Product Information

AFBR-59SMI2Z

AFBR-59SMI2Z electronic component of Broadcom

Datasheet
Fiber Optic Transmitters, Receivers, Transceivers 250MBd Transceiver POF, SMI
Manufacturer: Broadcom
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

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Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

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AFBR-59SMI2Z
Broadcom

1 : USD 36.4672
5 : USD 35.3939
10 : USD 33.077
25 : USD 31.4016
50 : USD 30.2235
100 : USD 29.2025
250 : USD 28.7706
500 : USD 28.7706
1000 : USD 26.5715
N/A

Obsolete

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RoHS - XON
Icon ROHS
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Additional Infomation About Product

AFBR-59SMI2Z 250-MBd Compact 650-nm Transceiver for Data Communication over Polymer Optical Fiber (POF) Cables with SMI Connector Data Sheet power. In absence of receiver optical input signal, the receiver Description is in low power sleep mode and the differential output signal is The Avago Technologies AFBR-59SMI2Z transceiver provides pulled to ground. The receiver wakes up, when a valid optical system designers with the ability to support serial input signal is detected. communication with baud rates of up to 250 MBd over 2.2-mm jacketed standard polymer optical fiber (POF) with 1-mm core Features diameter and NA 0.5. Fast Ethernet communications over POF The SMI optical interconnect with its push-pull positive latching, with safe-release mechanism, provides secure, safe Data rates up to 250 MBd and easy to mate and de-mate optical connection for High EMI/EMC robustness miscellaneous industrial and medical applications. SMI connector system The AFBR-59SMI2Z is Laser Class 1, lead-free and compliant Link lengths up to 50m POF with RoHS. 3.3V operation LVDS input and output data connections Analog monitoring output (RSSI) Transmitter Operating temperature range from 40C to +85C. The transmitter consists of a 650-nm LED, which is controlled RoHS compliant by a fully integrated driver IC. The LED driver operates at 3.3V. It receives Low Voltage Differential Signaling (LVDS) electrical input, and converts it into a modulated current driving the LED. Applications LED and driver IC are packaged in an optical subassembly. Industrial and medical applications The optimized lens system of the optical subassembly couples Fast Ethernet the emitted optical power very efficiently into 1-mm core POF cable. Package Receiver The transceiver package contains the two optical subassemblies, which are mounted in the black housing for The receiver utilizes a fully integrated single chip solution, SMI optical connection. which provides excellent immunity to EMI and fast transient dV/dt rejection. The receiver directly converts light to a digital The inserts are packages inside a conductive plastic inner LVDS output signal and operates at 3.3-V nominal supply. The housing, which provides additional immunity against EMI/ integrated receiver is packaged in an optical subassembly, EMC. which couples optical power efficiently from POF to the receiving PIN. The receiver features an analog monitor output of the incoming optical signal. The monitor output provides an analog voltage proportional to the average optical input Broadcom - 1 -AFBR-59SMI2Z Pin Description and Recommended PCB Footprint Data Sheet Pin Description and Recommended PCB Footprint The AFBR-59SMI2Z has ten active signal pins (including supply voltage and ground pins) and two EMI shield solder posts. The EMI shield solder posts are isolated from transceiver internal circuit and should be connected to equipment chassis ground or signal ground. Figure 1 shows the top view of the PCB footprint and pinout diagram. Pin Description Table 1 Pin Description Pin No. Name Symbol Pin No. Name Symbol 1 EMI Shield GND 7 Rx DC Supply Voltage RVCC 2 Tx Data Input (Negative) TD 8 Rx Ground RGND 3 Tx Data Input (Positive) TD+ 9 Rx Signal Strength Indicator RSSI 4 Tx Ground TGND 10 Rx Data Output (Negative) RD 5 Tx DC Supply Voltage TVCC 11 Rx Data Output (Positive) RD+ 6 Tx Ground (optional) TGND 12 EMI Shield GND PCB Footprint Figure 1 PCB Footprint and Pinout Diagram (Top View) Notes: Dimensions: mm Recommended PCB thickness: 1.57 mm 0.08 mm Broadcom - 2 -

HS Compliance

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:

Broadcom may also be referenced as

 AVAGO TECHNOLOGIES
AV4
AV9
Avago
AVAGO TECHNOLOGIES
Avago Technologies US Inc.
AVAGO(Broadcom)
Broadcom Avago
BROADCOM (AVAGO)
Broadcom / Avago
BROADCOM CORPORATION
Broadcom Limited
PLX Technology Avago
PLX Technology / Avago

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