X-On Electronics has gained recognition as a prominent supplier of ICK BGA 27X27 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ICK BGA 27X27 Heat Sinks are a product manufactured by Fisher. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

ICK BGA 27X27 Fisher

ICK BGA 27X27 electronic component of Fisher
ICK BGA 27X27 Fisher
ICK BGA 27X27 Heat Sinks
ICK BGA 27X27 Thermal Management

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See Product Specifications
Part No. ICK BGA 27X27
Manufacturer: Fisher
Category: Heat Sinks
Description: HEAT SINK, BALL GRID
/ 27 x 27mm Integrated Circuit Chip Scale Ball Grid Array package suitable for consumer products.
Datasheet: ICK BGA 27X27 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.1021 ea
Line Total: USD 2.1 
Availability - 294
Ship by Mon. 16 Jun to Wed. 18 Jun
MOQ: 1  Multiples: 1
Pack Size: 1

 ICK BGA 27X27 More Buying Options & Price Grid(s)

Availability Price Quantity
294
Ship by Mon. 16 Jun to Wed. 18 Jun
MOQ : 1
Multiples : 1
1 : USD 2.1021
10 : USD 1.8816
14 : USD 1.4994
36 : USD 1.4259

Specifications

   
Manufacturer
Product Category
Thermal Resistance
Packages Cooled
External Height - Metric
External Width - Metric
External Length - Metric
External Diameter - Metric
Heat Sink Material
External Height - Imperial
External Width - Imperial
External Length - Imperial
External Diameter - Imperial
Svhc
Mounting Type
Surface Finish
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the ICK BGA 27X27 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ICK BGA 27X27 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

& Paykel Fisher & Paykel ICK BGA 27x27 is an Interposer Card BGA (Ball Grid Array) package designed to provide electrical interconnect between a printed circuit board and enclosed components. It has a 27x27 array of solder balls on a 0.5 mm pitch, designed with a ground plane on one side, and a signal routing plane on the other. ICK BGA 27x27 packages are designed to be used in space-constrained environments, such as those found in PC and laptop designs. They are also used in high-density, high-speed communication devices, such as digital cellular base stations.

HS Compliance

Tariff Desc

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