WM7121P, WM7121PE w Top Port Analogue Silicon Microphone DESCRIPTION FEATURES The WM7121P is a low-profile silicon analogue microphone. High SNR (65dB) It offers high Signal to Noise Ratio (SNR) and low power Low variation in sensitivity consumption and is suited to a wide variety of consumer - 3dB tolerance (WM7121P) applications. - 1dB tolerance (WM7121PE) The WM7121P incorporates Wolfsons proprietary Matched pair with Bottom Port microphone WM7132P CMOS/MEMS membrane technology, offering high reliability - Matched sensitivity, roll-off, and phase response and high performance in a miniature, low-profile package. Low current consumption (190A) The WM7121P is designed to withstand the high temperatures associated with automated flow solder Analogue output assembly processes. (Note that conventional microphones Top Port LGA Package can be damaged by this process.) 1.5V to 3.7V supply The WM7121P Top Port microphone offers matched performance to the WM7132P Bottom Port microphone. The APPLICATIONS matched characteristics enable highly accurate sound pick- up in opposite directions, suitable for noise cancellation and Mobile phone handsets other DSP algorithms. Portable media players The WM7121PE variant offers a tighter tolerance on the Digital still cameras microphone sensitivity, giving reduced variation between Digital video cameras parts. This removes the need for in-line production calibration of part-to-part microphone variations. Bluetooth headsets Portable navigation devices Portable games consoles BLOCK DIAGRAM 3D VIEW 3.76mm x 2.95mm x 1.10mm LGA package WOLFSON MICROELECTRONICS plc Pre-Production, June 2014, Rev 3.0 Copyright 2014 Wolfson Microelectronics plc WM7121P, WM7121PE Pre-Production TABLE OF CONTENTS DESCRIPTION ................................................................................................................ 1 FEATURES ..................................................................................................................... 1 APPLICATIONS ............................................................................................................. 1 BLOCK DIAGRAM ......................................................................................................... 1 3D VIEW ......................................................................................................................... 1 TABLE OF CONTENTS .................................................................................................. 2 PIN CONFIGURATION ................................................................................................... 3 PIN DESCRIPTION ......................................................................................................... 3 ORDERING INFORMATION ........................................................................................... 3 ABSOLUTE MAXIMUM RATINGS ................................................................................. 4 IMPORTANT ASSEMBLY GUIDELINES ....................................................................... 4 RECOMMENDED OPERATING CONDITIONS .............................................................. 4 ACOUSTIC AND ELECTRICAL CHARACTERISTICS .................................................. 5 TERMINOLOGY ........................................................................................................................... 5 TYPICAL PERFORMANCE ............................................................................................ 6 APPLICATIONS INFORMATION ................................................................................... 7 RECOMMENDED EXTERNAL COMPONENTS ......................................................................... 7 OPTIMISED SYSTEM RF DESIGN ............................................................................................. 7 CONNECTION TO A WOLFSON CODEC .................................................................................. 8 MATCHED MICROPHONE PAIRS ............................................................................................. 8 PCB LAND PATTERN AND PASTE STENCIL ........................................................................... 9 PACKAGE DIMENSIONS ............................................................................................. 10 IMPORTANT NOTICE .................................................................................................. 11 ADDRESS: ................................................................................................................................. 11 REVISION HISTORY .................................................................................................... 12 w PP, June 2014, Rev 3.0 2