Product Information

SMDSW.020 4OZ

SMDSW.020 4OZ electronic component of Chip Quik

Datasheet
Leaded No-Clean, Water Soluble Wire Solder Sn63Pb37 (63/37) 24 AWG, 25 SWG Spool, 4 oz (113.40g)

Manufacturer: Chip Quik
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 20.4356 ea
Line Total: USD 20.4356

19 - Global Stock
Ships to you between
Thu. 05 Oct to Mon. 09 Oct
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
9 - Global Stock


Ships to you between Fri. 29 Sep to Thu. 05 Oct

MOQ : 1
Multiples : 1

Stock Image

SMDSW.020 4OZ
Chip Quik

1 : USD 22.5165

19 - Global Stock


Ships to you between Thu. 05 Oct to Mon. 09 Oct

MOQ : 1
Multiples : 1

Stock Image

SMDSW.020 4OZ
Chip Quik

1 : USD 20.4356

     
Manufacturer
Chip Quik
Product Category
Solder
RoHS - XON
1 Icon ROHS
Product
Solder
Type
Wire, Rosin Core
Alloy
Sn63/Pb37
Description/Function
Small Size Solder Wire Spool
Diameter
0.02 in
Package Type
SPOOL
Contains Lead
Yes
Packaging
-
Brand
Chip Quik
Factory Pack Quantity :
1
Hts Code
8311303000
Product Type
Solder
Subcategory
Solder & Equipment
Taric
8311300000
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SMDSW.020 1OZ SMDSW.020 1OZ Datasheet revision 1.7 www.chipquik.com Solder Wire Sn63/Pb37 No-Clean with 2.2% Flux Core 1oz Spool Product Highlights No-Clean Water-Washable Synthetic Flux Core The clear, non-corrosive, non-conductive residue is meant to be left on the board. Residues that do remain are water soluble if you want to remove them. Clean with hot water at 60C (140F) minimum. 2.2% flux core Halogen content: None Specifications Alloy: Sn63/Pb37 Wire Diameter: 0.020 (0.5mm) Flux Type: No-Clean Water-Washable Synthetic Flux Classification: ROL0 Melting Point: 183C (361F) Packaging: 1 oz spool Test Results Test J-STD-004 or other Test Requirement Result requirements as stated Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5% Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean) Surface Insulation Resistance 85C, IPC-TM-650: 2.6.3.7 L: 100M (No-clean) 85% RH 168 Hours Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Compliant Coalition (EICC) REACH Compliance Articles 33 and 67 of Regulation (EC) Contains Lead (Pb) CAS 7439-92-1 No 1907/2006 No other SVHC present Conforms to the following Industry Standards: J-STD-004B, Amendment 1 (Solder Fluxes): Yes J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes RoHS 2 Directive 2011/65/EU: No 1 1994-2018 Chip Quik Inc. ChipQuik Solder Wire Orderable Part Numbers: Flux Core Alloy Melting Point Diameter Size Orderable Part Number .015 (0.38mm) 100g (3.5oz) SMDSW.015 100g 0.4 oz SMDSW.020 .4OZ 1 oz SMDSW.020 1OZ 2 oz SMDSW.020 2OZ .020 (0.5mm) 4 oz SMDSW.020 4OZ 1/2 lb SMDSW.020 8OZ Sn63/Pb37 183C (361F) 1 lb SMDSW.020 1LB 0.7 oz SMDSW.031 .7OZ 1 oz SMDSW.031 1OZ 2 oz SMDSW.031 2OZ .031 (0.8mm) 4 oz SMDSW.031 4OZ 1/2 lb SMDSW.031 8OZ 1 lb SMDSW.031 1LB .015 (0.38mm) 100g (3.5oz) SMD2SW.015 100g 0.4 oz SMD2SW.020 .4OZ 1 oz SMD2SW.020 1OZ 2 oz SMD2SW.020 2OZ No-Clean Water- .020 (0.5mm) 4 oz SMD2SW.020 4OZ Washable Synthetic 1/2 lb SMD2SW.020 8OZ Flux Core 2.2% Sn60/Pb40 183-188C (361-370F) 1 lb SMD2SW.020 1LB (Except .006 and 0.7 oz SMD2SW.031 .7OZ .008 diameter wire 1 oz SMD2SW.031 1OZ which are 1.2%) 2 oz SMD2SW.031 2OZ .031 (0.8mm) 4 oz SMD2SW.031 4OZ 1/2 lb SMD2SW.031 8OZ 1 lb SMD2SW.031 1LB .015 (0.38mm) 100g (3.5oz) SMD3SW.015 100g 0.4 oz SMD3SW.020 .4OZ 1 oz SMD3SW.020 1OZ 2 oz SMD3SW.020 2OZ .020 (0.5mm) 4 oz SMD3SW.020 4OZ 1/2 lb SMD3SW.020 8OZ Sn62/Pb36/Ag2 179C (354F) 1 lb SMD3SW.020 1LB 0.7 oz SMD3SW.031 .7OZ 1 oz SMD3SW.031 1OZ 2 oz SMD3SW.031 2OZ .031 (0.8mm) 4 oz SMD3SW.031 4OZ 1/2 lb SMD3SW.031 8OZ 1 lb SMD3SW.031 1LB Continued on next page 2 1994-2018 Chip Quik Inc.

Tariff Desc

8311.30.00 -Coated rods and cored wire, of base metal, for soldering, brazing or welding by flame
Chip Quik Inc
Chip Quik Inc.