MAX14988 2.5A Octal Three-Level Digital Pulsers with TR Switches General Description Benefits and Features The MAX14988 octal three-level, high-volage (HV) puls- Saves Space in High-Channel-Count and Portable er device generates high-frequency HV bipolar pulses Systems (up to Q105V) from low-voltage control logic inputs for High Density driving piezoelectric transducers in ultrasound systems. 8 Channels (Three-Level Operation) All eight channels have embedded overvoltage-pro- Integrated Low-Power T/R Switches tection diodes and an integrated active return-to-zero DirectDrive Architecture Eliminates External clamp. The device has embedded independent (floating) High-Voltage Capacitor power supplies (FPS) and level shifters that allow signal No External Floating Power Supply (FPS) transmission without the need for external HV capacitors. Required The device also features eight integrated transmit/receive High Performance Enhances Image Quality) (T/R) switches. Excellent -43dBc (typ) THD for Second The device features two modes of operation: shutdown Harmonic at 5MHz mode and octal three-level pulser mode (with integrated Sync Function Eliminates Effects of FPGA Jitter active return-to-zero clamp). In octal three-level pulser and Improves Performance in Doppler Mode mode, each channel is controlled by two logic inputs Low Propagation Delay 10.8ns (typ) (DINN /DINP ) and the active return to zero features half Strong Active Return to Zero the current driving of the pulser 1.25A (typ). Conserves Power The device can operate both in clocked and transparent Low Quiescent Power Dissipation (13mW/Channel) mode. In clocked mode, data inputs can be synchronized Programmable Current Capability with a clean differential or single-ended clock to reduce Shutdown Mode phase noise associated with FPGA output signals that are detrimental for Doppler analysis. In transparent mode, the Applications synchronization feature is disabled and output reflects the Ultrasound Medical Imaging data input after a 10.8ns delay. The device features adjust- Industrial Flaw Detection able maximum current (0.44A to 2.5A) to reduce power Piezoelectric Drivers consumption when full current capability is not required. Test Equipment The device features integrated grass-clipping diodes (with low parasitic capacitance) for receive (Rx) and transmit Functional Diagram (Tx) isolations. The device features a damping circuit that can be activated as soon as the transmit burst is over. V V PP NN The damping circuit has an on-resistance of 200I. It fully MAX14988 VPP discharges the pulsers output internal node before the V GRASS-CLIPPING V DS EEA DIODES grass-clipping diodes. VGP VCCA OUT V EE VGN The device is available in a 68-pin (10mm x 10mm) TQFN V CC package with an exposed pad and are specified over the DAMP GND VDS -40NC to +85NC extended temperature range. LVOUT POWER SUPPLIES V CC0 NN T/R SWITCH AND DIGITAL PULSER CONTROL GND GND CC1 CIRCUIT Ordering Information appear at end of data sheet. MODE VEE CLK CLK VCC GND SYNC DINN GND DINP DirectDrive is a registered trademark of Maxim Integrated Products, Inc. 19-7467 Rev 0 12/14MAX14988 2.5A Octal Three-Level Digital Pulsers with TR Switches Absolute Maximum Ratings (All voltages referenced to GND.) THP Logic Output Voltage Range ........................-0.3V to +5.6V V Logic Supply Voltage Range ........................-0.3V to +5.6V V Output Voltage DD GP V , V Positive Driver Supply Voltage Range ..-0.3V to +5.6V Range ..........max (V - 5.6V), (V + 0.6V) to (V + 0.3V) CC CCA PP EE PP V , V Negative Driver Supply Voltage Range ...-5.6V to +0.3V V Output Voltage EE EEA GN V High Negative Range .........(V - 0.3V) to min (V + 0.6V), (V + 5.6V) NN NN CC NN Supply Voltage Range .....................................-110V to +0.3V Continuous Power Dissipation (T = +70C) A V High Positive TQFN (derate 50mW/NC above +70C) ....................4000mW PP Supply Voltage Range .....................................-0.3V to +110V Operating Temperature Range ........................... -40C to +85C OUT Output Voltage Range ................................... V to V Maximum Junction Temperature .....................................+150C NN PP LVOUT Output Voltage Range Storage Temperature Range ............................ -65C to +150C (100mA Maximum Current)............................-1.2V to +1.2V Lead Temperature (soldering, 10s) .................................+300C DINN , DINP , CC , SYNC, MODE ....................-0.3V to +5.6V Soldering Temperature (reflow) .......................................+260C CLK, CLK Voltage Range ......................... -0.3V to (V + 0.3V) CC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TQFN Junction-to-Ambient Thermal Resistance ( ) ............20C/W Junction-to-Case Thermal Resistance ( ) ..................0.5C/W JA JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC Electrical Characteristics (V = +3V, V = +5V, V = +5V, V = -5V, V = -5V, V = +105V, V = -105V, 1F bypass capacitor between V and DD CC CCA EE EEA PP NN GN V , 1F bypass capacitor between V and V , no load, unless otherwise noted. Typical values are at T = +25C.) (Note 2) NN GP PP A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES (V , V , V , V , V ) DD CC EE PP NN Logic Supply Voltage V +1.7 +3 +5.25 V DD Positive Drive Supply Voltage V +4.9 +5 +5.1 V CC Negative Drive Supply Voltage V -5.1 -5 -4.9 V EE High-Side Supply Voltage V 0 +105 V PP Low-Side Supply Voltage V -105 0 V NN LOGIC INPUTS/OUTPUTS (DINN , DINP , MODE, SYNC, CC ) Low-Level Input Threshold V 0.2 x V V IL DD High-Level Input Threshold V 0.8 x V V IH DD Differential Input Resistance RIND 70 100 170 kW Between DINPx and DINNx Pulldown Input Resistance Pins RPD 70 100 170 kW MODE, SYNC, CC0, CC1 Logic Input Capacitance C 4 pF IN Logic Input Leakage I V = 0V or V -1 0 +1 A IN IN DD DINP, DINN THP Low-Level Output Voltage V Pullup resistor to V (R = 1k) 0.1 V OL DD PULLUP CLOCK INPUTS (CLK, CLK)DIFFERENTIAL MODE Differential Clock Input Voltage V 0.2 2 V CLKD P-P Range Maxim Integrated 2 www.maximintegrated.com