HSB03-141406 CUI Devices

HSB03-141406 electronic component of CUI Devices
HSB03-141406 CUI Devices
HSB03-141406 Heat Sinks
HSB03-141406  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of HSB03-141406 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB03-141406 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. HSB03-141406
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 14 x 14 x 6 mm
Datasheet: HSB03-141406 Datasheet (PDF)
Price (USD)
1: USD 0.7704 ea
Line Total: USD 0.77 
Availability : 0
  
QtyUnit Price
1$ 0.7704
10$ 0.7377
50$ 0.6774
100$ 0.6318
250$ 0.5879
500$ 0.5752
1000$ 0.5498
3672$ 0.5463

Availability 3139
Ship by Fri. 15 Aug to Thu. 21 Aug
MOQ : 147
Multiples : 1
QtyUnit Price
147$ 0.8977
250$ 0.7179
500$ 0.6904
1000$ 0.6396
3672$ 0.6274
7344$ 0.6148
11016$ 0.6117
18360$ 0.6086

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the HSB03-141406 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB03-141406 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB03-141406 DESCRIPTION: HEAT SINK FEATURES BGA design small footprint aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB03-141406 35.98 39.7 15.8 11.6 2.08 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 100 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 80 0 0 0 0 1 39.7 15.8 11.6 60 2 73.2 30.9 22.7 40 3 103.0 45.9 33.6 4 129.7 61.1 45.0 20 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature 0 012345 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB03-141406 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 1.6 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Same Sky (formerly CUI Devices)
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