MF-SM013/250V-2 Bourns

MF-SM013/250V-2 electronic component of Bourns
MF-SM013/250V-2 Bourns
MF-SM013/250V-2 Resettable Fuses - PPTC
MF-SM013/250V-2  Circuit Protection
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of MF-SM013/250V-2 Resettable Fuses - PPTC across the USA, India, Europe, Australia, and various other global locations. MF-SM013/250V-2 Resettable Fuses - PPTC are a product manufactured by Bourns. We provide cost-effective solutions for Resettable Fuses - PPTC, ensuring timely deliveries around the world.

Part No. MF-SM013/250V-2
Manufacturer: Bourns
Category: Resettable Fuses - PPTC
Description: Resettable Fuses - PPTC 0.13A 60V 6.5ohm Vertical
Datasheet: MF-SM013/250V-2 Datasheet (PDF)
Price (USD)
1: USD 0.923 ea
Line Total: USD 0.92 
Availability : 911
  
Ship by Fri. 29 Aug to Wed. 03 Sep
QtyUnit Price
1$ 0.923
10$ 0.7268
30$ 0.6412
100$ 0.3619
500$ 0.3154
1000$ 0.2966

Availability 3880
Ship by Fri. 22 Aug to Thu. 28 Aug
MOQ : 2000
Multiples : 2000
QtyUnit Price
2000$ 0.7125
4000$ 0.6625
8000$ 0.625
16000$ 0.61


Availability 1490
Ship by Fri. 22 Aug to Thu. 28 Aug
MOQ : 628
Multiples : 1
QtyUnit Price
628$ 0.4142
651$ 0.3995
657$ 0.3958
1000$ 0.3922


Availability 34920
Ship by Fri. 22 Aug to Thu. 28 Aug
MOQ : 2000
Multiples : 2000
QtyUnit Price
2000$ 0.3734


Availability 2131
Ship by Wed. 20 Aug to Fri. 22 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.45
10$ 1.296
50$ 0.9779
100$ 0.902
200$ 0.748
500$ 0.6941
1000$ 0.6424
2000$ 0.5643
4000$ 0.5335


Availability 34920
Ship by Fri. 22 Aug to Thu. 28 Aug
MOQ : 2000
Multiples : 2000
QtyUnit Price
2000$ 0.3734


Availability 970
Ship by Fri. 22 Aug to Thu. 28 Aug
MOQ : 1000
Multiples : 1000
QtyUnit Price
1000$ 0.6677


Availability 3880
Ship by Fri. 22 Aug to Thu. 28 Aug
MOQ : 2000
Multiples : 2000
QtyUnit Price
2000$ 0.9975
4000$ 0.9275
8000$ 0.875
16000$ 0.854


Availability 911
Ship by Fri. 29 Aug to Wed. 03 Sep
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 0.923
10$ 0.7268
30$ 0.6412
100$ 0.3619
500$ 0.3154
1000$ 0.2966


Availability 1490
Ship by Fri. 22 Aug to Thu. 28 Aug
MOQ : 645
Multiples : 1
QtyUnit Price
645$ 0.4031
651$ 0.3995
657$ 0.3958
1000$ 0.3922

   
Manufacturer
Product Category
Hold Current
Trip Current
Current Rating - Max
Maximum Voltage
Resistance
Mounting Style
Termination Style
Package / Case
Series
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the MF-SM013/250V-2 from our Resettable Fuses - PPTC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MF-SM013/250V-2 and other electronic components in the Resettable Fuses - PPTC category and beyond.

