x 1.5mm) 1 OC MAX13047EEVB+ 10 UTQFN (1.4mm x 1.8mm) 2 AAC Note: All devices are specified over the extended -40C to +85C operating temperature range. +Denotes a lead-free/RoHS-compliant package. EP = Exposed pad. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.Single- and Dual-Bidirectional Low-Level Translator ABSOLUTE MAXIMUM RATINGS (All voltages referenced to GND.) Junction-to-Ambient Thermal Resistance ( ) (Note 1) JA V ...........................................................................-0.3V to +6V 6-Pin DFN.................................................................477C/W CC V ..............................................................................-0.3V to +4V 10-Pin UTQFN ...........................................................20.1C/W L I/O V .......................................................-0.3V to (V + 0.3V) Junction-to-Ambient Thermal Resistance ( ) (Note 1) CC CC JC I/O V ............................................................-0.3V to (V + 0.3V) 6-Pin DFN................................................................20.1C/W L L SHDN........................................................................-0.3V to +6V 10-Pin UTQFN .........................................................143.1C/W Short-Circuit Duration I/O V , I/O V to GND...........Continuous Operating Temperature Range ...........................-40C to +85C L CC Power Dissipation (T = +70C) Junction Temperature......................................................+150C A 6-Pin DFN (derate 2.1mW/C above +70C) .............168mW Storage Temperature Range .............................-65C to +150C 10-Pin UTQFN (derate 6.9mW/C above +70C).........559mW Lead Temperature (soldering, 10s) .................................+300C Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = +1.65V to +5.5V, V = +1.1V to minimum of either +3.6V or ((V + 0.3V)), I/O V and I/O V are unconnected, T = -40C to CC L CC L CC A +85C, unless otherwise noted. Typical values are V = +3.3V, V = +1.8V at T = +25C.) (Notes 2, 3) CC L A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY V > 3.3V 1.1 3.6V CC V Supply Range V V L L V 3.3V 1.1 V + 0.3V CC CC V Supply Range V 1.65 5.5 V CC CC Supply Current from V I 10 A CC QVCC Supply Current from V I 15 A L QVL V Shutdown-Mode Supply Current I T = +25C, SHDN = GND 0.03 1A CC SD-VCC A V Shutdown-Mode Supply Current I T = +25C, SHDN = GND 0.03 1A L SD-VL A I/O V and I/O V Shutdown-Mode L CC I T = +25C, SHDN = GND 0.02 0.5 A SD-LKG A Leakage Current SHDN Input Leakage T = +25C 0.02 0.1 A A ESD PROTECTION Human Body Model 15V I/O V (Note 4) kV CC IEC 61000-4-2 Air-Gap Discharge 15V IEC 61000-4-2 Contact Discharge 8V All Other Pins Human Body Model 2 kV LOGIC-LEVEL THRESHOLDS V - L I/O V Input-Voltage High V V L IHL 0.2 I/O V Input-Voltage Low V 0.15 V L ILL 2 MAX13046E/MAX13047E