ICK BGA 14 X 14 X 10 Fisher

ICK BGA 14 X 14 X 10 electronic component of Fisher
ICK BGA 14 X 14 X 10 Fisher
ICK BGA 14 X 14 X 10 Heat Sinks
ICK BGA 14 X 14 X 10  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of ICK BGA 14 X 14 X 10 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ICK BGA 14 X 14 X 10 Heat Sinks are a product manufactured by Fisher. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. ICK BGA 14 X 14 X 10
Manufacturer: Fisher
Category: Heat Sinks
Description: Heatsink: extruded; black; L:14mm; W:14mm; H:10mm; aluminium
Datasheet: ICK BGA 14 X 14 X 10 Datasheet (PDF)
Price (USD)
1: USD 1.5876 ea
Line Total: USD 1.59 
Availability : 1678
  
Ship by Wed. 01 Oct to Fri. 03 Oct
QtyUnit Price
1$ 1.5876
10$ 1.3524
19$ 1.0878
51$ 1.029

Availability 1678
Ship by Wed. 01 Oct to Fri. 03 Oct
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.5876
10$ 1.3524
19$ 1.0878
51$ 1.029

   
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We are delighted to provide the ICK BGA 14 X 14 X 10 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ICK BGA 14 X 14 X 10 and other electronic components in the Heat Sinks category and beyond.

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The ICK BGA 14 X 14 X 10 is a ball grid array (BGA) package manufactured by Fisher. This particular BGA package is 14 mm x 14 mm x 10 mm in size and is used as a connection point on a printed circuit board (PCB). It is a surface mountable device that uses a plastic or metal enclosing along with solder balls that are in contact with the PCB. The ICK BGA 14 X 14 X 10 features a large number of pins on the device to ensure reliable, cross process communication. The design of the ICK BGA 14 X 14 X 10 is optimized for maximum signal integrity, tolerancing, and reliability. The solder properties of ICK BGA 14 X 14 X 10 are optimized for high temperature environments and provide excellent quality assurance throughout the product’s life cycle.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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