HSML-C170-T0000 Broadcom

HSML-C170-T0000 High Performance Surface Mount ChipLED Data Sheet Description Features The HSML-C170-T0000 ChipLED is a surface-mount LED that LED with AlInGaP die comes in an industrial standard 2.0 mm 1.25 mm package Surface-mount device with 0805 footprint footprint, which allows for ease of use and handling. It offers Top-emitting package industry-leading performance by using efficient and high Compatible with reflow soldering brightness AlInGaP material. Tape in 8-mm carrier tape on a 7-in. diameter reel This LED has a wide viewing angle. Coupled with high performance, these features make this device an ideal Applications candidate for applications that require uniform light distribution and high brightness. Pushbutton backlighting This device is ideal for use in applications, such as industrial Icon backlighting equipment, consumer electronics, gaming, home appliances, Status indicator and black and white goods markets. Device Selection Guide Part Number Emitting Color HSML-C170-T0000 Orange CAUTION: LEDs are Class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broadcom - 1 -HSML-C170-T0000 Data Sheet Package Dimensions NOTE 1. All dimensions are in millimeters (in.). 2. Tolerance 0.1 mm (0.004 in.) unless otherwise specified. Broadcom - 2 -