SmartBond DA14585 Smallest, lowest power and most integrated Bluetooth 5 SoC Connected devices are constantly evolving. New generations appear that are smarter, more full featured and have longer battery lifetimes. To enable this, SmartBond has evolved too. The DA14585 offers designers all the benefits of the industry-leading DA14580 but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets. As part of the Dialog SmartBond family, the DA14585 is the smallest, lowest power and most integrated Bluetooth solution available. This versatile SoC is ideal for adding Bluetooth low energy to products like remote controls, proximity tags, beacons, connected medical devices and smart home nodes. It supports all Bluetooth developments up to and including Bluetooth 5 and Bluetooth low energy Mesh. Plus, with 96 kB of RAM, the DA14585 has double the memory for user applications of its predecessor to take full advantage of the standards features. It also includes an integrated microphone interface for voice support at low additional cost. The wide supply voltage range (0.9 3.6 V) covering a larger choice of energy sources and gives full design flexibility . Like all SmartBond solutions, the DA14585 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and Dialogs SmartSnippets software that helps you optimize your software for power consumption. Applications DA14585 Remote controls Proximity tags and trackers ARM M0 CPU Beacons SWD Connected medical devices RC32KHz UARTx2 OTP 64 kB RC16MHz Smart home SPI RCX 12C Human Interface Devices ADC VR controllers RAM 32 kB KEYBOARD Connected sensors RAM 16 kB WAKEUP Wireless charging RAM 16 kB 4-CH DMA RAM 32 kB QDEC TIMERS DCDC BUCK ROM PCM/12S DCDC BOOST 128 kB PDM LDOs GPIO matrix www.dialog-semiconductor.com/bluetoothlowenergy SRC BLE 5.0 MAC Ready XTAL16M Digital PHY XTAL32K RADIOSoC Features Complies with Bluetooth 5.0, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) Supports up to 8 Bluetooth LE connections Fast cold boot in less than 50 ms Processing units - 16 MHz 32 bit ARM Cortex-M0 with SWD interface - Dedicated Link Layer Processor - AES-128 bit encryption Processor Memories - 64 kB One-Time-Programmable (OTP) memory - 96 kB Data/Retention SRAM - 128 kB ROM Operating System and protocol stack Power management - Integrated Buck/Boost DCDC converter - P0, P1, P2 and P3 ports with 3.3 V tolerance - Easy decoupling of only 4 supply pins - Supports coin (typ. 3.0 V) and alkaline (typ. 1.5 V) battery cells - 1.8 V cold boot support-buck mode - 0.9 V cold boot support-boost mode - 10-bit ADC for battery voltage measurement Digital controlled oscillators - 16 MHz crystal (20 ppm max) and RC oscillator - 32 kHz crystal (50 ppm) - RCX oscillator(500 ppm max) Flexible Reset Circuitry - System & Power On Reset in a single pin General purpose, Capture and Sleep timers - Digital interfaces - Gen. purpose I/Os: 14 (WL-CSP34), 25 (QFN40), 32 (QFN48) - 2 UARTs with hardware flow control up to 1 MBd - SPI+ interface - IC bus at 100 kHz, 400 kHz - 3-axes capable Quadrature Decoder Analog interfaces - 4-channel 10-bit ADC www.dialog-semiconductor.com/bluetoothlowenergy