CLD-DS20 Rev 12A Product family data sheet cree Xlamp XP-G leds Product descriPtion features table of contents The XLamp XP-G LeD delivers Available in white, outdoor white Characteristics .......................... 2 unprecedented levels of light output and 80-CRI, 85-CRI and 90-CRI Flux Characteristics .................... 3 and efficacy for a single die LED. white Relative Spectral Power The XLamp XP-G LeD continues ANSI-compatible chromaticity Distribution............................... 4 Crees history of innovation in bins Relative Flux vs. Junction LeDs for lighting applications with Maximum drive current: Temperature ............................. 4 wide viewing angle, symmetrical 1500 mA electrical Characteristics ............. 5 package, unlimited floor life and Low thermal resistance: 4 C/W Relative Flux vs. Current ............ 5 electrically neutral thermal path. Wide viewing angle: 125 Relative Chromaticity vs Current Unlimited floor life at and Temperature ....................... 6 XLamp XP-G LeDs are the ideal 30 C/85% RH Typical Spatial Distribution .......... 7 choice for lighting applications Reflow solderable - JEDEC Thermal Design ......................... 7 where high light output and J-STD-020C Reflow Soldering Characteristics .. 8 maximum efficacy are required, Electrically neutral thermal path Notes ....................................... 9 such as LeD light bulbs, outdoor RoHS- and REACh-compliant Mechanical Dimensions..............10 lighting, portable lighting, indoor UL-recognized component Tape and Reel ..........................11 lighting and solar-powered lighting. (e349212) Packaging ................................12 Copyright 2009-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without Cree, Inc. notice. Cree , the Cree logo and XLamp are registered trademarks of Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 WWW.CREE.CoM/XLAMpXLamp Xp-g Leds characteristics characteristics unit minimum typical maximum Thermal resistance, junction to solder point C/W 4 Viewing angle (FWHM) degrees 125 Temperature coefficient of voltage mV/C -2.1 ESD withstand voltage (HBM per Mil-Std-883D) v 8000 DC forward current mA 1500 Reverse voltage v 5 Forward voltage ( 350 mA, 25 C) v 2.9 3.25 Forward voltage ( 700 mA, 25 C) v 3.05 Forward voltage ( 1000 mA, 25 C) v 3.15 Forward voltage ( 1500 mA, 25 C) v 3.25 LeD junction temperature C 150 Copyright 2009-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree , the Cree logo and XLamp are registered trademarks of Cree, Inc. 2