Product Information

MAX14618ETA+T

MAX14618ETA+T electronic component of Analog Devices

Datasheet
USB Switch ICs 3rd Generation USB Host Charger ID SW with CDP Emulation

Manufacturer: Analog Devices
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Price (USD)

1: USD 7.6067 ea
Line Total: USD 7.61

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 15 May to Fri. 17 May

MOQ : 1
Multiples : 1

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MAX14618ETA+T
Analog Devices

1 : USD 7.6067
10 : USD 5.4508
25 : USD 5.1465
100 : USD 4.4143
250 : USD 4.1852
500 : USD 3.8673
1000 : USD 3.5492
2500 : USD 3.422

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
On Resistance - Max
Supply Voltage - Min
Supply Voltage - Max
Number of Switches
Maximum Operating Temperature
Minimum Operating Temperature
Mounting Style
Package / Case
Packaging
Product
Configuration
On Time - Max
Off Time - Max
Operating Supply Voltage
Bandwidth
Series
Brand
Operating Supply Current
Pd - Power Dissipation
Factory Pack Quantity :
Switch Continuous Current
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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EVALUATION KIT AVAILABLE MAX14600MAX14605/ USB Host Charger Identification/ MAX14618 Adapter Emulators General Description Benefits and Features The MAX14600MAX14605 and MAX14618 are third- Improved Charger Interoperability generation USB 2.0 host charger identification devices USB CDP Emulation in S0 State that combine USB Hi-Speed analog switches with a USB Meets New USB Battery Charging (BC) Revision adapter emulator circuit. 1.2 Specification Backward-Compatible with Previous USB BC Revisions The MAX14600MAX14605 and MAX14618 Meets China YD/T1591-2009 Charging Specification support passthrough mode and auto mode. In charging Supports Standby Mode Charging for Apple and downstream port (CDP) pass-through mode, the devices BC Revision 1.2-Compatible Devices emulate the CDP function while supporting normal USB Greater User Flexibility traffic. The MAX14600/MAX14603/MAX14605 have a CB0 and CB1 Pins Control Multiple Automatic and pFET open-drain output (CEN), and the MAX14601/ Manual Charger States MAX14604/MAX14618 have an nFET open-drain output High Level of Integrated Features (CEN) to restart the peripheral connected to the USB host. Supports Remote Wake-Up (MAX14603/ All the devices support the CDP and standard downstream MAX14604/MAX14605/MAX14618) port (SDP) charging during the active state (S0) and Low-Capacitance USB 2.0 Hi-Speed Switch to support the dedicated charging port (DCP) charging Change Charging Modes during the standby state (S3/S4/S5). The MAX14603/ Automatic Current-Limit Switch Control MAX14604/MAX14605/MAX14618 support remote wakeup in Save Space on Board standby mode. The MAX14602/MAX14605 offer backward- 2mm x 2mm, 8-Pin TDFN Package compatible CDP emulation upgrade to the MAX14566E. Applications The MAX14600MAX14605/MAX14618 are available in an 8-pin (2mm x 2mm) TDFN package, and are specified USB Host Data/Chargers including: over the -40C to +85C extended temperature range. Laptop and Desktop Computers USB Hubs Ordering Information/Selector Guide appears at end of data Flat-Panel Displays with USB sheet. Media Players Game Consoles Typical Operating Circuit OVERCURRENT EXTERNAL 5V PROTECTOR POWER SWITCHING SUPPLY POWER SUPPLY CEN iPod USB A APPLE DOCK APPLE OR CONNECTOR DOCK iPhone Li+ BATTERY EMBEDDED PHONE OR MP3 V BUS PLAYER CONTROLLER CEN DM D- USB A STANDBY CB0 CONNECTOR MICRO-USB DP D+ USB A MICRO B CDP/FM CB1 CONNECTOR GND MAX14600 LAPTOP CHIPSET TDM USB TRANSCEIVER TDP iPhone and iPod are registered trademarks of Apple, Inc. 19-5957 Rev 4 2/16MAX14600MAX14605/ USB Host Charger Identification/ MAX14618 Adapter Emulators Absolute Maximum Ratings All voltages referenced to GND. Operating Temperature Range ........................... -40C to +85C V , TDP, TDM, CB0, CB1, DP, DM, CEN, CEN -0.3V to +6.0V Junction Temperature ......................................................+150C CC Continuous Current into Any Terminal ..............................30mA Storage Temperature Range ............................ -65C to +150C Continuous Power Dissipation (T = +70C) Lead Temperature (soldering, 10s) .................................+300C A TDFN (derate 11.9mW/C above +70C) .................953.5mW Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics TDFN Junction-to-Ambient Thermal Resistance ( ) ..........84C/W JA Junction-to-Case Thermal Resistance ( ) ...............37C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 3.0V to 5.5V, T = T to T , unless otherwise noted. Typical values are at V = 5.0V, T = +25C.) (Note 2) CC A MIN MAX CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY V > V (Note 6) 3.0 5.5 CB0 IH Power-Supply Range V V CC V = 0V (Note 3) 4.75 5.25 CB0 V = V = V = 5.25V, CM mode 50 100 CB0 CB1 CC V = V = 5.25V, V = 0V, PM mode 4 20 CB0 CC CB1 Supply Current I V = 0V, V = V = 5.25V, FM mode 10 50 A CC CB0 CB1 CC V = 0V, V = V = 5.25V (MAX14618) 130 200 CB0 CB1 CC V = V = 0V, AM mode 130 200 CB0 CB1 ANALOG SWITCH Analog-Signal Range V , V 0 V V DP DM CC V = V = 0V to V , TDP TDM CC On-Resistance TDP/TDM Switch R 3.5 6.5 ON I = I = 10mA TDP TDM On-Resistance Match Between V = 5.0V, V = V = 400mV, CC DP DM R 0.1 ON Channels TDP/TDM Switch I = I = 10mA DP DM On-Resistance Flatness V = 5.0V, V = V = 0 to V , CC DP DM CC R 0.1 FLAT TDP/TDM Switch I = I = 10mA DP DM V = 0V, V = V , V = 1V, CB0 CB1 CC DP On-Resistance of DP/DM Short R 70 120 SHORT R = 20k DM I V = 3.6V, V = V = 0.3V to 3.3V, TDPOFF, CC DP DM Off-Leakage Current -250 +250 nA I V = V = 3.3V to 0.3V TDMOFF TDP TDM I , V = 3.6V, V = V = 3.3V to 0.3V, DPON CC DP DM On-Leakage Current -250 +250 nA I V = V DMON CB CC DYNAMIC PERFORMANCE (Note 4) V or V = 1.5V, R = 300, TDP TDM L Turn-On Time t 300 800 s ON C = 35pF, V = V V = 0V, Figure 1 L IH CC, IL Maxim Integrated 2 www.maximintegrated.com

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AD4
ANALOG DEVICES
Analog Devices Hittite
ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
Analog Devices, Inc.
DA4
Dallas
DALLAS / MAXIM
Dallas Semiconductor (VA)
LINEAR
LINEAR TECH
Linear Technology
Linear Technology (part of ADI)
LT
LT4
MAXIM
Maxim Integrated
MAXIM INTEGRATED / ANALOG DEVICES
Maxim Integrated Products
MAXIM-DALLAS
MX4
Technology
Trinamic
TRINAMIC / ANALOG DEVICES
Trinamic Motion Control
Trinamic Motion Control GmbH

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