X-On Electronics has gained recognition as a prominent supplier of H330S Q50-20-MINI_PCIE-10 RF Modules across the USA, India, Europe, Australia, and various other global locations. H330S Q50-20-MINI_PCIE-10 RF Modules are a product manufactured by Fibocom. We provide cost-effective solutions for RF Modules, ensuring timely deliveries around the world.

H330S Q50-20-MINI_PCIE-10 Fibocom

Name: H330S Q50-20-MINI_PCIE-10
Brand: Fibocom
SKU: H330SQ5020MINIPCIE10_Fibocom
Availability: OutOfStock
Rating: 5 (11 reviews)

H330S Q50-20-MINI_PCIE-10 electronic component of Fibocom

H330S Q50-20-MINI_PCIE-10 Embedded Solutions

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See Product Specifications

Part No.	H330S Q50-20-MINI_PCIE-10
Manufacturer:	Fibocom
Category:	RF Modules
Description:	Module: GSM; HSPA+, WCDMA; 3G; D:21Mbps; GPIO, SIM, UART x2,USB
Datasheet:	H330S Q50-20-MINI_PCIE-10 Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1: USD 35.4051 ea
Line Total: USD 35.41

Availability - 0

MOQ: 1 Multiples: 1
Pack Size: 1

H330S Q50-20-MINI_PCIE-10 More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Wed. 16 Jul to Fri. 18 Jul MOQ : 1 Multiples : 1	1 : USD 35.4051 25 : USD 32.7565

Specifications

Manufacturer Fibocom Fibocom
Product Category RF Modules RF Modules
Dimensions 50.95X30x3.45Mm 50.95X30x3.45Mm
Interface Gpio, Sim, Uart X2, Usb Gpio, Sim, Uart X2, Usb
Case Mini Pcie Mini Pcie
Application Data Data
Standard 3G 3G
Communictions Protocol Ftp, Http, Mms, Ntp, Pop3, Ppp, Smtp, Ssl, Tcp, Udp Ftp, Http, Mms, Ntp, Pop3, Ppp, Smtp, Ssl, Tcp, Udp
Transmission Hspa + , Wcdma Hspa + , Wcdma
Type Of Communications Module Gsm Gsm
Downlink Transfer Rate 21Mbps 21Mbps
Supply Voltage 3.3 To 4.2 VDC 3.3 To 4.2 VDC

We are delighted to provide the H330S Q50-20-MINI_PCIE-10 from our RF Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the H330S Q50-20-MINI_PCIE-10 and other electronic components in the RF Modules category and beyond.

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Additional Infomation About Product

27.8mm H330S HSPA+ Module Perfect Wireless Experience Quad-band FIBOCOM H330S LGA module adopts one of the most advanced GSM/GPRS/EDGE Intel platforms in the industry and supports the main 3G frequencies of global 3G. It provides multiple interfaces for Quad-band HSPA/HSPA+ customers, such as USB2.0,UART,I2C,I2S. It has a built-in TCP/IP&UDP/IP protocol stack . 5.76Mbps HSUPA H330S not only can it be applied to industrial elds such as 21Mbps HSDPA vehicle navigation, security monitoring, wireless POS, and remote medical services, but also can be applied to consumer Internal TCP/IP & UDP/IP electronics such as tablet PC, and e-books, fully satisfying the demand of mobile broadband applications for all kinds of users. Temperature Range -40~+85 33.8mm Analog and Digital Audio Available For Global Market PERFEC T WIRELES S EXPERIENCE bocom.com27.8mm27.8mm H330S HSPA+ Module Perfect Wireless Experience H330S HSPA+ Module Technical Specications Product Features WCDMA: Band 1,2,5,8 or Band 1,8 RX Sensitivity GSM/GPRS/EDGE: 850/900/1800/1900MHz UMTS/HSPA: -109dBm or 900/1800MHz GSM: -108dBm LGA 120pin 33.8 x 27.8 x 2.45mm TX Power Operating Voltage: 3.3~4.5V UMTS/HSPA+ Class 3 (0.25W) Current Consumption GSM 850/900 MHz Class 4 (2W) 2mA(Sleep Mode) GSM 1800/1900 MHz Class 1 (1W) 3G Idle: 13mA EDGE 850/900 MHz Class E2 ( 0.5W) 3G Talk: 500mA EDGE 1800/1900 MHz Class E2 ( 0.4W) 2G Talk: 260mA (GSM PCL5) AT Command Set: FIBOCOM proprietary AT commands/ GSM 07.05/GSM 07.07 Data UMTS/HSDPA/HSUPA 3GPP release 7 MUX: HSUPA 5.76Mbps (Cat 6) Basic Mode HSDPA 21Mbps (Cat 14)/7.2Mbps (Cat 8) MO/MT Text and PDU modes GSM 3GPP release 7 Cell broadcast EDGE (E-GPRS) Multi-slot class 33(296kbps DL SMS: 236.8kbps UL) MO/MT Text and PDU modes GPRS Multi-slot class 33(107kbps DL85.6kbps UL) Cell broadcast Embedded TCP/IP and UDP/IP protocol stack Interfaces Drivers SIM Card1.8V/2.8V I2C Win CE Multiple Proles over USB I2S Linux 2.6.18 above 1 x USB 2.0 Multi-endpoints GPIO Android 4.2 above 2 x UART RTC MUX Over UART1 Approvals CCC/SRRC/NAL/RoHS/CE /GCF/FCC/PTCTB/TELEC/RCM/ANATEL Copyright 1999~2015 Fibocom Wireless Inc. Subject to changes in technology, design and availability E-mail : market bocom.com Tel : +86 755-2673 3555 PERFEC T WIRELES S EXPERIENCE bocom.com 33.8mm33.8mm

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

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