ICK PGA 9X9 Fisher

ICK PGA 9X9 electronic component of Fisher
ICK PGA 9X9 Fisher
ICK PGA 9X9 Heat Sinks
ICK PGA 9X9  Thermal Management
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of ICK PGA 9X9 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ICK PGA 9X9 Heat Sinks are a product manufactured by Fisher. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

Part No. ICK PGA 9X9
Manufacturer: Fisher
Category: Heat Sinks
Description: Heat Sink Passive PGA Pin Array Adhesive 14K/W Black Anodized
Datasheet: ICK PGA 9X9 Datasheet (PDF)
Price (USD)
1: USD 2.3667 ea
Line Total: USD 2.37 
Availability : 20
  
Ship by Fri. 08 Aug to Tue. 12 Aug
QtyUnit Price
1$ 2.3667
11$ 1.8228
30$ 1.7199

Availability 20
Ship by Fri. 08 Aug to Tue. 12 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 2.3667
11$ 1.8228
30$ 1.7199

   
Manufacturer
Product Category
Product
Fin Style
Height
Attachment Method
Device Cooled
Type
Rad Hardened
Product Depth Mm
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the ICK PGA 9X9 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ICK PGA 9X9 and other electronic components in the Heat Sinks category and beyond.

Image Part-Description
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Enclosure: with panel; FR; X:116mm; Y:220mm; Z:63.5mm; aluminium
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Enclosure: with panel; AKG; X:69mm; Y:100mm; Z:24mm; aluminium
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image AKG 69 24 50 SA
Enclosure: with panel; AKG; X:69mm; Y:50mm; Z:24mm; aluminium
Stock : 10
Large
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Stock Image CC 50 200 200 ME
Enclosure: with panel; CC; X:200mm; Y:200mm; Z:50mm; aluminium
Stock : 1
Large
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image AKG 41 16 80 ME
Enclosure: with panel; AKG; X:41mm; Y:80mm; Z:16mm; aluminium; grey
Stock : 4
Large
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image AKG 69 16 80 ME
Enclosure: with panel; AKG; X:69mm; Y:80mm; Z:16mm; aluminium; grey
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Hola1 H A H Heatsinks for PGA B C art. no. D ICK PGA 6 x 6 x 14 E WLF ... 14 x 14 art. no. F ICK PGA 8 x 8 x 12 WLF ... 23 x 23 art. no. G H ICK PGA 9 x 9 WLF ... 24 x 24 art. no. I ICK PGA 11 x 11 x 8 WLF ... 24 x 27 art. no. K L ICK PGA 11 x 11 WLF ... 24 x 27 M H H H Thermal conduct. foil WLFT 404/405 E 5 SMD -heatsinks B 37 39 Thermal conductive glue E 15 Mounting material for semiconduct. E 35 39 B 10 Thermal conductive paste E 13 Hole pattern A 21 N Processor overview B 2 - 7 Technical introduction A 2 - 7 HHola1 H A H Heatsinks for PGA art. no. B C ICK PGA 11 x 11 x 12 WLF ... 24 x 27 art. no. D ICK PGA 14 x 14 WLF ... 31 x 34 E art. no. F ICK PGA 14 x 14 x 10 WLF ... 35 x 35 art. no. G ICK PGA 14 x 14 x 14 H WLF ... 35 x 35 art. no. I ICK PGA 14 x 14 x 12 WLF ... 36 x 36 K art. no. L ICK PGA 15 x 15 WLF ... 37 x 37 M H H H H Thermal conduct. foil WLFT 404/405 E 5 SMD -heatsinks B 37 39 Thermal conductive glue E 15 Mounting material for semiconduct. E 35 39 B 11 N Thermal conductive paste E 13 Hole pattern A 21 Processor overview B 2 - 7 Technical introduction A 2 - 7 H

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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