Product Information

HSS-C2540-SMT-TR

HSS-C2540-SMT-TR electronic component of CUI Devices

Datasheet
Tin Plated 19.38 x 25.4 x 11.43 mm Surface Mount Heat Sink

Manufacturer: CUI Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.7509 ea
Line Total: USD 1.75

4855 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
873 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 900
Multiples : 900

Stock Image

HSS-C2540-SMT-TR
CUI Devices

900 : USD 1.575
1800 : USD 1.5619

3704 - WHS 2


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

HSS-C2540-SMT-TR
CUI Devices

1 : USD 1.7172
10 : USD 1.6844
25 : USD 1.683
100 : USD 1.6803
250 : USD 1.6789
500 : USD 1.6762
1000 : USD 1.6749
3000 : USD 1.6721

4855 - WHS 3


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

Stock Image

HSS-C2540-SMT-TR
CUI Devices

1 : USD 1.7509
10 : USD 1.6905
25 : USD 1.6542
50 : USD 1.5094
250 : USD 1.4973
900 : USD 1.4611
4500 : USD 1.4249

873 - WHS 4


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 900
Multiples : 900

Stock Image

HSS-C2540-SMT-TR
CUI Devices

900 : USD 2.1936

3704 - WHS 5


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 5
Multiples : 1

Stock Image

HSS-C2540-SMT-TR
CUI Devices

5 : USD 1.7337
10 : USD 1.7322
25 : USD 1.7295
100 : USD 1.728
250 : USD 1.7252
500 : USD 1.6907

     
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Additional Resources: Product Page 3D Model PCB Footprint date 03/10/2020 page 1 of 3 MODEL: HSS-C2540-SMT-TR DESCRIPTION: HEAT SINK FEATURES TO-263 package low profile design surface mount tape and reel pack 1 thermal resistance power MODEL 1 dissipation 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (C/W) (C/W) (C/W) (C/W) (W) HSS-C2540-SMT-TR 19.74 21.90 5.50 4.00 3.80 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 100 Heatsink Temperature Rise Above Without Airflow Ambient (T = Ths - Ta) (C) 90 200 LFM Power Natural 80 200 LFM 400 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 21.90 5.50 4.00 50 2 41.68 11.15 7.79 3 62.55 16.69 12.14 40 4 79.22 22.44 16.40 30 5 98.00 28.21 20.66 20 Ths: hot spot temperature measured on the heatsink 10 Ta: ambient temperature 0 012345 Dissipated Power (W) cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model PCB Footprint CUI Devices MODEL: HSS-C2540-SMT-TR DESCRIPTION: HEAT SINK date 03/10/2020 page 2 of 3 MECHANICAL DRAWING units: mm MATERIAL C1100 tolerance: 0.3 mm FINISH tin plated THICKNESS 0.6 mm WEIGHT 8.9 g 20.32 (0.800) 2.54 (0.100) 2.54 (0.100) 10.67 (0.420) 16.76 (0.660) Recommended Copper Pad Layout Top View PACKAGING units: mm Reel QTY: 150 pcs per reel 40.4 2 44 36 cuidevices.com

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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