MAX20047 Dual 3A USB DCP Charger General Description Benefits and Features The MAX20047 is an automotive-grade, low-cost, small- Operating V Range of 3.5V to 36V IN footprint dual-port charger IC designed for automotive 40V Load-Dump Protection charging applications. It combines a fully synchronous 6A Synchronous DC-DC Converter with Integrated FETs step-down buck converter with integrated high-side and low- side FETs capable of operating with input voltages from 3.5V 93% Charge Efficiency at 3A Charging to 36V and delivering 5.2V output voltage. The IC features 0.4MHz to 2.2MHz Programmable Switching integrated iPod /iPhone 1.0A and iPad 2.1A dedicated Frequency by External Pin Settings charging modes. Spread-Spectrum Operation The IC delivers up to 3A of charging current with 93% Fixed 8ms Internal Soft-Start efficiency per port through integrated switches with 5.20V Output programmable current limit and thermal foldback control. The buck converter switching frequency is programmable 99% Duty-Cycle Operation with Low Dropout from 0.4MHz to 2.2MHz. Short-to-ground protection and 2% Output-Voltage Accuracy overcurrent protection are also provided on the protected Input System Overvoltage and Short-Circuit HVBUS outputs to protect the internal BUS power rail from Protection an overcurrent fault. The MAX20047 offers short-to-battery up to +18V and can also be ordered with spread-spectrum Accurate SRC DMOS Current Limiting with Minimal operation to reduce EMI. Voltage Drop Low R 15m Dual USB Power Switches ON Applications Adjustable SRC DMOS Current Limit by External USB Dedicated Charging Ports (DCP) Pin Settings Automotive Cigarette Lighter Adapters Integrated Current Sensing Power Supply for Linear Chargers Thermal Regulation and Thermal Shutdown Ordering Information appears at end of data sheet. Dual Autonomous Battery-Charging Ports with Portable Device Detection Integrated Apple 2.4A, 2.1A, 1.0A Detection Integrated Samsung Detection Integrated DCP Detection Robust for the Automotive Environment Short-to-Battery and Short-to-Ground Protection on Protected SRC DMOS Output Short-to-Battery and Short-to-PV Protection on Protected HVDP1, HVDM1, HVDP2, and HVDM2 Inputs Tested to ISO 10605 and IEC 61000-4-2 ESD Standards 20-Pin (5.0mm x 3.5mm) FC2-QFN Package -40C to +125C Operating Temperature Range iPod, iPhone, iPad, and Apple are registered trademarks of Apple Inc. AEC-Q100 Qualified Samsung is a registered trademark of Samsung Electronics Co., Ltd. 19-100165 Rev 0 9/17MAX20047 Dual 3A USB DCP Charger Absolute Maximum Ratings SUPSW, HVEN to PGND ......................................-0.3V to +40V HVDP1, HVDP2, HVPM1, HVDM2 to Ground ......-0.3V to +18V LX to PGND..........................................-0.3V to V + 0.3V LX Continuous Current ............................................................8A SUPSW BIAS to Ground ....................................................-0.3V to +6.0V Continuous Power Dissipation (T = +70C) A COMP to Ground ......................................-0.3V to V + 0.3V (Single-Layer Board BIAS G DMOS to Ground ...........................................-0.3V to +16.0V derate 13.2mW/C over +70C) .............................1052.6mW AGND to PGND ....................................................-0.3V to +0.3V Operating Temperature Range ......................... -40C to +125C PV to PGND ..........................................................-03V to +6.0V Maximum Junction Temperature .....................................+150C OUT to PGND .........................................................-0.3V to V Storage Temperature Range ..............................-60C to+150C PV BST to LX .............................................................-0.3V to +6.0V Lead Temperature (soldering, 10s) .................................+300C S DMOS1, S DMOS2 to Ground ...........................-0.3V to V Soldering Temperature (reflow) .......................................+260C PV ILIM, CONFIG, FOSC to Ground .............-0.3V to V + 0.3V BIAS Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) FC2-QFN Junction-to-Ambient Thermal Resistance ( ) ..........36C/W Junction-to-Case Thermal Resistance ( ) .....................2C/W JA JC Note 1: Thermal resistance can be lowered with improved board design. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 20 FC2-QFN F203A5F+1 21-100124 90-100045 Electrical Characteristics (T = -40C to +125C. Typical values are at V = +14V and T = +25C, unless otherwise noted.) (Note 3) A SUPSW A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Range V 3.5 36 V SUP Load-Dump-Event Supply V t < 1 40 V SUP LD LD s Voltage V = 14V HVEN = 0V, SUPSW Shutdown Supply Current I 6 15 A SHDN off state BIAS Regulator Voltage V = 14V, I < 10mA, SUPSW BIAS V 4.7 4.96 5.45 V BIAS (Nominal) BIAS not switched over to V OUT BIAS Undervoltage Lockout V V rising 2.7 3 3.3 V UV BIAS R BIAS (Rising) BIAS Undervoltage Lockout V 2.5 V UV BIAS F (Falling) BIAS Current Limit I 50 mA BIAS Maxim Integrated 2 www.maximintegrated.com