Features Applications RoHS compliant* HDMI 1.4 ESD protection >25 kV Digital Visual Interface (DVI) Low capacitance <0.05 pF USB 3.0 / USB OTG Low leakage current <5 nA Memory protection SIM card ports ChipGuard MLU Series - ESD Protectors General Information Device Symbol The ChipGuard MLU Series has been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLU family has been designed to protect equipment to IEC61000-4-2, Level 4 (8 kV Contact / 15 kV Air Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. V The ChipGuard MLU Series has been manufactured to provide low 0.05 pF capacitance and leakage currents less than 5 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical Characteristics 25 C (unless otherwise noted) CG0402MLU / CG0603MLU (Note 3) Parameter Symbol 3.3x 05x 12x 24x Unit Typical Continuous Operating Voltage V 3.3 5 12 24 V DC Typical Clamping Voltage (Note 1) V 25 V C Maximum Capacitance 1 VRMS 1 MHz C 0.05 pF O Maximum Leakage Current Max. VDC I 5 nA L Typical Trigger Voltage (Note 2) V 250 V T Maximum ResponseTime R 1 ns T ESD Protection: Per IEC 61000-4-2 Min. Contact Discharge (>1000 Reps) 8 kV Min. Air Discharge (>1000 Reps) 15 kV Operating Temperature T -40 to +125 C OPR Storage Temperature T -55 to +150 C STG Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. Part number suffix x can be E for 0603 size or G for 0402 size to indicate tape & reel quantity. *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specications are subject to change without notice. Users should verify actual device performance in their specic WARNING Cancer and Reproductive Harm applications. The products described herein and this document are subject to specic legal disclaimers as set forth on the www.P65Warnings.ca.gov last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. *RoHS COMPLIANT ChipGuard MLU Series - ESD Protectors Product Dimensions Recommended Pad Layout A A MM W DIMENSIONS: (INCHES) B C B L D CG0402 CG0603 CG0402 CG0603 Dimension Series Series Dim. Series Series 1.00 0.15 1.60 0.20 0.51 0.76 L A (0.04 0.006) (0.064 0.008) (0.020) (0.030) 0.50 0.10 0.80 0.20 0.61 1.02 W B (0.02 0.004) (0.032 0.008) (0.024) (0.040) 0.36 0.05 0.45 0.10 0.51 0.50 A C (0.014 0.002) (0.018 0.004) (0.020) (0.020) 0.25 0.15 0.30 0.20 1.70 2.54 B D (0.10 0.006) (0.012 0.008) (0.067) (0.100) Solder Refl ow Recommendations Preheat Stages 1-3 Soldering Cooling 300 A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 250 Temperature B Stage 2 Preheat 140 C to 160 C 60 s to 120 s 200 C Stage 3 Preheat Preheat to 200 C 20 s to 40 s 150 D Main Heating 200 C 60 s to 70 s 210 C 55 s to 65 s 100 220 C 50 s to 60 s 230 C 40 s to 50 s 50 240 C 30 s to 40 s 0 E Cooling 200 C to 100 C 1 C/s to 4 C/s 110 sec. (min.) 120 sec. (min.) 30-70 sec. Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specications are subject to change without notice. Users should verify actual device performance in their specic applications. The products described herein and this document are subject to specic legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C)