HSB03-121218 CUI Devices

HSB03-121218 electronic component of CUI Devices
HSB03-121218 CUI Devices
HSB03-121218 Heat Sinks
HSB03-121218  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of HSB03-121218 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB03-121218 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. HSB03-121218
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 12 x 12 x 18 mm
Datasheet: HSB03-121218 Datasheet (PDF)
Price (USD)
1: USD 1.0513 ea
Line Total: USD 1.05 
Availability : 4496
  
Ship by Thu. 31 Jul to Mon. 04 Aug
QtyUnit Price
1$ 1.0513
10$ 0.9223
25$ 0.8719
50$ 0.7888
100$ 0.7611
250$ 0.723
500$ 0.6976
1000$ 0.648
5040$ 0.6422

Availability 2298
Ship by Mon. 04 Aug to Fri. 08 Aug
MOQ : 65
Multiples : 1
QtyUnit Price
65$ 1.2143
250$ 0.8951
500$ 0.8597
1000$ 0.8242
2520$ 0.777
5040$ 0.7429
7560$ 0.7219
10080$ 0.6772


Availability 4496
Ship by Thu. 31 Jul to Mon. 04 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.0513
10$ 0.9223
25$ 0.8719
50$ 0.7888
100$ 0.7611
250$ 0.723
500$ 0.6976
1000$ 0.648
5040$ 0.6422

   
Manufacturer
Product Category
Product
Mounting Style
Heatsink Material
Fin Style
Thermal Resistance
Length
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the HSB03-121218 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB03-121218 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB03-121218 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB03-121218 24.01 28.8 9.6 6.8 3.12 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 28.8 9.6 6.8 2 52.8 18.7 13.1 40 3 73.2 27.6 19.4 4 93.5 36.6 25.7 20 5 111.9 45.3 31.9 6 128.7 54.5 38.5 0 Ths: hot spot temperature measured on the heatsink 0123456 7 Ta: ambient temperature Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB03-121218 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 3.8 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Same Sky (formerly CUI Devices)
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