Click here for production status of specific part numbers. MAX32000 High-Speed Quad Driver with Integrated DACs, Cable-Droop Compensation, Slew-Rate Control, and VHH Fourth-Level Drive General Description Benefits and Features The MAX32000 is a fully integrated, quad-channel, Low Power at High-Speed Maximizes Driver high-performance pin-electronics driver with built-in level- Performance setting DACs, ideal for memory and SOC ATE systems. 700mW per Channel Each MAX32000 channel includes a four-level pin driver, 2.57Gbps at +1V Programmed programmable cable-droop compensation, five 14-bit 280ps Typical Rise/Fall Times at +2V (20% to 80%) Very Low Timing Dispersion at 50ps Typical DACs, and a comparator that is useful for AC calibration. Wide Voltage Range from -2V to +6V The driver features a wide -2V to +6V operating range Integrated VHH Programming Mode (4th-Level and a data rate of 1200Mbps at +2V operation, and in Drive) up to 13V high-voltage mode (VHH mode) offers an output voltage 100nA Low-Leak Mode range of 0 to 13V. The device includes high impedance, Integrated Functionality Provides Value-Added Features active termination (3rd-level drive), and is highly linear Programmable Double Time Constant Cable-Droop even at low voltage swings. The calibration comparators Compensation and multiplexer provide a timing calibration path for each Digital Slew-Rate Control for EMI-Sensitive channel. A serial interface configures the device, easing Applications PCB signal routing. Adjustable Output Resistance with 360m The MAX32000 is available in a 64-pin TQFP-EPR pack- Resolution age with top-side exposed pad. 22 DACs to Generate DC Voltage Levels for Control and Monitoring Applications 50MHz SPI Interface Memory Testers SOC Testers Digital Testers Ordering Information Discrete Component ATE PART TEMP RANGE PIN-PACKAGE Burn-In Testers MAX32000CCB+ 0C to +70C 64 TQFP-EP* Wafer Testers +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. SPI is a trademark of Motorola, Inc. 19-100695 Rev 1 1/21MAX32000 High-Speed Quad Driver with Integrated DACs, Cable-Droop Compensation, Slew-Rate Control, and VHH Fourth-Level Drive Absolute Maximum Ratings V to GND .......................................................-0.3V to +11.0V ENVHH to DGND ..................................... -0.3V to (V + 0.3V) CC DD V to GND ..........................................................-6.0V to +0.3V OVALARM, TALARM to DGND ................ -0.3V to (V + 0.3V) EE DD Any V to Any V ........................................................+16.5V TEMP to GND ...............................(V - 0.3V) to (V + 0.3V) CC EE EE CC V to DGND .......................................................-0.3V to +5.0V REF to GND ................................................-0.3V to the lower of DD V to GND .....................................................-0.3V to +19.0V (GNDDAC + 2.6V) and (V + 0.3V) HHP CC REF Current .....................................................................75mA DGND to GND ....................................................................0.3V GNDDAC to GND ...........................................................0.3V All Digital Inputs................................................................30mA DUT Short-Circuit Duration .....................................Continuous DGND to GNDDAC ........................................................0.3V DGS to GND.....................................................................1.0V Continuous Power Dissipation 64-Pin TQFP (derate 125mW/C above +70C) ...........10.0W CTV, DATV , RTV to GND ....................................-0.3V to +5V Junction Temperature ......................................................+150C DATA , NDATA to GND...............(V - 0.3V) to (V + 0.3V) EE CC Operating Junction Temperature Range ..........+40C to +100C RCV , NRCV to GND .................(V - 0.3V) to (V + 0.3V) EE CC Storage Temperature ........................................ -65C to +150C CMP, NCMP to GND ................. (V - 1.1V) to (V + 0.3V) CTV CTV Lead Temperature (soldering, 10s) .................................+300C Current into CMP, NCMP .................................................10mA Soldering Temperature (reflow) .......................................+260C DATA to NDATA , RCV to NRCV ....................................1V ESD, Human Body Model: DUT to GND All Pins Excluding Below Pins .......................................2.000V (all modes except VHH) ............(V - 0.3V) to (V + 0.3V) EE CC ESD, Human Body Model: DATA , NDATA ...................1.500V DUT to GND (VHH mode) ................................-3.5V to +13.5V ESD, Human Body Model: RCV , NRCV , DATV , RTV ..1.500V DUT to V .......................................................................+19V EE Humidity................................................................... 10% to 90% SCLK, DIN, CS, LOAD, RST to DGND .... -0.3V to (V + 0.3V) DD Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) 64 TQFP-EP Junction-to-Ambient Thermal Resistance ( ) ..........40C/W JA Junction-to-Case Thermal Resistance ( ) .................1C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = +9.25V, V = -5.25V, V = +17.5V, V = +3.3V, V = +3V, V = +1.5V, V = 0V, V = V = 0V, CC EE HHP DD DHV DTV DLV DATV RTV V = +1.2V, V = +1V, V = +10V, CDRP = 000b, RO = 1110b, SC = 00b, V = V = V = 0V, specifica- CTV CMPV VHH DGS GND GNDDAC tions apply after calibration, level-setter errors included. The device is tested at T = +70C with an accuracy of 15C specification J compliance with supply and temperature variations are verified by guardbanding mean shifts of characterized data, unless otherwise noted. Temperature coefficients are measured at T = +40C and +100C, unless otherwise noted.) J PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DRIVER DRIVER DC CHARACTERISTICS (R 10M, unless otherwise noted, includes level-setter error) L V V = -2.0V, V = +1.5V -1.8 +6.0 DHV DLV DTV Output Voltage Range V V = +6.0V, V = +1.5V -2.0 +5.8 V DLV DHV DTV V V = +6.0V, V = -2.0V -2.0 +6.0 DTV DHV DLV V = +0.125V, V = -2.0V, DHV DLV V 2 DHV OS V = +1.5V DTV V = +0.125V, V = +6.0V, DLV DHV Output Offset Voltage (Note 2) V 2 mV DLV OS V = +1.5V DTV V = +0.125V, V = +6.0V, DTV DHV V 2 DTV OS V = -2.0V DLV Maxim Integrated 2 www.maximintegrated.com