HSSR-7110, HSSR-7111, HSSR-7112, 1 HSSR-711E, 5962-9314001, 5962-9314002 90V/1.0, Hermetically Sealed, Power MOSFET Optocoupler Data Sheet Description Features The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and SMD Dual marked with device part number and DLA Standard 5962-9314001, 5962-9314002 are single-channel power Microcircuit Drawing (SMD) MOSFET optocouplers, constructed in eight-pin, hermetic, ac/dc signal and power switching dual-in-line, ceramic packages. The devices operate exactly like Compact solid-state bidirectional switch a solid-state relay. Manufactured and tested on a MIL-PRF-38534 certified line The products are capable of operation and storage over the full QML-38534, Class H and Class E military temperature range and can be purchased as a Hermetically sealed 8-pin, dual-in-line package commercial product (HSSR-7110), with full MIL-PRF-38534 Small size and weight Class H testing (HSSR-7111 and HSSR- 7112), with Performance guaranteed over 55C to +125C MIL-PRF-38534 Class E testing (Class K with exceptions) Connection A 0.8A, 1.0 (HSSR-711E) or from the DLA Standard Microcircuit Drawing (SMD) 5962-93140. Details of the Class E program exceptions Connection B 1.6A, 0.25 are listed here: 1500 Vdc withstand test voltage High transient immunity 1. Nondestructive Bond Pull, Test method 2023 of MIL-STD-883 in device screening is not required. 5 Amp output surge current 2. Particle Impact Noise Detection (PIND), Test method 2020 of MIL-STD-883 in device screening and group C testing is Applications not required. Military and space 3. Die Shear Strength, Test method 2019 of MIL-STD-883 in High reliability systems group B testing is not required. Standard 28 Vdc and 48 Vdc load driver 4. Internal Water Vapor Content, Test method 1018 of Standard 24 Vac load driver MIL-STD-883 in group C testing is not required. Aircraft controls 5. Scanning Electron Microscope (SEM) inspections, Test method 2018 of MIL-STD-883 in element evaluation is not ac/dc electromechanical and solid-state relay replacement required. I/O modules Harsh industrial environments CAUTION It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or 1. See Selection Guide Lead Configuration Options for available extensions. degradation that may be induced by ESD. Broadcom - 1 -HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002 Functional Diagrams Data Sheet The devices feature logic level input control and very low Functional Diagrams output on-resistance, making them suitable for both ac and dc loads. Connection A, as shown in the Functional Diagrams, CONNECTION A CONNECTION B AC/DC CONNECTION DC CONNECTION allows the device to switch either ac or dc loads. Connection B, I I O O with the polarity and pin configuration as shown, allows the 1 8 1 8 NC NC + + V I I F F O device to switch dc loads only. The advantage of Connection B - 2 7 2 7 + + is that the on-resistance is significantly reduced, and the V V V F F O output current capability increases by a factor of two. 3 6 3 6 - - - The devices are convenient replacements for mechanical and 4 NC 5 4 NC 5 solid-state relays where high component reliability with TRUTH TABLE standard footprint lead configuration is desirable. Devices may INPUT OUTPUT be purchased with a variety of lead bend and plating options. H CLOSED See Selection Guide Lead Configuration Options table for L OPEN details. Standard microcircuit drawing (SMD) parts are available for each package and lead style. All devices are manufactured and tested on a MIL-PRF-38534 The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, and SMD certified line, and Class H and Class E devices are included in 5962-9314001, 5962-9314002 are designed to switch loads on the DLA Qualified Manufacturers List, QML-38534 for Hybrid 28 Vdc power systems. They meet 80V surge and 600V spike Microcircuits. Each device contains an AlGaAs light-emitting requirements. diode optically coupled to a photovoltaic diode stack, which drives two discrete power MOSFETs. The device operates as a CAUTION Maximum Switching Frequency Care should be solid-state replacement for single-pole, normally open (1 Form taken during repetitive switching of loads so as A) relay used for general-purpose switching of signals and not to exceed the maximum output current, loads in high reliability applications. maximum output power dissipation, maximum case temperature, and maximum junction temperature. Selection Guide Lead Configuration Options Avago Technologies Part Number and Options Commercial HSSR-7110 MIL-PRF-38534 Class H HSSR-7111 HSSR-7112 MIL-PRF-38534 Class E HSSR-711E a Gold Plate Gold Plate Gold Plate Standard Lead Finish b Option 200 Option -200 Option -200 Solder Dipped a Option 100 Option -100 Butt Joint/Gold Plate b Option 300 Option -300 ASSR-711E-300 Gull Wing/Soldered a Option 600 Option -600 Crew Cut/Gold Plate SMD Part Number Prescript for all below 5962- 5962- 5962- a 9314001HPC 9314002HPC 9314001EPC Gold Plate b 9314001HPA 9314002HPA 9314001EPA Solder Dipped a 9314001HYC 9314002HYC Butt Joint/Gold Plate b 9314001HYA 9314002HYA Butt Joint/Soldered b 9314001HXA 9314002HXA Gull Wing/Soldered a 9314001HZC 9314002HZC Crew Cut/Gold Plate b 9314001HZA 9314002HZA Crew Cut/Soldered a. Gold Plate lead finish: Maximum gold thickness of leads is <100 in. Typical is 60 in to 90 in. b. Solder lead finish: Sn63/Pb37. Broadcom - 2 -