HSS09-B20-P431 CUI Devices

Additional Resources: Product Page 3D Model date 06/25/2021 page 1 of 3 MODEL: HSS09-B20-P431 DESCRIPTION: HEAT SINK FEATURES TO-220 package solder pin aluminum alloy black anodized finish 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS09-B20-P431 18.82 22.9 7.7 5.9 3.98 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 140 Without Airow 120 200 LFM 100 Heatsink Temperature Rise Above 400 LFM Ambient (T = Ths - Ta) (C) Power Natural 80 200 LFM 400 LFM (W) Conv. 0 0 0 0 60 1 22.9 7.7 5.9 40 2 42.3 15.3 11.3 3 59.3 22.8 16.7 20 4 75.8 30.3 22.1 5 90.7 37.6 27.3 0 6 104.3 45.3 32.9 0123456789 7 118.5 52.6 38.2 Heat Dissipated (W) 8 131.4 59.4 43.5 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices MODEL: HSS09-B20-P431 DESCRIPTION: HEAT SINK date 06/25/2021 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL AL 1050 tolerance: 0.38 mm FINISH black anodized THICKNESS 1.2 mm PIN MATERIAL brass PIN PLATING 2~3 m tin WEIGHT 5.0 g cuidevices.com