Product Information

MAX3522BCTN+

MAX3522BCTN+ electronic component of Analog Devices

Datasheet
RF Amplifier DOCSIS 3.1 Upstream Amplifier

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 11.6658 ea
Line Total: USD 11.67

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 23 May to Mon. 27 May

MOQ : 1
Multiples : 1

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MAX3522BCTN+
Analog Devices

1 : USD 11.0704
10 : USD 9.8012
25 : USD 9.3581
100 : USD 8.0428
260 : USD 7.6813
520 : USD 7.0617
1040 : USD 6.9455
2600 : USD 6.7131

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Type
Operating Frequency
Gain
Operating Supply Voltage
NF - Noise Figure
Minimum Operating Temperature
Maximum Operating Temperature
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EVALUATION KIT AVAILABLE MAX3522B DOCSIS 3.1 Programmable-Gain Amplifier General Description Benefits and Features The MAX3522B is a programmable gain amplifier (PGA) Delivers +68dBmV Output Power While Meeting designed to exceed the DOCSIS 3.1 Upstream Transmit DOCSIS 3.1 Requirements requirements. By providing dual outputs, the MAX3522B Covers 5MHz204MHz Output Bandwidth eliminates the need for an external RF switch when Dual Outputs Eliminates Need for an External RF selecting between two different upstream bandwidths. Switch The PGA meets the DOCSIS 3.1 spurious limits while transmitting a combined output power of 68dBmV over Programmable Power Codes Allow Operation at Reduced Power Dissipation the RF bandwidth of 5MHz to 204MHz from either output. The gain is controlled in 1dB steps over a 54dB range Exceeds Spurious Requirements with Fully Loaded using a SPI 3-wire interface. The use of Maxim s high- OFDM Allocation at +65dBmV at Modem Output voltage CMOS process enables the device to deliver high Two GPIO s Available for SPI-bus Control of External dynamic range, while minimizing power dissipation under RF Switches a +5V supply rail. 56L 8mm x 8mm x 0.75mm TQFN Package with The MAX3522B is available in a 56-pin 8mm x 8mm x Exposed Paddle 0.75mm TQFN package, and operates over temperature range of 0C to +70C. Ordering Information appears at end of data sheet. Applications DOCSIS 3.1 Upstream (D3.1 US) Simplified Block Diagram Cable Modem (CM) Customer Premises Equipment (CPE) 56 55 54 53 52 51 50 49 48 47 46 45 44 43 GND 1 42 GND 2 41 GND GND MAX3522B VDD 3 40 BYPASS 4 39 VDD BYP OUT1+ GND 5 38 OUT1+ 6 37 IN+ OUT1 IN 7 36 OUT1 8 35 GND OUT2+ CSB 9 34 OUT2+ SDA 10 33 OUT2 11 32 CLK OUT2 SERIAL INTERFACE TXEN 12 31 BYPASS 13 30 N.C. GND GND 14 29 GND 15 16 17 18 19 20 21 22 23 24 25 26 27 28 19-100012 Rev 0 6/17 GND GND GND GND VDD DIG GND GND AMUX GND GND GND GND GND GND DPLX1 GND DPLX2 GND GND GND GND GND GND GND GND GND GND GNDMAX3522B DOCSIS 3.1 Programmable-Gain Amplifier Absolute Maximum Ratings VDD, VDD BYP, VDD DIG to GND ....................-0.3V to +5.5V Operating Temperature Range (100% duty-cycle) ...0C to 70C TXEN, SDA, SCLK, CSB .....................................-0.3V to +4.2V Junction Temperature ......................................................+150C IN+, IN- ........................................................-0.3V to V + 0.3V Storage Temperature Range ............................ -65C to +165C DD OUT1+, OUT1-, OUT2+, OUT2- to GND .......-0.3V to V + 3V Lead Temperature (soldering, 10s) .................................+300C DD RF Input Power ..............................................................+10dBm Soldering Temperature (reflow) .......................................+260C Continuous Power Dissipation (T = 70C) (derate 100mW/C A above T = 70C) ...................................................6037.5mW A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION ESD SENSITIVE DEVICE Package Information 56L TQFN Sawn PACKAGE CODE T5688+2 Outline Number 21-0135 Land Pattern Number 90-0046 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) PCB board must be designed for a of 10C/W or lower JA JA Junction to Case ( ) 1C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AD4
ANALOG DEVICES
Analog Devices Hittite
ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
Analog Devices, Inc.
DA4
Dallas
DALLAS / MAXIM
Dallas Semiconductor (VA)
LINEAR
LINEAR TECH
Linear Technology
Linear Technology (part of ADI)
LT
LT4
MAXIM
Maxim Integrated
MAXIM INTEGRATED / ANALOG DEVICES
Maxim Integrated Products
MAXIM-DALLAS
MX4
Technology
Trinamic
TRINAMIC / ANALOG DEVICES
Trinamic Motion Control
Trinamic Motion Control GmbH

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