MAX14784E/MAX14786E/ Full-Duplex, 35kV ESD-Protected, MAX14787E/MAX14789E RS-485 Transceivers for High-Speed Communication General Description Benefits and Features The MAX14784E/MAX14786E/MAX14787E/MAX14789E Flexibility full-duplex RS-485 transceivers are designed for robust Use in Full-Duplex or Half-Duplex Applications communication in harsh industrial environments. All Wide 3.0V to 5.5V Supply Voltage Range Available with 500kbps and 25Mbps Speed Options devices feature 35kV ESD protection on the RS-485 pins and operate from a 3V to 5.5V supply with a 4mA Available in 8-Pin and 14-Pin SO and TSSOP Packages no-load supply current (max). Optimized for Performance in Harsh Industrial The MAX14784E/MAX14787E are optimized for communi- cation over very long cables or short unterminated cables. Environments 35kV ESD (HBM) Protection on RS-485 I/O Ports The MAX14784E/MAX14786E are available in a 14-pin Extended Operating Temperature Range SO package and operate over the -40C to +125C tem- Slew-Rate Limited Outputs (MAX14784E/ perature range. The MAX14786E is also available in a MAX14787E) 14-pin TSSOP package. Integrated Receiver Deglitch Filter Increases Noise The MAX14787E/MAX14789E are optimized for space- Immunity (MAX14784E/MAX14787E/) constrained applications and are available in an 8-pin SO Short-Circuit Protected Outputs package, operating over the -40C to +105C temperature True Fail-Safe Receiver range. Thermal Shutdown Applications 1/4-Unit Load Allows up to 128 Transceivers on the Bus Motion Controllers Encoder Interfaces HVAC Control Systems Ordering Information appears at end of data sheet. Utility Meters Functional Diagram A A RO R RO B R RE B RE V CC V CC SHUTDOWN DE DE Z Z DI DI D D Y Y MAX14784E MAX14787E MAX14786E MAX14789E 19-6863 Rev 2 1/15MAX14784E/MAX14786E/ Full-Duplex, 35kV ESD-Protected, MAX14787E/MAX14789E RS-485 Transceivers for High-Speed Communication Absolute Maximum Ratings (All voltages referenced to GND.) Operating Temperature Range V .....................................................................-0.3V to +6.0V 8 SO ............................................................. -40C to +105C CC RE, RO ..................................................... -0.3V to (V + 0.3)V 14 SO ........................................................... -40C to +125C CC DE, DI ...................................................................-0.3V to +6.0V TSSOP .......................................................... -40C to +125C A, B, Y, Z ...........................................................-8.0V to +13.0V Junction Temperature ......................................................+150C Short-Circuit Duration ................................................Continuous Storage Temperature Range ............................ -65C to +150C Continuous Power Dissipation (T = +70C) Lead Temperature (soldering, 10s) .................................+300C A 8 SO (derate 7.6mW/C above +70C) .......................606mW Soldering Temperature (reflow) .......................................+260C 14 SO (derate 11.9mW/C above +70C) ...................952mW TSSOP (derate 10mW/C above +70C) ....................796mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) Junction-to-Case Thermal Resistance ( ) Junction-to-Ambient Thermal Resistance ( ) JC JA 8 SO ............................................................................38C/W 8 SO ..........................................................................132C/W 14 SO ..........................................................................34C/W 14 SO ..........................................................................84C/W TSSOP .........................................................................30C/W TSSOP .........................................................................30C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 3.0V to 5.5V, T = T to T , unless otherwise noted. Typical values are at V = 5V, and T = +25C.) (Notes 2, 3) CC A MIN MAX CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY Supply Voltage V 3.0 5.5 V CC Supply Current I DE = high, RE = low, no load 1.9 4 mA CC Shutdown Supply Current I DE = low, RE = high 5 10 A SHDN DRIVER R = 54, V = 4.5V, Figure 1 2.1 L CC Differential Driver Output V R = 100, V = 3.0V, Figure 1 2.0 V OD L CC R = 54, V = 3.0V, Figure 1 1.5 L CC Change in Magnitude of Differ- V R = 100 or 54, Figure 1 (Note 4) 0.2 V OD L ential Driver Output Voltage Driver Common-Mode Output V R = 100 or 54, Figure 1 (Note 4) V /2 3 V OC L CC Voltage Change in Magnitude of Driver V R = 100 or 54, Figure 1 (Note 4) 0.2 V OC L Common-Mode Output Voltage Single-Ended Driver Output V Y and Z outputs, I = -20mA 2.2 V OH Y,Z Voltage High Single-Ended Driver Output V Y and Z outputs, I = +20mA 0.8 V OL Y,Z Votlage Low Differential Driver Output Ca- C DE = RE = high, f = 4MHz 12 pF OD pacitance Maxim Integrated 2 www.maximintegrated.com