X-On Electronics has gained recognition as a prominent supplier of HSB07-202009 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB07-202009 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

HSB07-202009 CUI Devices

HSB07-202009 electronic component of CUI Devices
HSB07-202009 CUI Devices
HSB07-202009 Heat Sinks
HSB07-202009  Thermal Management

Images are for reference only
See Product Specifications
Part No. HSB07-202009
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 20 x 20 x 9 mm
Datasheet: HSB07-202009 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.0395 ea
Line Total: USD 1.04 
Availability - 3400
Ship by Fri. 11 Jul to Tue. 15 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1732
Ship by Tue. 15 Jul to Mon. 21 Jul
MOQ : 68
Multiples : 1
68 : USD 1.16
250 : USD 0.8617
500 : USD 0.83
1872 : USD 0.7699
3744 : USD 0.7383
5616 : USD 0.7198
9360 : USD 0.6965
16848 : USD 0.6406

3400
Ship by Fri. 11 Jul to Tue. 15 Jul
MOQ : 1
Multiples : 1
1 : USD 1.0395
10 : USD 0.9538
25 : USD 0.8341
50 : USD 0.745
100 : USD 0.7184
250 : USD 0.6965
500 : USD 0.6699
1000 : USD 0.6456
5616 : USD 0.6329

   
Manufacturer
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Mounting Style
Heatsink Material
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We are delighted to provide the HSB07-202009 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB07-202009 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB07-202009 DESCRIPTION: HEAT SINK FEATURES BGA design top mount aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB07-202009 24.08 29.2 8.6 6.0 3.11 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 120 Without Airow 100 Heatsink Temperature Rise Above 200 LFM Ambient (T = Ths - Ta) (C) 80 400 LFM Power Natural 200 LFM 400 LFM (W) Conv. 0 0 0 0 60 1 29.2 8.6 6.0 2 53.0 17.0 11.4 40 3 73.9 25.2 16.8 4 93.3 33.7 22.5 20 5 111.8 41.9 27.7 Ths: hot spot temperature measured on the heatsink 0 Ta: ambient temperature 0123456 Heat Dissipated (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB07-202009 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 3.7 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Same Sky (formerly CUI Devices)
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