HSB17-404025 CUI Devices

HSB17-404025 electronic component of CUI Devices
HSB17-404025 CUI Devices
HSB17-404025 Heat Sinks
HSB17-404025  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of HSB17-404025 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSB17-404025 Heat Sinks are a product manufactured by CUI Devices. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. HSB17-404025
Manufacturer: CUI Devices
Category: Heat Sinks
Description: Heat Sinks heat sink, BGA, 40 x 40 x 25 mm
Datasheet: HSB17-404025 Datasheet (PDF)
Price (USD)
1: USD 3.0975 ea
Line Total: USD 3.1 
Availability : 571
  
Ship by Wed. 27 Aug to Fri. 29 Aug
QtyUnit Price
1$ 3.0975
10$ 2.6082
25$ 2.3793
50$ 1.9866
1000$ 1.9866
5120$ 1.9635

Availability 344
Ship by Fri. 29 Aug to Thu. 04 Sep
MOQ : 22
Multiples : 10
QtyUnit Price
22$ 3.2928
100$ 2.625
250$ 2.4937
640$ 2.3625
1280$ 2.2706
2560$ 2.1656
5120$ 2.0738
7680$ 2.0212


Availability 571
Ship by Wed. 27 Aug to Fri. 29 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 3.0975
10$ 2.6082
25$ 2.3793
50$ 1.9866
1000$ 1.9866
5120$ 1.9635

   
Manufacturer
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Heatsink Material
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the HSB17-404025 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSB17-404025 and other electronic components in the Heat Sinks category and beyond.

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Additional Resources: Product Page 3D Model date 06/24/2021 page 1 of 3 MODEL: HSB17-404025 DESCRIPTION: HEAT SINK FEATURES BGA design top mount aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSB17-404025 6.41 9.0 2.1 1.5 11.69 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES Heatsink Temperature Rise Above Ambient (T = Ths - Ta) (C) 120 Power Natural 200 LFM 400 LFM (W) Conv. Without Airow 100 0 0 0 0 200 LFM 1 9.0 2.1 1.5 80 400 LFM 2 17.7 4.2 2.9 3 25.7 6.1 4.3 60 4 32.6 8.1 5.6 5 38.5 9.9 6.8 40 6 43.8 12.0 8.0 7 50.0 14.0 9.3 20 8 55.8 16.0 10.7 9 60.9 18.1 12.1 0 20.1 13.4 10 66.2 05 10 15 20 25 11 71.8 22.1 14.6 12 76.3 23.8 15.9 Heat Dissipated (W) 26.0 17.2 13 81.5 14 85.9 27.7 18.4 15 90.9 29.8 19.7 31.8 20.9 16 96.0 17 100.1 33.7 22.2 18 104.6 35.6 23.4 37.7 24.8 19 109.5 20 113.7 39.8 26.1 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSB17-404025 DESCRIPTION: HEAT SINK date 06/24/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 6063-T5 tolerance: 0.38 mm FINISH black anodized WEIGHT 15.0 g cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Same Sky (formerly CUI Devices)
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