Type CD Low Resistance Precision Chip Resistors Page 1 of 2 Low Resistance Chip down to 0.010 at 1% with unique Pedestal Terminal Design for Current Sense in Hybrid and SMT Applications Type CD Low Resistance Precision Chip Resistors utilize the proven Caddock Micronox resistance films to achieve the unique low resistance range in this family. The special performance features of the Type CD Low Resistance Precision Film Resistor include: Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pedestals to receive aluminum wire bonds. Resistance as low as 0.010 ohm at 1%. Pedestal terminals in this design provide an ultra low resistance connection pad which maintains the precision 0.010 1% at the point of customer Kelvin connection to the resistor chip. The pedestal terminal with its copper core also provides heat spreading which enhances the high power handling capability. Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina. High pulse handling and overload capability. Low inductance provides excellent high frequency and pulse response. Style FC - Flip Chip Version is a surface mount version with solderable pedestal terminals for flip chip soldering. Power Capability Information Resistance Dimensions in inches and (millimeters) General Applications High Power Applications Comments Max. Chip Power Rating Thermal Resistance - R JC Model Temperature at 70 C Film (J) to Solder Pad (C) Min. Max. A B C D (see note 1) (see note 2) .200 .012 .150 .012 .063 .006 .062 min. CD2015FC 1.0 Watt 0.010 0.20 12.0C/Watt 150 C Solderable Pedestal (5.08 .30 (3.81 .30) (1.60 .15) (1.57 min.) .250 .012 .200 .012 .063 .006 .078 min. CD2520FC 9.0C/Watt 150 C 0.010 0.20 1.5 Watts Solderable Pedestal (6.35 .30) (1.60 .15 (1.98 min.) (5.08 .30) Style FC Derating Curve For General Applications 100 Note 1: General Applications - The power rating for CD2015FC Standard Resistance Values: 80 general applications is based upon 0.5 sq. in. (300 Tolerance CD2015FC 1% Standard. 2 mm ) of termination pad or trace area (2 oz. copper) 0.010 0.030 0.075 60 0.015 0.033 0.10 connected to each end of the resistor. Maximum chip 0.020 0.040 0.20 40 temperature is 150C. Use Derating Curve to derate 0.025 0.050 appropriately for the maximum ambient temperature 20 CD2520FC Standard Resistance Values: and for the temperature limitations of the adjacent 0 Tolerance CD2520FC 1% Standard. materials. 25 70 100 150 0.010 0.030 0.075 o AMBIENT TEMPERATURE, C 0.015 0.033 0.10 0.020 0.040 0.20 Note 2: Thermal Resistance - In High Power Applications where the circuit board material 0.025 0.050 provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of Custom resistance values and non-standard tolerances the chip resistor is useful to establish the maximum power capability of the chip resistor in the can be manufactured for high quantity applications. application. The film temperature is measured at the center of the resistor element and solder Please contact Caddock Applications Engineering. pad temperature at the center of the solderable pedestal (point X in the recommended circuit layout shown below). Maximum temperature of the chip resistor (at the center of chip) should not exceed 150C through the temperature range of the application. Recommended Circuit Board Layout Note: Actual width of current trace is based on C C (current and sense connections): magnitude of current. Point of connection should be in the area shown. Fig. 1A: Recommended Kelvin layout. X X C = Current connection S = Sense connection S S Sales and Applications Engineering 17271 North Umpqua Hwy. ELECTRONICS, INC. Roseburg, Oregon 97470-9422 e-mail: caddock caddock.com web: www.caddock.com Phone: (541) 496-0700 For Caddock Distributors listed by country see caddock.com/contact/dist.html Fax: (541) 496-0408 2003-2017 Caddock Electronics, Inc. 28 IL117.0717 RATED LOAD, %Type CD Low Resistance Precision Chip Resistors Page 2 of 2 Style WB - W is ire Bond Version a hybrid mountable version with copper pedestal terminals and an aluminum surface layer for wire bonding. The back surface of these devices is metallized for solder attachment of the chip resistor to a heat sinking substrate. Power Capability Information Resistance Dimensions in inches and (millimeters) Thermal Resistance Comments R Max. Chip JC Model Temperature Film (J) to Solder Pad (C) Min. Max. A B C D (see note 3) .200 .012 .150 .012 .061 .005 .062 min. Terminals have an Aluminum surface layer