EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver with 35kV HBM ESD Protection General Description Benefits and Features Integrated Protection Increases Robustness The MAX14783E is a half-duplex RS-485/422 transceiver that operates at either 3.3V or 5V rails with high 35kV High ESD Protection ESD performance and up to 42Mbps data rate. The 35kV HBM ESD per JEDEC JS-001-2012 device is optimized for high speeds over extended cable 20kV Air Gap per IEC 61000-4-2 runs while maximizing tolerance to noise. 12kV Contact ESD per IEC 61000-4-2 4kV EFT per IEC 61000-4-4 The MAX14783E is available in 8-pin MAX , 8-pin SO, Short-Circuit Protected Outputs and 8-pin TDFN-EP packages. The device in the TDFN-EP True Fail-Safe Receiver Prevents False Transition package operates over the -40C to +125C temperature on Receiver Input Short or Open Events range. The MAX14783E in the MAX and SO packages Hot-Swap Capability Eliminates False Transitions operates over the -40C to +85C and -40C to +125C During Power-Up or Hot Insertion temperature ranges. 3V to 5.5V Supply Voltage Range Applications High-Speed Data Rates up to 42Mbps Motion Controllers -40C to +125C Operating Temperature Field Bus Networks Allows Up to 32 Transceivers on the Bus Encoder Interfaces Low 10A (max) Shutdown Current for Lower Power Backplane Busses Consumption Ordering Information appears at end of data sheet. Functional Diagram V CC MAX14783E RO R RE B SHUTDOWN A DE DI D GND MAX is a registered trademark of Maxim Integrated Products, Inc,. 19-6734 Rev 2 7/20MAX14783E High-Speed 3.3V/5V RS-485/RS-422 Transceiver with 35kV HBM ESD Protection Absolute Maximum Ratings (Voltages referenced to GND.) Junction Temperature ......................................................+150 C V .....................................................................-0.3V to +6.0V Storage Temperature Range ............................ -65 C to +150C CC RO ............................................................ -0.3V to (V + 0.3V) Continuous Power Dissipation (T = +70C) CC A RE, DE, DI ............................................................-0.3V to +6.0V MAX (derate at 4.8mW/C above +70C) .................387mW SO (derate at 7.6mW/C above +70C) ......................606mW A, B (V 3.6V) .............................................-8.0V to +13.0V CC TDFN-EP (derate at 24.4mW/C above +70C) ........1951mW A, B (V < 3.6V) .............................................-9.0V to +13.0V CC Lead Temperature (soldering, 10s) .................................+300C Short-Circuit Duration (RO, A, B) to GND .................Continuous Soldering Temperature (reflow) ...................................... +260 C Operating Temperature Range MAX14783EE ............................................... -40C to +85C MAX14783EA ............................................. -40 C to +125C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 8 SOIC Package Code S8+4 Outline Number 21-0041 Land Pattern Number 90-0096 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 132C/W JA Junction to Case ( ) 38C/W JC PACKAGE TYPE: 8 TDFN Package Code T833+2 Outline Number 21-0137 Land Pattern Number 90-0059 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8C/W JC PACKAGE TYPE: 8 MAX Package Code U8+1 Outline Number 21-0036 Land Pattern Number 90-0092 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 206C/W JA Junction to Case ( ) 42C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com