Click here to ask an associate for production status of specific part numbers. Automotive 4-Channel, 130mA Backlight Driver MAX20444C 2 with Boost/SEPIC Controller and I C Interface General Description Benefits and Features The MAX20444C is a 4-channel backlight driver IC with Wide Voltage-Range Operation boost controller for automotive displays. The integrated Operates Down to 4V Supply After Startup current outputs can sink up to 130mA LED current each. Survives Load Dumps Up to 52V The device accepts a wide 4.5V to 36V input volt- High Integration age range and withstands direct automotive load-dump Complete 4-Channel Solution Including Boost events. Controller The internal current-mode switching DC-DC controller 2 I C Control for Minimum Parts Count supports boost or SEPIC topologies and operates in the Robust and Low EMI 400kHz to 2.2MHz frequency range. Integrated spread Spread-Spectrum Oscillator spectrum helps reduce EMI. An adaptive output-voltage- Phase Shifting control scheme minimizes power dissipation in the LED 400kHz to 2.2MHz Switching-Frequency Range current-sink paths. Fail-Safe Operation Mode Using the FSEN Pin 2 The device features I C-controlled pulse-width-modu- Versatile Dimming Scheme Allows Hybrid or lation (PWM) dimming and hybrid dimming. In either 2 case, the minimum pulse width is 500ns. Phase-shifted PWM-Only Dimming Using DIM Input or I C dimming of the strings is incorporated for lower EMI. Dimming Ratio > 10,000:1 Using Hybrid Dimming 10,000:1 Dimming Ratio at 200Hz Using PWM Comprehensive diagnostic information is also available Dimming 2 through the I C interface, while stand-alone operation is also supported. Complete Diagnostics LED Open/Short Detection and Protection The MAX20444C is available in a 24-pin TQFN or 24-pin Boost Output Undervoltage and Overvoltage side-wettable TQFN (SWTQFN) package and operates over the -40C to +125C temperature range. Boost-Voltage Measurement LED-Current Measurement Applications Thermal Shutdown Infotainment Displays Compact (4mm x 4mm) 24-Pin TQFN and Central Information Displays SWTQFN Packages Instrument Clusters Ordering Information appears at end of data sheet. 19-101244 Rev 0 9/21 2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887 U.S.A. Tel: 781.329.4700 2021 Analog Devices, Inc. All rights reserved.MAX20444C Automotive 4-Channel, 130mA Backlight Driver 2 with Boost/SEPIC Controller and I C Interface Absolute Maximum Ratings IN, EN, OUT , BSTMON, PGATE to GND ...........-0.3V to +52V OUT Continuous Current............................ -150mA to +150mA PGND, LEDGND to GND .....................................-0.3V to +0.3V Continuous Power Dissipation V to GND ..........................-0.3V to +6V (min) of (V + 0.3V) Multilayer Board (T = +70C) ....................................2.857W CC IN A FLTB, SCL/IRANGE, I2CDIS/RSDT, Junction-to-Ambient Thermal Resistance ( ) ..............36C/W JA SDA/PSEN, DIM to GND .....................................-0.3V to +6V Package Thermal Resistance ( ) ..................................3C/W JC FSEN/ISET, CS, RT, COMP, Operating Temperature .................................... -40C to +125C NDRV, IREF to GND ...............................-0.3V to V + 0.3V Junction Temperature ....................................... -40C to +150C CC HDSET to GND ...........................................-0.3V to V + 0.3V Storage Temperature Range ............................ -65C to +150C CC NDRV Peak Current (< 100ns) .................................. -5A to +5A Lead Temperature Range ................................................+300C NDRV Continuous Current ........................... -100mA to +100mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information TQFN/SWTQFN TQFN SWTQFN Package Code T2444+4C T2444Y+4C Outline Number 21-0139 21-100290 Land Pattern Number 90-0022 90-0022 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 36C/W 41.27C/W JA Junction to Case ( ) 3C/W 3.44C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Analog Devices 2 www.analog.com