Product Information

MAX20766EPE+

MAX20766EPE+ electronic component of Analog Devices

Datasheet
Power Management Specialised - PMIC SMART SLAVE IC WITH INTEGRATED CURRENT AND TEMPERATURE SENSORS

Manufacturer: Analog Devices
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Price (USD)

1: USD 9.6021 ea
Line Total: USD 9.6

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 22 May to Tue. 28 May

MOQ : 1
Multiples : 1

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MAX20766EPE+
Analog Devices

1 : USD 9.6021
10 : USD 8.3538
25 : USD 7.0843
100 : USD 6.4969
490 : USD 5.796
980 : USD 5.0164

0 - WHS 2


Ships to you between Tue. 28 May to Thu. 30 May

MOQ : 1
Multiples : 1

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MAX20766EPE+
Analog Devices

1 : USD 9.9132
10 : USD 8.6331
25 : USD 8.2303
100 : USD 6.8809
250 : USD 6.5711
490 : USD 5.9773
980 : USD 5.7836

     
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MAX20766 Smart Slave IC with Integrated Current and Temperature Sensors General Description Benefits and Features The MAX20766 is a feature-rich smart slave IC designed Increased Power Density with Fewer External to work with Maxims seventh-generation controller to Components implement a high-density multiphase voltage regulator. Monolithic Integration for Reduced Parasitics Up to six smart slave ICs, plus a controller IC, provide Scalable Architecture Compatible with Coupled a compact synchronous buck converter that includes Inductors accurate individual phase-current and temperature report- 94% Peak Efficiency ing through SMBus/PMBus. This smart slave device Top-Side Cooling for Improved Heat Transfer to includes protection circuits for overtemperature, VX short, Ambient and all power-supply UVLO faults. If a fault is detected, Accurate Real-Time Telemetry of Critical Parameters the slave IC immediately shuts down and sends a fault PMBus-Compliant Interface through the Controller signal to the controller IC. IC for Telemetry and Power Management Monolithic integration and advanced packaging technolo- Junction Temperature Monitoring and Reporting gies allow practical per-phase, high-switching frequencies Per-Phase Current Reporting with significantly lower losses than alternative implemen- Advanced Self-Protection Features for the System tations. Smart slave ICs are designed to support phase and IC shedding and DCM modes for efficiency optimization over a wide range of load currents. High per-phase current- Overcurrent Protection capability designs with low C enable a design with OUT Overtemperature Protection fewer phases and a smaller footprint. Boost Voltage UVLO VX Short Protection The MAX20766 is available in a 16-pin FCQFN package with exposed top-side thermal pads. Top-side cooling improves heat transfer to ambient and reduces PCB and component temperatures. Ordering Information appears at end of data sheet. Applications Communication and Networking Equipment Servers and Storage Equipment PMBus is a trademark of SMIF, Inc. High-Current Voltage Regulators Networking ASICs FPGAs Typical Application Circuit Microprocessor Chipsets Memory CS1 CS2 MAX20766 DEVICE OPERATING INPUT T 1 SENSE TYPE CURRENT (A) VOLTAGE (V) CS6 SVID V Electrical 55 per phase OUT MULTIPHASE MAX20766 T 2 SENSE CONTROLLER SMBUS 24 per phase, 6.5 to 16.0 85C, PWM 1 two-phase PWM 2 SENSE- SENSE+ No Airflow application PWM 6 MAX20766 T 6 Note: For specific operating conditions, see the SOA curves in SENSE the Typical Operating Characteristics section. Thermal rating based on 2-phase data. 19-8577 Rev 1 12/17MAX20766 Smart Slave IC with Integrated Current and Temperature Sensors Absolute Maximum Ratings Supply Voltage V ............................................-0.3V to +18V Operating Temperature Range ......................... -40C to +125C DDH Supply and Input Pin Voltages V , V ............-0.3V to +2.5V Junction Temperature ......................................................+150C CC DD Switching-Node Voltage (VX) DC ..........................-0.3V to +18V Storage Temperature Range ............................ -65C to +150C Switching-Node Voltage (VX) 25ns (Note 1) ..........-10V to +23V Peak Reflow Temperature ...............................................+260C V Pin to VX Pin Differential 25ns (Note 2) ......-10V to +23V CS.........................................................................-0.3V to +2.5V DDH BST Pin (BST) DC..............................................-0.3V to +20.5V TS FAULT ...................................................-0.3V to V + 0.3V DD BST Pin (BST) 25ns ..............................................-6.0V to +27V PWM .....................................................................-0.3V to +2.5V BST Pin to VX Pin Differential ............................................+2.5V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Operating Ratings V , V ........................................................+1.71V to +1.98V DD CC 12V Supply (V ) ...........................................+6.5V to +16.0V DDH Frequency (f ) ............................................ 300kHz to 1.3MHz SW Note 1: The 25ns rating is the allowable voltage that the VX node may exceed the -0.3V to +18V ratings in either positive or negative direction for up to 25ns per cycle. Note 2: A high-frequency input bypass capacitor must be located less than 60mils (1.524mm) from the V and V pins. DDH SS Package Information PACKAGE TYPE: 16 FCQFN Package Code P163A6F+2 Outline Number 21-0986 Land Pattern Number 90-0490 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Case ( ) +0.42C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AD4
ANALOG DEVICES
Analog Devices Hittite
ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
Analog Devices, Inc.
DA4
Dallas
DALLAS / MAXIM
Dallas Semiconductor (VA)
LINEAR
LINEAR TECH
Linear Technology
Linear Technology (part of ADI)
LT
LT4
MAXIM
Maxim Integrated
MAXIM INTEGRATED / ANALOG DEVICES
Maxim Integrated Products
MAXIM-DALLAS
MX4
Technology
Trinamic
TRINAMIC / ANALOG DEVICES
Trinamic Motion Control
Trinamic Motion Control GmbH

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