conga-TCA3/CSP-B-HF Congatec

conga-TCA3/CSP-B-HF electronic component of CongatecImages are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of conga-TCA3/CSP-B-HF Heat Sinks across the USA, India, Europe, Australia, and various other global locations. conga-TCA3/CSP-B-HF Heat Sinks are a product manufactured by Congatec. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No.conga-TCA3/CSP-B-HF
Manufacturer:Congatec
Category:Heat Sinks
Description:Heat Sinks Standard passive cooling solution for COM Express module conga-TCA3 with 10mm fins. All standoffs are 2.7mm bore hole.
Datasheet:conga-TCA3/CSP-B-HF Datasheet (PDF)
Shipping Charges:Click here for details
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Price (USD)
  
1: USD 60.6375 ea
Line Total: USD 60.64 
Availability : 0
  
QtyUnit Price
1$ 60.6375
5$ 60.6375
10$ 57.3164
25$ 55.973
  

Availability0
Ship by Tue. 23 Jun to Thu. 25 Jun
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 60.6375
5$ 60.6375
10$ 57.3164
25$ 55.973

   
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We are delighted to provide the conga-TCA3/CSP-B-HF from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the conga-TCA3/CSP-B-HF and other electronic components in the Heat Sinks category and beyond.

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LOW POWER CONSUMPTION conga-TCA3 rd - 3 Gen. Intel Atom processor up to Quad Core - COM Express Compact Type 6 module - Temperature range up to -40C .. +85C Formfactor Formfactor COM Express Compact (95 x 95 mm) Type 6 Connector Layout CPU Intel Atom E3845 1.91 GHz Quad Core L2 Cache 2MB 10W TDP Intel Atom E3827 1.75 GHz Dual Core L2 Cache 1MB 8W TDP Intel Atom E3826 1.46 GHz Dual Core L2 Cache 1MB 7W TDP Intel Atom E3825 1.33 GHz Dual Core L2 Cache 1MB 6W TDP Intel Atom E3815 1.46 GHz Single Core L2 Cache 512kB 5W TDP Intel Celeron J1900 2.0 GHz Quad Core L2 Cache 2MB 10W TDP Intel Celeron N2930 1.83 GHz Quad Core L2 Cache 2MB 7.5W TDP Intel Celeron N2807 1.58 GHz Dual Core L2 Cache 1MB 4.3W TDP DRAM 2 SO-DIMM sockets for DDR3L memory modules up to 8 GByte with 1333MT/s Dual channel memory interface for increased graphics performance. Chipset Integrated in SoC Ethernet Intel I210 Gigabit Ethernet I/O Interfaces Up to 5x PCIe x1 8x USB 2.0 1x USB 3.0 2x SATA LPC SPI IC bus (fast mode 400 kHz multi-master) SDIO Sound Digital High Definition Audio Interface Graphics Intel HD Grahpics Gen 7 Full hardware acceleration for MPEG2 H.264 DirectX11 OCL 1.1 OGL 3.2 WMV9 and VC1 LVDS Dual channel LVDS transmitter support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200 60Hz. Digital Display Interface (DDI) Up to 2x DDI (max. 2560x1600) CRT Interface 320 MHz RAMDAC resolutions up to 2560x1600 congatec Board Controller Multi Stage Watchdog non-volatile User Data Storage Manufacturing and Board Information Board Statistics BIOS Setup Data Backup IC bus (fast mode, 400 kHz, multi-master) Power Loss Control Embedded BIOS Features OEM Logo OEM CMOS Defaults LCD Control Display Auto Detection Backlight Control Flash Update based on AMI Aptio UEFI Security Trusted Platform Module (TPM) optional. Hash and RSA algorithms key lengths up to 2048 bits real random number generator Power Management ACPI 5.0 with battery support Operating Systems Microsoft Windows 10 Microsoft Windows 10 IoT Enterprise Microsoft Windows 10 IoT Core Microsoft Windows 8 Microsoft Windows 7 Microsoft Windows Embedded Standard Microsoft Windows 7 Embedded Compact Android Yocto MoonIsland / WindRiver IDP Power Consumption Typ. application: see users guide for full details CMOS Battery Backup Temperature Commercial: Operating: 0 to +60C Storage: -20 to +80C Industrial: Operating: -40 to +85C Storage: -45 to +85C Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. Size 95 x 95 mm (3.74 x 3.74) www.congatec.comoption conga-TCA3 Block Diagram COM Express 2.1 COM Express 2.1 3rd Generation Intel Atom processor AB Connector CD Connector CPU Platform Type 6 Type 6 Intel 64 AES-NI DDI0 LVDS eDP to EIST XD LCD I/ F (LVDS) DDIO LVDS DDI1 1:2 DP DDI1 PCIe0 x1 Integrated Intel HD Graphics PCIe Port 0 switch PCIe1 x1 Hardware Graphics Accelerators DDI2 PCIe Port 1 PCIe2 x1 2D 3D PCIe Port 2 PCIe Switch PCIe3 x1 PCIe Port 3 Gfx with Burst Technology PLX PCIe Port 4 Video Codecs PCIe Port 5 Dual Channel MPEG-2 OpenCL 1.2 DDR3L 1333 MT/s Ethernet PCIe GBE H.264 OpenGL 3.0 CRT CRT MVC DirectX 11 4x USB 2.0 VC-1 OpenGLES 2.0 USB Port 0..3 SuperSpeed 0 USB Port 4 USB 3.0 Port 0 USB HSIC VP8 USB HSIC USB Port 5 4 port MJPEG USB 3.0 Port 1 USB Port 6 Hub USB Port 7 USB 3.0 Port 2 HDA HDA I/F Display Interface USB 3.0 Port 3 SATA0 DisplayPort++ eDP VGA SATA Port 0 SATA1 SATA Port 1 MIPI-CSI Audio Interface SDIO SATA Port 2 HDA SATA Port 3 PEG x16 SM Bus I/O Interfaces SM Bus SPI PCIe SPI LPC SD Card SPI PCIe Port 6 UART eMMC 4.5 UART SATA USB 2.0 USB 3.0 eMMC PCIe Port 7 LPC LPC LPC Bus TPM I2C 3rd Gen congatec I2C Bus System Management GPI / GPO GPIOs MUX Controller LID / SLEEP LID / SLEEP (Watchdog, EEProm...) FAN control FAN www.congatec.com eMMC Feature Flash connector SO-DIMM (optional) DDR 3L

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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