AS3032316-035nX0IBCY

1Mbit 32Mbit x16: MRAM Memory Parallel Persistent SRAM Memory (AS3001316, AS3004316, AS3008316, AS3016316, AS3032316) Features Packages Interface Parallel Asynchronous x16 44-pin TSOP (10mm x 18mm) Technology 54-pin TSOP (10mm x 22mm) 40nm pMTJ STT-MRAM 48-ball FBGA (10mm x 10mm) Virtually unlimited Endurance and Data Memory Array Organization Retention (see Endurance and Data 1Mbit Retention on page 24) 65,536 x 16 Density 4Mbit 1Mb, 4Mb, 8Mb, 16Mb, 32Mb 262,144 x 16 Operating Voltage Range 8Mbit VCC: 2.70V 3.60V 524,288 x 16 Operating Temperature Range 16Mbit Industrial: -40C to 85C 1,048,576 x 16 Industrial Plus: -40C to 105C 32Mbit RoHS Compliant 2,097,152 x 16 Performance Device Operation Typical Values Units Read Cycle Time 35.0 (minimum) ns Write Cycle Time 35.0 (minimum) ns Standby Current 1.7 (typical)* mA Sleep Mode Current 5.0 (typical)* uA Read Current 20.0 (typical) mA Write Current 20.0 (typical) mA *Number shown is for 16Mb device R e v i s i o n : P A v a l a n c h e T e c h n o l o g y P a g e 1 26 Preliminary 1Mbit 32Mbit x16: MRAM Memory Table of Contents Features ....................................................................................................................................................... 1 Performance ............................................................................................................................................... 1 Table of Contents...................................................................................................................................... 2 General Description ................................................................................................................................. 3 Ordering Options ...................................................................................................................................... 4 Valid Combinations Standard ...................................................................................................... 5 Signal Description and Assignment .................................................................................................... 8 Package Options ....................................................................................................................................... 9 44-Pin TSOP (Top View) ...................................................................................................................... 9 54-Pin TSOP (Top View) ...................................................................................................................... 9 48-Ball FBGA (Balls Down, Top View) ........................................................................................... 10 Package Drawings .................................................................................................................................. 11 44-Pin TSOP ......................................................................................................................................... 11 54-Pin TSOP ......................................................................................................................................... 12 48-Ball FBGA ........................................................................................................................................ 13 Architecture .............................................................................................................................................. 14 Device Initialization ................................................................................................................................ 15 Electrical Specifications ....................................................................................................................... 18 Write Operation ....................................................................................................................................... 20 Bus Turnaround Operation Read to Write .................................................................................... 22 Read Operation........................................................................................................................................ 23 Endurance and Data Retention ........................................................................................................... 24 Thermal Resistance................................................................................................................................ 25 Product Use Limitations ....................................................................................................................... 26 Limited Warranty ................................................................................................................................. 26 R e v i s i o n : P A v a l a n c h e T e c h n o l o g y P a g e 2 26 Preliminary