Fair-Rite Product s Catalog Part Data Sheet, 2506033007Y3 Printed: 2013-07-03 Fair-Rite Products Corp. PO Box J,One Commercial Row, Wallkill, NY 12589-0288 Phone: (888) 324-7748 www.fair-rite.com Part Number: 2506033007Y3 Frequency Range: Medium Current Description: MULTI-LAYER CHIP BEAD Application: Suppression Components Where Used: Board Component Part Type: Chip Beads Mechanical Specifications Weight: .006 (g) Part Type Information Fair-Rite offers a broad selection of cost effective multi-layer chip beads to suppress conducted EMI signals. Chip beads can be used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. Chip beads are 100% tested for impedance and dc resistance. They are available in standard, high and GHz signal speeds. The multi-layer chip beads are organized by increasing package size and current carrying capacity. -All multi-layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided. -The impedance values listed are typical values. The nominal impedance with a 25% tolerance is specified for the + marked 100 MHz. Chip beads are measured for impedance on the HP 4291A and fixture HP 16192A. -Chip beads have plated contacts, 100% tin over a nickel undercoating. They can accommodate both reflow and wave soldering technologies. -The suggested land patterns are in accordance to the latest revision of IPC-7351. -Recommended storage and operating temperature range is -55C to 125C. -Our Chip Bead Kit (part number 0199000018) is available for prototype evaluation.Fair-Rite Product s Catalog Part Data Sheet, 2506033007Y3 Printed: 2013-07-03 Fair-Rite Products Corp. PO Box J,One Commercial Row, Wallkill, NY 12589-0288 Phone: (888) 324-7748 www.fair-rite.com Mechanical Specifications Land Patterns V W X Y Z Dim mm mm nominal inch ref tol inch misc. 0.600 1.700 1.000 1.100 - A 0.80 0.15 0.031 - 0.024 0.067 0.039 0.043 - B 0.80 0.15 0.031 - Winding Information C 1.60 0.15 0.063 - Turns Wire 1st Wire 2nd Wire D 0.40 0.20 0.016 - E - - - - Tested Size Length Length F - - - - - - - - G - - - - H - - - - Reel Information J - - - - Tape Width Pitch Parts 7 Parts 13 Parts 14 K - - - - mm mm Reel Reel Reel Electrical Specifications 8 4 4000 10000 - Typical Impedance ( ) Package Size 50 MHz 23 Pkg Size 100 MHz+ 30 25% 0603 500 MHz 40 (1608) 1000 MHz 41 Connector Plate Holes Rows Electrical Properties - - Signal Speed Standard Max DCR ( ) 0.04 Max Current (mA) 3000 Legend + Test frequency Preferred parts, the suggested choice for new designs,have shorter lead times and are more readily available. The column H(Oe) gives for each bead the calculated dc bias field in oersted for 1 turn and 1 ampere direct current. The actual dc H field in the application is this value of H times the actual NI (ampere-turn) product. For the effect of the dc bias on the impedance of the bead material, see figures 18-23 in the application note How to choose Ferrite Components for EMI Suppression. A turn is defined as a single pass through a hole. l/A - Core Constant l : Effective Path Length e A : Effective Cross-Sectional Area V : Effective Core Volume e e L A - Inductance Factor ( ) Nl - Value of dc Ampere-turns 2 N L N/AWG - Number of Turns/Wire Size for Test Coil