AFBR-5930Z Broadcom

AFBR-5930Z 200 MBd SBCON Transceivers in 2 x 5 Package Style Data Sheet Description Features The AFBR-5930Z trans ceiver from Avago Technologies Fully RoHS compliant provides the system designer with a product to implement Multisourced 2 x 5 package style with MT-RJ recep- the SBCON specification and to be compatible with IBM tacle ESCON architecture. Single +3.3 V power supply This transceiver is supplied in the industry standard 2 x 5 Wave solder and aqueous wash process compatibility DIP style with a MT-RJ fiber connector interface. Manufactured in an ISO 9002 certified facility Transmitter Sections Compliant to SBCON 200 MBd specification The transmitter section of the AFBR-5930Z utilizes a 1300 Applications nm InGaAsP LED. This LED is packaged in the optical sub- assembly portion of the transmitter section. It is driven by Interconnection with IBM compatible processors, di- a custom silicon IC which converts differential PECL logic rectors and channel attachment units signals, ECL referenced (shifted) to a +3.3 V supply, into an Disk and tape dr ives analog LED drive current. Communication controllers Data communication equipment Receiver Sections Local area networks The receiver section of the AFBR-5930Z utilizes an InGaAs Point-to-point communication PIN photodiode coupled to a custom silicon transimped- ance preamplifier IC. I t is packaged in the optical subassem- bly portion of the receiver. This PIN/preampliefi r combina t ion is coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Signal Detect function. The Data out- put is differential. The Signal Detect output is single-ended. Both Data and Signal Detect outputs are PECL compati ble, ECL referenced (shifted) to a +3.3 V power supply. The re- ceiver outputs, Data Out and Data Out Bar, are squelched at Signal Detect Deassert. Patent - www.avagotech.com/patents Package The overall package concept for the Avago Technologies The receiver section includes an internal shield for the elec- transceiver consists of three basic elements the two op- trical and optical subassemblies to ensure high immunity tical subassemblies, an electrical subassembly, and the to external EMI fields. housing as illustrated in the block diagram in Figure 1. The outer housing including the MT-RJ ports is molded The package outline drawing and pin out are shown in of filled nonconductive plastic to provide mechanical Figures 2 and 3. The details of this package outline and pin strength. The solder posts of the Avago Technologies out are compliant with the multi source definition of the 2 x design are isolated from the internal circuit of the trans- 5 DIP. The low profile of the Avago Technologies transceiver ceiver. design complies with the maximum height allowed for the The transceiver is attached to a printed circuit board with MT-RJ connector over the entire length of the package. the ten signal pins and the two solder posts which exit The optical subassemblies utilize a high-volume assembly the bottom of the housing. The two solder posts provide process together with low-cost lens elements which result the primary mechanical strength to withstand the loads in a cost-effective building block. imposed on the transceiver by mating with the MT-RJ con- nectored fiber cables. The electrical subassembly con sists of a high volume multi- layer printed circuit board on which the IC and various surface-mounted passive circuit elements are attached. R SUPPLY X DATA OUT QUANTIZER IC PIN PHOTODIODE DATA OUT PRE-AMPLIFIER SUBASSEMBLY SIGNAL R GROUND X MT-RJ DETECT RECEPTACLE T GROUND X LED DATA IN OPTICAL LED DRIVER IC SUBASSEMBLY DATA IN T SUPPLY X Figure 1. Block Diagram. 2