Product Information

MAX15068ATP+

MAX15068ATP+ electronic component of Analog Devices

Datasheet
Hot Swap Voltage Controllers Dual ORing, Single Hot-swap Controller with Accurate Power

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 10.5207 ea
Line Total: USD 10.52

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 1
Multiples : 1

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MAX15068ATP+
Analog Devices

1 : USD 10.5207
10 : USD 9.1646
25 : USD 8.7387
100 : USD 7.3001
490 : USD 6.6859
980 : USD 5.7015

0 - WHS 2


Ships to you between Thu. 23 May to Mon. 27 May

MOQ : 1
Multiples : 1

Stock Image

MAX15068ATP+
Analog Devices

1 : USD 10.206
10 : USD 8.8956
25 : USD 8.4798
100 : USD 7.0754
250 : USD 6.7604
490 : USD 6.1546
980 : USD 5.9486
2940 : USD 5.7548

     
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EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX15068 Dual ORing, Single Hot-Swap Controller with Accurate Current Monitoring General Description Benefits and Features The MAX15068 offers ORing function and hot-swap 2.9V to 18V Operating Voltage Range (ORing and features for two input-supply-rail applications requiring the Hot Swap) safe insertion and removal of circuit line cards from a live Seamless Power Transition of Redundant Supplies backplane. The device integrates dual ORing MOSFET Controls n-Channel MOSFETs controllers, a single hot-swap controller, electronic circuit- breaker protection, and power monitoring in a single < 0.5s Reverse Turn-Off Time package. The device operates on 2.9V to 18V supply Precision Current Monitoring voltages. Adjustable Slew-Rate Control The device regulates the forward voltage drop across the ORing MOSFETs to ensure smooth current transfer from Adjustable Current-Limit Fault Delay one supply to the other without oscillation. The ORing Adjustable Circuit-Breaker Current Threshold MOSFET turns on quickly to reduce the load voltage drop during supply switchover. If the input supply fails Inrush Current Regulated at Startup or is shorted, a fast turn-off minimizes reverse-current Adjustable Undervoltage Lockout transients. Small (4mm x 5mm) TQFN Package The device implements a foldback current limit during hot- swap startup in order to control inrush current, thereby Applications keeping the hot-swap MOSFET under safe operating area Baseband Station (SOA). After the hot-swap startup cycle is completed, on- Redundant Power Supplies chip comparators provide active current-limit protection against short-circuit and overcurrent faults. The load is Supply Holdup disconnected from the input quickly in the event of a fault Computer Systems and Servers condition. Telecom Networks Storage Bridge Bay The device provides a current-sense amplifier output. A voltage proportional to the current delivered to the system can be read directly at the IPMON pin. The device is factory-calibrated to deliver accurate overcurrent protection with 5% accuracy. During an overcurrent-fault condition, the device enters an autoretry mode. The device features an adjustable slew-rate control during startup. Additional features include power-good and fault-indicator outputs. The MAX15068 is available in a 20-pin, (4mm x 5mm) TQFN package and is specified from a -40C to +125C Ordering Information appears at end of data sheet. operating temperature range. 19-6872 Rev 3 10/19MAX15068 Dual ORing, Single Hot-Swap Controller with Accurate Current Monitoring Absolute Maximum Ratings IN1, IN2 to GND .......................................................-1V to +24V CP2 to IN2 .............................................................-0.3V to +14V PG, EN, FAULT, CSN to GND ..............................-0.3V to +24V OG1 .............................................(V - 0.3V) to (V + 0.3V) IN1 CP1 CSP to GND ............................Max (-0.3V, V - 0.6V) to +24V OG2 .............................................(V - 0.3V) to (V + 0.3V) IN IN2 CP2 V to GND ...............................................................-0.3V to +6V Current into EN, PG, FAULT ..............................................20mA S ON, PC, IPMON, CB, CDLY to GND ..........-0.3V to (V + 0.3V) Continuous Power Dissipation (T = +70C) S A CSP to CSN .........................................................-0.3V to +0.3V 20-Pin TQFN (derate 30mW/C above +70C) .........2400mW OUT to GND ..........................................................-0.3V to +24V Operating Temperature Range ......................... -40C to +125C GATE to GND ........................................................-0.3V to +36V Junction Temperature ......................................................+150C GATE to OUT ........................................................-0.3V to +20V Storage Temperature Range ............................ -65C to +150C CP1 to GND ..........................................................-0.3V to +36V Lead Temperature (soldering, 10s) .................................+300C CP1 to IN1 .............................................................-0.3V to +14V Soldering Temperature (reflow) .......................................+260C CP2 to GND ..........................................................-0.3V to +36V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 20-PIN TQFN Package Code T2045+1C Outline Number 21-0726 Land Pattern Number 90-100091 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 33.5C/W JA For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = V = 12V, C = C = C = 1F, T = -40C to +125C. Typical values are at T = +25C, unless otherwise noted.) (Note 1) IN1 IN2 IN1 IN2 VS A A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SUPPLY VOLTAGE Hot swap and ORing 2.9 18 Input Supply Voltage V V IN Current monitor 4.8 18 Input Supply Current I 4 mA IN Internal LDO Output Voltage V 4.8 5 5.25 V S V Undervoltage Lockout V V rising 2.5 2.65 2.8 V S UVLO S V Undervoltage-Lockout S V 0.07 V UVLO HYS Hysteresis V rising 2.4 2.49 2.58 CSP CSP Undervoltage Lockout V V CSP UVLO V falling 2.25 2.35 2.42 CSP Maxim Integrated 2 www.maximintegrated.com

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AD4
ANALOG DEVICES
Analog Devices Hittite
ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
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DA4
Dallas
DALLAS / MAXIM
Dallas Semiconductor (VA)
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Maxim Integrated Products
MAXIM-DALLAS
MX4
Technology
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TRINAMIC / ANALOG DEVICES
Trinamic Motion Control
Trinamic Motion Control GmbH

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