CLD-DS51 Rev 12H Product family data sheet Cree XLamp XP-G2 LEDs Pro DuCt DEsCriPtion FEAturEs tAbLE o F ContEnts The XLamp XP-G2 LeD builds on the Available in white, outdoor white and Characteristics ............................................2 unprecedented performance of the 80-, 85- and 90-CRI white Flux Characteristics ....................................3 original XP-G by increasing lumen output ANSI-compatible chromaticity bins Relative Spectral Power Distribution ...... 10 up to 20% while providing a single die LeD Binned at 85C Relative Flux vs. Junction Temperature .. 10 point source for precise optical control. Maximum drive current: 1500mA electrical Characteristics ......................... 11 The XP-G2 LeD shares the same footprint Low thermal resistance: 4C/W Relative Flux vs. Current .......................... 11 as the original XP-G, providing a seamless Wide viewing angle: 115 Relative Chromaticity vs Current and upgrade path and shortening the design Unlimited floor life at Temperature ............................................. 12 cycle. 30C/85% RH Typical Spatial Distribution ...................... 13 Reflow solderable - JEDEC J-STD-020C Thermal Design ........................................ 13 XLamp XP-G2 LeDs are the ideal choice electrically neutral thermal path Performance Groups Luminous Flux... 14 for lighting applications where high RoHS and ReACh compliant Performance Groups Chromaticity ...... 15 light output and maximum efficacy are UL recognized component (E349212) Crees Standard Chromaticity Regions required, such as LeD light bulbs, outdoor Plotted on the 1931 CIE Curve ................ 18 lighting, portable lighting, indoor lighting Crees Standard Cool White Kits Plotted and solar-powered lighting. on ANSI Standard Chromaticity Regions ..................................................... 20 Crees Standard Warm and Neutral White Kits Plotted on ANSI Standard Chromaticity Regions .............................. 21 Crees Standard Chromaticity Kits .......... 23 Bin and Order Code Formats ................... 24 Reflow Soldering Characteristics ............ 25 Notes ........................................................ 26 Mechanical Dimensions .......................... 28 Tape and Reel ........................................... 29 Packaging ................................................. 30 Copyright 2012-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and XLamp are Cree, Inc. registered trademarks and the Cree logo is a trademark of Cree, Inc. UL and the UR logo are registered trademarks of UL LLC. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www. CRee.Com/XLAmp XLamp Xp-G2 LED Ch ArAC tEristiCs Characteristics unit Minimum t ypical Maximum Thermal resistance, junction to solder point C/W 4 Viewing angle (FWHM) degrees 115 Temperature coefficient of voltage mV/C -1.8 ESD withstand voltage (HBM per Mil-Std-883D) v 8000 DC forward current mA 1500 Reverse voltage v 5 Forward voltage ( 350mA, 85 C) v 2.8 3.15 Forward voltage ( 700mA, 85 C) v 2.9 Forward voltage ( 1000mA, 85 C) v 3.0 Forward voltage ( 1500mA, 85 C) v 3.1 LeD junction temperature C 150 Copyright 2012-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and XLamp are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL and the UR logo are registered trademarks of UL LLC. 2