SRU6013-4R2Y Bourns

100 100 Features Applications n Maximum height of 1.60 mm n Input/output of DC/DC converters n Current up to 3.2 A n Power supplies for: Portable communication equipment n RoHS compliant* Camcorders LCD TVs SRU6013 Series - Shielded SMD Power Inductors Electrical Specifications General Specifications Test Voltage ....................................0.1 V Inductance Test I rms SRF RDC I sat Reflow Soldering .. 230 C, 50 sec. max. 100 KHz Q Bourns Max. Freq. Typ. Max. Typ. Part Number L Tol. Ref. **K- Operating Temp........-40 C to +125 C (MHz) (MHz) (m W) (A) (A) (H) (%) Factor (Temperature rise included) Storage Temp...........-40 C to +125 C SRU6013-1R0Y 1.0 30 12 7.96 100 36 3.20 2.90 453 Resistance to Soldering Heat SRU6013-1R5Y 1.5 30 10 7.96 90 40 3.00 2.40 370 ...............................260 C for 10 sec. SRU6013-2R2Y 2.2 30 10 7.96 80 50 2.50 2.10 313 Moisture Sensitivity Level .....................1 SRU6013-3R3Y 3.3 30 10 7.96 70 60 2.35 1.75 272 ESD Classification (HBM) .................N/A SRU6013-4R2Y 4.2 30 10 7.96 55 75 2.10 1.50 214 SRU6013-6R4Y 6.4 30 10 7.96 45 110 1.70 1.30 177 Materials SRU6013-100Y 10 30 14 2.52 35 165 1.40 1.00 151 SRU6013-150Y 15 30 12 2.52 26 235 1.10 0.80 116 Core ....................Ferrite DR and RI core SRU6013-220Y 22 30 12 2.52 22 325 0.95 0.72 99 Wire ............................Enameled copper SRU6013-330Y 33 30 10 2.52 18 500 0.78 0.58 77 Terminal ....................................Ag/Ni/Sn SRU6013-470Y 47 30 10 2.52 14 675 0.66 0.50 65 Rated Current ..Ind. drop 35 % typ. at Isat SRU6013-680Y 68 30 10 2.52 10 900 0.60 0.40 57 Temp. Rise.......40 C max. at rated Irms **K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(H) x I (peak-to-peak ripple current, A), Packaging .................. 1000 pcs. per reel determine core loss from Core Loss vs. Flux Density plot. Product Dimensions SRU6013 Core Loss vs. Flux Density 1000 6.20 0.30 100 (.244 .012) 6.20 0.30 6.50 0.30 (.244 .012) 1.40 0.20 (.256 .012) 10 (.055 .008) 1 MHz 6.50 0.30 1.40 0.20 500 KHz (.256 .012) (.055 .008) 300 KHz 200 KHz 1 2.15 4.90 TYP. 100 KHz (.193) (.085) 50 KHz TYP. 2.15 4.90 TYP. (.193) (.085) 0.1 TYP. 0.01 2.20 (.087) 100 1000 10000 TYP. 2.20 2.15 Flux Density Bp-p (gauss) TYP. (.087) (.085) TYP. 2.15 TYP. Electrical Schematic Recommended Layout (.085) MM DIMENSIONS: REF. (INCHES) 1.10 (.043) REF. 4.90 1.10 1.10 REF. (.193) 1.10 (.043) (.043) (.043) REF. 4.90 1.10 REF. REF. (.193) 1.10 (.043) (.043) REF. * RoHS Directive 2002/95/EC Jan. 27, 2003 including REF. 4.90 annex and RoHS Recast 2011/65/EU June 8, 2011. (.193) Specifications are subject to change without notice. REF. 4.90 The device characteristics and parameters in this data (.193) sheet can and do vary in different applications and 2.40 REF. (.094) actual device performance may vary over time. REF. Users should verify actual device performance in their 2.40 1.10 specific applications. (.094) 2.40 (.043) REF. REF. (.094) REF. 1.10 2.40 (.043) REF. (.094) REF. 100 *RoHS COMPLIANT VERSIONS AVAILABLE *RoHS COMPLIANT LEAD FREE LEAD FREE VERSIONS ARE RoHS COMPLIANT* Core Loss (mW) SRF0504SRU6013 SeriesSeries - -Shielded Line Filter SMD Power Inductors Packaging Specifications 178.0 2.0 0.5 178.0 2.0 0.5 DIA. 16.5 18.4 DIA. (7.008) (7.008) (.079 .020) (.079 .020) (.650) (.724) COVER 13.0 0.5 13.0 0.5 TAPE 21.0 0.8 21.0 0.8 (.512 .020) (.512 .020) (.827 .031) (.827 .031) DIA. DIA. EMBOSSED CAVITY 50.0 50.0 (1.969) (1.969) 13.0 0.5 13.0 0.5 DIA. DIA. (.512 .020) EMBOSSED (.512 .020) CARRIER 12.0 14.0 14 (.472) (.551) (.551) 44 (.157) (.157) END START END START 100 100 100 10 100 100 100 10 8 8 (.315)(.315) NO COMPONENT NO COMPONENT NO COMPONENT NO COMPONENT 200200 400400 COMPONENTCOMPONENTSS (7.874) (15.748) (7.874) (15.748) USER DIRECTION OF FEED USER DIRECTION OF FEED MM DIMENSIONS: (INCHES) QTY: 1,000 PCS. PER REEL REV. 03/18 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.