X-On Electronics has gained recognition as a prominent supplier of HSB03-121218 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB03-121218 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB03-121218 CUI Devices

HSB03-121218 electronic component of CUI Devices
HSB03-121218 CUI Devices
HSB03-121218 Heat Sinks
HSB03-121218  Thermal Management

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See Product Specifications
Part No. HSB03-121218
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 12 x 12 x 18 mm
Datasheet: HSB03-121218 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.0513 ea
Line Total: USD 1.05 
Availability - 4708
Ship by Wed. 14 May to Fri. 16 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2298
Ship by Fri. 16 May to Thu. 22 May
MOQ : 121
Multiples : 1
121 : USD 1.2157
250 : USD 0.882
500 : USD 0.8689
1000 : USD 0.8426
2520 : USD 0.7731
5040 : USD 0.7612
7560 : USD 0.7508
10080 : USD 0.7179

4708
Ship by Wed. 14 May to Fri. 16 May
MOQ : 1
Multiples : 1
1 : USD 1.0513
10 : USD 0.9223
25 : USD 0.8719
50 : USD 0.7888
100 : USD 0.7611
250 : USD 0.7149
500 : USD 0.6976
1000 : USD 0.648

   
Manufacturer
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Heatsink Material
Fin Style
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We are delighted to provide the HSB03-121218 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB03-121218 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB03-121218 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB03-121218 24.01 28.8 9.6 6.8 3.12 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 60 1 28.8 9.6 6.8 2 52.8 18.7 13.1 40 3 73.2 27.6 19.4 4 93.5 36.6 25.7 20 5 111.9 45.3 31.9 6 128.7 54.5 38.5 0 Ths: hot spot temperature measured on the heatsink 0123456 7 Ta: ambient temperature Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB03-121218 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 3.8 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Same Sky (formerly CUI Devices)
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