for CD2015WBA 8.33C/Watt 150C 0.010 0.20 (5.08 .30) (3.81 .30) (1.55 .13) (1.57 min.) wire bonding. Aluminum wire to be used for bonding. Terminals have an Aluminum surface layer for .250 .012 .200 .012 .061 .005 .078 min. CD2520WBA 0.010 0.20 5.00C/Watt 150C (6.35 .30) (5.08 .30) (1.55 .13) (1.98 min.) wire bonding. Aluminum wire to be used for bonding. Note 3: Thermal Resistance - In High Power Applications where the circuit board material CD2015WBA provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of Standard Resistance Values: the chip resistor is useful to establish the maximum power capability of the chip resistor in the Tolerance CD2015WBA 1% Standard. application. The film temperature is measured at the center of the resistor element and the 0.010 0.030 0.075 solder pad temperature is measured at the soldered interface with the circuit board. Maximum 0.015 0.033 0.10 0.020 0.040 0.20 temperature of the chip resistor (at the center of chip) should not exceed 150C through the 0.025 0.050 temperature range of the application. CD2520WBA Location for Sense (Potential) Connection: Standard Resistance Values: Note: The sense connection for each Tolerance CD2520WBA 1% Standard. Film Temperature pedestal is positioned inboard of the current Measuring Point 0.010 0.030 0.075 0.015 0.033 0.10 connection (single or multiple current wires). Sense Wire Sense Wire 0.020 0.040 0.20 Current Wire Current Wire 0.025 0.050 Solder pad, soldered interface with circuit board. Custom resistance values and non-standard tolerances Circuit board: IMS, Ceramic (Alumina) , or other. can be manufactured for high quantity applications. WB Resistor mounting Please contact Caddock Applications Engineering. General Information for Type CD - Style FC and Style WB - Chip Resistors Specifications: Packaging information: Temperature Coefficient: TC referenced to Solder attachment notes: Style FC, flip chip resistors, are shipped with the bare +25C, R taken at +150C. During soldering of the Type CD Resistor ceramic side up in the pocket, with the solderable pedestals the soldering temperature profile must not 0.050 ohm to 0.20 ohm, 0 to +100 ppm/C. facing down. Style WB, wire bondable resistors, are shipped with the cause the pedestal terminals of this device 0.010 ohm to 0.049 ohm, 0 to +200 ppm/C. wire bondable pedestals facing up in the pocket. to exceed 220C. The illustration shows the orientation of the CD2015 chip Inductance: Less than 5 nH typical. Style FC - Flip Chip version resistors resistors in the tape. The CD2520 chip resistors are rotated 90 Load Life: 1000 hours at rated power, based from what is shown in the illustration. have a bare ceramic back surface. The upon 150C max. chip temperature, 7 dia. recommended solder for flip chip solder (178 mm) R (0.5% + 0.0005 ohm). attachment is 62Sn / 36Pb / 2Ag. 12mm 0.473 Bo Momentary Overload: 1.5 times rated Style WB - Wire Bond version resistors power, for 5 seconds, R (0.5% + 0.0005 have a metallized back surface for Ao ohm). soldering to a substrate or a heat sink. The recommended solder is Ko signifies tape thickness and dimension Operating Temperature: -55C to +150C. 62Sn / 36Pb / 2Ag512 arbor hole Measurement Note: All measurements (13mm) are taken using Kelvin connections per the Size 2015 Size 2520 recommended connection locations. Ao 0.189 (4.80mm) 0.271 (6.88mm) Bo 0.209 (5.31mm) 0.216 (5.49mm) A Ordering Physical Size Ko 0.087 (2.21mm) 0.066 (1.68mm) D 2015 = 0.200 x 0.150 Information: Carrier Tape and pocket dimensions: 2520 = 0.250 x 0.200 Tape is 12mm Carrier Tape (8mm pitch) B Full reel quantities: CD 2520 FC - 0.10 - 1% 1000 pieces per reel for CD2015 and CD2520 Tolerance: Quantities of less than 250 will be shipped in tape without reel Type CD 1% 0.010 and above. C and without tape leader at the option of Caddock. Style: FC or WBA Tape dimensions and materials will be consistent with EIA-481-1. Dimensions in inches and (millimeters) Reels will be marked with a label containing Caddock logo, part Resistor Value () number, resistor value, tolerance, packaging date, and quantity. See charts for availability Sales and Applications Engineering 17271 North Umpqua Hwy. ELECTRONICS, INC. Roseburg, Oregon 97470-9422 e-mail: caddock caddock.com web: www.caddock.com Phone: (541) 496-0700 For Caddock Distributors listed by country see caddock.com/contact/dist.html Fax: (541) 496-0408 2003-2017 Caddock Electronics, Inc. 28 IL117.0717