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Features Applications n Surface Mount Device Provides overcurrent protection in: n Reduced footprint size n Customer Premise Equipment (CPE) n High voltage surge capabilities n Central Office (CO) n Assists in meeting ITU K.20/K.21/K.45 n Access/Outside Plant Equipment specifications n RoHS compliant* n Agency recognition: MF-SM013/250V - Telecom PTC Resettable Fuses Electrical Characteristics Max. One Hour Tripped Hold Initial Max. Interrupt Post-Trip Power Current Resistance Operating Ratings Resistance Dissipation Model Voltage Volts Amps Amps Ohms Ohms Ohms Watts (V) (A) at 23 C at 23 C at 23 C at 23 C at 23 C Volts Max. Max. I Min. Max. Max. Typ. H MF-SM013/250V 60 250 3.0 0.13 4.0 7.0 16.0 3.0 MF-SM013/250V-B5 60 250 3.0 0.13 9.0 12.0 20.0 3.0 Environmental Characteristics Operating Temperature ......................................... -40 C to +85 C Storage Condition ................................................. +40 C max. 70 % R.H. max. Passive Aging ....................................................... +85 C, 1000 hours ............................................... 15 % typical resistance change Humidity Aging...................................................... +85 C, 85 % R.H. 1000 hours ............................. 15 % typical resistance change Thermal Shock ..................................................... MIL-STD-202F, Method 107G, .............................. 15 % typical resistance change -55 C to +125 C,10 times Solvent Resistance ............................................... MIL-STD-202, Method 215B ................................. Marking still legible Vibration ............................................................... MIL-STD-883C, Method 2007.1, Condition A ....... 5 % typical resistance change Moisture Sensitivity Level (MSL) .......................... See Note ESD Classification - HBM ..................................... Class 6 Test Procedures And Requirements Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................ Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air 23 C ................................................. Rmin R Rmax Time to Trip ........................................................... At specified current, Vmax, 23 C ......................... T max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning Solderability .......................................................... 245 C 5 C, 5 seconds ...................................... >95 % coverage UL File Number .................................................... E174545 TV File Number .................................................. R50362083 Thermal Derating Chart - I /I (Amps) hold trip Ambient Operating Temperature Model -40 C -20 C 0 C 23 C 40 C 50 C 60 C 70 C 85 C MF-SM013/250V 0.22 0.19 0.16 0.13 0.105 0.090 0.075 0.060 0.040 MF-SM013/250V-B5 0.22 0.19 0.16 0.13 0.105 0.090 0.075 0.060 0.040 I is approximately two times I . trip hold WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products describedherein andthis document aresubject tospecific legal disclaimers as set forthon the last page of this document, andwww.bourns.com/docs/legal/disclaimer.pdf at .6.6 MAX. (.260) 7.4 (.291) MAX. 1.94 3.2 (.076) MF-SM013/250V - Telecom PTC Resettable Fuses (.126) MAX. Product Dimensions Recommended Pad Layout 6.6 2.29 3.43 2.29 MAX. (.260) (.090) (.090) (.135) 7.4 (.291) Terminal material: MAX. Tin-plated brass 2.41 2.41 (.095) (.095) 6.35 (.250) 1.94 3.2 (.076) (.126) Packaging Quantity MAX. MM DIMENSIONS: (INCHES) 1,000 pieces per reel 2.29 3.43 2.29 (.135) (.090) (.090) Solder Reflow Recommendations t Notes: p T P MF-SM013/250V models cannot be wave soldered or CRITICAL ZONE RAMP-UP hand soldered. Please contact Bourns for soldering TTO T L P 2.41 2.41 recommendations. (.095) (.095) T L All temperatures refer to topside of the package, measured 6.35 t on the package body surface. L (.250) If reflow temperatures exceed the recommended profile, T MAX. S devices may not meet the published specifications. RAMP-DOWN Compatible with Pb and Pb-free solder reflow profiles. Excess solder may cause a short circuit, especially during T MIN. S t hand soldering. Please refer to the Multifuse Polymer PTC s Soldering Recommendation guidelines. PREHEAT 25 t 25 C TO PEAK Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts to T ) 3 C / second max. max p PREHEAT: Temperature Min. (Ts ) 150 C min Temperature Max. (Ts ) 200 C max Time (Ts to Ts ) (ts) 60~180 seconds min max TIME MAINTAINED ABOVE: Inspect solder joint to determine if solder joint is Process Time Temperature (T ) 217 C L Materials Temperature acceptable (i.e. exhibits wetting of joints surface). Description Interval Time (t ) 60~150 seconds L Use the following criteria (ref. acceptability of printed 1. Apply solder paste to Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Peak Temperature (T ) 260 C board assemblies, IPC-A-610): p test board (8 - 10 mil thick) Alloy water soluble or no A) Acceptable (see Figure 1) Time within 5 C of Actual Peak Temperature (t ) 20~40 seconds clean solder pastep (see note 1) (1) The solder connection wetting angle (solder to Ramp-Down Rate 6 C / second max. single sided epoxy glass component and solder to PCB termination) Time 25 C to Peak Temperature 8 minutes max. (G10) (UL approved) does not exceed 90 . PC board approx. 4x4x.06 in. (2) Solder balls that do not violate minimum 2. Place test units onto board 6 units/board electrical clearances and are attached Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. (soldered) to a metal surface. 3. Ramp up Convection oven (see note 2) 2.5 C 0.5 /sec. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. B) Unacceptable (see Figure 2) 4. Preheat (T ) 150 C to 190 C 90 30 sec. S (1) Solder connection wetting angle exceeding 5. Time above liquidus (T ) 220 C 60-90 sec. L 90 . 6. Peak temperature (T ) 250 C +0 /-5 P (2) Incomplete reflow of solder paste. 10-20 sec. within 5 C of peak (3) Dewetting. 7. Ramp down Room temperature 3 C 0.5 C/sec. If unacceptable, determine cause and correct prior to (see note 2) next run. 8. Cleaning water clean profile High pressure deionized 72 F to 160 F As required NOTES: water 65 PSI max. (22 C to 71 C) 1. Water soluble solder paste only above 100K. 2. Refer to ref. temperature profile. Temperature at lead/pad junction with K type thermocouple. Temperature of Lead/Pad Junction 3. Units that are board mounted for environmental testing must see a peak temperature in the reflow (Derived using 6-zone Convection Oven) zone, as specified. This is to ensure that all test units will see worst case conditions. 4. Ramp down rate to be measured from 245 C to 150 C. 5. Process Description 8 does not apply to open frame trimmers. Temperature

Tariff Desc

8541.50.00 - Other semiconductor devices
42 No Other discrete (not IC) semiconductor devices
(PTC resettable fuses used to protect against overcurrent. Also known as a multifuse or polyfuse or polyswitch)

8536.10 FUSES AND FUSE HOLDERS, subminiature, plug in or pigtail type known as picofuses or microfuses, dimensions NOT exceeding 6mm x 18mm TC 8530773
Bourns Inc.
BOURNS JW MILLER
BR4
J.W. Miller
JW Miller
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