MAX4731/MAX4732/MAX4733 19-2645 Rev 2 12/06 50, Dual SPST Analog Switches in UCSP General Description Features 1.52mm 1.52mm UCSP Package The MAX4731/MAX4732/MAX4733 low-voltage, dual, single-pole/single-throw (SPST) analog switches oper- Guaranteed On-Resistance (R ) ON ate from a single +2V to +11V supply and handle rail- 25 (max) at +5V 50 (max) at +3V to-rail analog signals. These switches exhibit low leakage current (0.1nA) and consume less than 0.5nW On-Resistance Matching (typ) of quiescent power, making them ideal for battery- 3 (max) at +5V 3.5 (max) at +3V powered applications. Guaranteed < 0.1nA Leakage Current at When powered from a +3V supply, these switches fea- T = +25C A ture 50 (max) on-resistance (R ) with 3.5 (max) ON Single-Supply Operation from +2.0V to +11V matching between channels, and 9 (max) flatness over the specified signal range. TTL/CMOS-Logic Compatible The MAX4731 has two normally open (NO) switches, -108dB Crosstalk (1MHz) the MAX4732 has two normally closed (NC) switches, -72dB Off-Isolation (1MHz) and the MAX4733 has one NO and one NC switch. The Low Power Consumption: 0.5nW (typ) MAX4731/MAX4732/MAX4733 are available in 9-bump Rail-to-Rail Signal Handling chip-scale packages (UCSP), along with 8-pin TDFN and 8-pin MAX packages. The tiny UCSP occupies a Ordering Information 1.52mm 1.52mm area and significantly reduces the required PC board area. TEMP PIN/BUMP- TOP PART Applications RANGE PACKAGE MARK MAX4731EUA -40C to +85C 8 MAX Battery-Powered Systems MAX4731ETA -40C to +85C 8 TDFN-EP** ALG Audio/Video-Signal Routing MAX4731EBL- -40C to +85C 9 UCSP-9 ABV Low-Voltage Data-Acquisition Systems MAX4732EUA -40C to +85C 8 MAX Cell Phones MAX4732ETA -40C to +85C 8 TDFN-EP** ALH Communications Circuits MAX4732EBL- -40C to +85C 9 UCSP-9 ABT MAX4733EUA -40C to +85C 8 MAX PDAs MAX4733ETA -40C to +85C 8 TDFN-EP** ALI MAX4733EBL- -40C to +85C 9 UCSP-9 ABS UCSP is a trademark of Maxim Integrated Products, Inc. *Future productcontact factory for availability. MAX is a registered trademark of Maxim Integrated Products, Inc. **EP = Exposed pad. Pin Configurations/Functional Diagrams/Truth Tables TOP VIEW TOP VIEW MAX4731 MAX4732 (BUMPS (BUMPS MAX4731 MAX4732 COM1 COM1 ON BOTTOM) ON BOTTOM) NO1 A1 A2 A3 GND NC1 A1 A2 A3 GND NO1 1 8 V+ NC1 1 8 V+ COM1 2 7 IN1 COM1 2 7 IN1 IN1 B1 B3 IN2 IN1 B1 B3 IN2 IN2 3 6 COM2 IN2 3 6 COM2 V+ C1 C2 C3 NO2 V+ C1 C2 C3 NC2 GND 4 5 NO2 GND 4 5 NC2 COM2 COM2 UCSP UCSP TDFN TDFN MAX4731 MAX4732 IN NO IN NC 0 OFF 0 ON Pin Configurations/Functional 1 ON 1 OFF Diagrams/Truth Tables SWITCHES SHOWN SWITCHES SHOWN continued at end of data sheet. FOR LOGIC0 INPUT FOR LOGIC0 INPUT Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.50, Dual SPST Analog Switches in UCSP ABSOLUTE MAXIMUM RATINGS (All voltages referenced to GND.) Operating Temperature Range ...........................-40C to +85C V+...........................................................................-0.3V to +12V Storage Temperature Range .............................-65C to +150C IN , COM , NO , NC (Note 1)....................-0.3V to (V+ + 0.3V) Maximum Junction Temperature .....................................+150C Continuous Current (any pin) ...........................................10mA Lead Temperature (soldering, 10s) .................................+300C Peak Current (any pin, pulsed at 1ms, 10% duty cycle) ...20mA Bump Temperature (soldering, Note 2) Continuous Power Dissipation (T = +70C) Infrared (15s) ...............................................................+220C A 8-Pin MAX (derate 4.5mW/C above +70C) .............362mW Vapor Phase (60s) .......................................................+215C 8-Pin TDFN (derate 24.4mW/C above +70C) .........1951mW 9-Bump UCSP (derate 4.7mW/C above +70C).........379mW Note 1: Signals on IN , NO , NC , or COM exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum current rating. Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre- heating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICSSingle +3V Supply (V+ = +3V 10%, V = +2.0V, V = +0.8V, T = T to T , unless otherwise noted. Typical values are at V+ = +3V, T = +25C.) IH IL A MIN MAX A (Notes 3, 4) PARAMETER SYMBOL CONDITIONS T MIN TYP MAX UNITS A ANALOG SWITCH V , COM Analog Signal Range 0V+V V , V NO NC +25C 19 50 V+ = +2.7V, On-Resistance R I = 5mA ON COM T to MIN 60 V or V = +1.5V NO NC T MAX +25C 0.8 3.5 V+ = +2.7V, On-Resistance Matching R I = 5mA ON COM T to MIN Between Channels (Notes 5, 6) 4.5 V or V = +1.5V NO NC T MAX +25C 2.3 9 V+ = +2.7V, On-Resistance Flatness R I = 5mA FLAT(ON) COM T to MIN (Note 7) 11 V or V = +1V, +1.5V, +2V NO NC T MAX +25C -0.1 +0.1 V+ = +3.6V, NO or NC Off-Leakage Current I NO (OFF) V = +0.3V, +3V nA COM T to MIN (Note 8) I NC (OFF) -2 +2 V or V = +3V, +0.3V NO NC T MAX +25C -0.1 +0.1 V+ = +3.6V, COM Off-Leakage Current I nA V = +0.3V, +3V COM (OFF) COM T to MIN (Note 8) -2 +2 V or V = +3V, +0.3V NO NC T MAX +25C -0.2 +0.2 V+ = +3.6V, COM On-Leakage Current V = +0.3V, +3.0V COM I nA COM (ON) T to MIN (Note 8) V or V = +0.3V, +3V, or NO NC -4 +4 T MAX floating 2 MAX4731/MAX4732/MAX4733