Product Information

SMD291SNL

SMD291SNL electronic component of Chip Quik

Datasheet
Solder Solder Paste 15g

Manufacturer: Chip Quik
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 17.1706 ea
Line Total: USD 17.1706

92 - Global Stock
Ships to you between
Wed. 10 Apr to Fri. 12 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
83 - Global Stock


Ships to you between Wed. 10 Apr to Fri. 12 Apr

MOQ : 1
Multiples : 1

Stock Image

SMD291SNL
Chip Quik

1 : USD 17.1706
12 : USD 16.0356

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Type
Alloy
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SMD291SNL SMD291SNL Datasheet revision 1.2 www.chipquik.com Solder Paste No-Clean SAC305 in 5cc Syringe 15g T3 Mesh Product Highlights Printing speeds up to 100mm/sec Excellent wetting compatibility on most board finishes Long stencil life Dispense grade Wide process window Compatible with enclosed print heads Clear residue Passes BONO test 1.56% Low voiding RoHS II and REACH compliant Specifications Alloy: Sn96.5/Ag3.0/Cu0.5 Mesh Size: T3 Micron (m) Range: 25-45 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Load: 87% Metal by Weight Melting Point: 217-220C (423-428F) Packaging: 5cc/15g Syringe Shelf Life: Refrigerated >6 months, Unrefrigerated >2 months *See notes below: *Shelf Life Notes: Chip Quik solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product thoroughly for 2-3 minutes before inspection and use. Chip Quik solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal powder. Chip Quik solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you have any issues with our solder paste, please contact Chip Quik directly for no charge warranty replacement. Please retain original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes. Printer Operation Print Speed: 25-100mm/sec Squeegee Pressure: 70-250g/cm of blade Under Stencil Wipe: Once every 10-25 prints, or as necessary Stencil Life >8 hours 20-50% RH 22-28C (72-82F) >4 hours 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this products stated shelf life. 1 1994-2017 Chip Quik Inc. Recommended Profile Reflow profile for Sn96.5/Ag3.0/Cu0.5 solder assembly, designed as a starting point for process optimization. 249C (480F) 217C (423F) 175C (347F) Temperature 150C (302F) 25C (77F) 0sec 90sec 180sec 210sec 240sec 270sec Time Test Results Test J-STD-004 or other Test Requirement Result requirements as stated Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5% Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean) Surface Insulation Resistance 85C, IPC-TM-650: 2.6.3.7 L: 100M (No-clean) 85% RH 168 Hours Tack Value IPC-TM-650: 2.4.44 64g Viscosity Malcom 10 RPM/25C IPC-TM-650: 2.4.34.4 Print: 155-215, Dispense: 125-170 3 (x10 mPa/s) Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Compliant Coalition (EICC) REACH Compliance Articles 33 and 67 of Regulation (EC) Contains no substance >0.1% w/w that No 1907/2006 is listed as a SVHC or restricted for use in solder materials Conforms to the following Industry Standards: J-STD-004B, Amendment 1 (Solder Fluxes): Yes J-STD-005A (Solder Pastes): Yes J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes RoHS 2 Directive 2011/65/EU: Yes 2 1994-2017 Chip Quik Inc.

Tariff Desc

8311.30.00 -Coated rods and cored wire, of base metal, for soldering, brazing or welding by flame
Chip Quik Inc
Chip Quik Inc.

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