Discontinued in September 2019 Differential COnneCt Or fCn-260(D) Series roHS Compliant TM microGiGaCn Stacking Connector n featureS High speed matched impedance (100) differential signal connector Low cross talk 2-step sequential mating of contacts Self alignment feature Hot plugable RoHS compliant n SpeCifiCatiOnS Item Specifications Operating temperature -55 C to +105 C f ujitsu s fCn-260(D) range Differential Signal Connector AC 0.1A (signal) Current rating As network speeds increase, designers AC0.5A (ground) are moving to differential interconnects Voltage rating AC 30 V for network switches and hubs, as well 80m ohms max. (signal) as for connections between components Contact resistance 40m ohms max.(ground) in high-speed computer clusters, video systems, test equipment, and Insulation resistance 1000Mohms minimum real-time medical equipment (MRI, Dielectric withstanding etc.). Conventional connectors do not AC 500V for 1 minute voltage support the speed and signal integrity requirements of these applications. By Durability 100 cycles implementing a connector specifically Insertion force 50 N maximum (24 pair) for high-speed, high-density, board-to- board differential applications, designers Withdrawl force 5 N minimum (24 pair) can take advantage of a differential n MaterialS interconnect instead of more costly fiber optic or coax alternatives. Item Materials Differential signals use two conductors to carry signals that are compliments of Insulator LCP Resin (UL94V-0) one another. This arrangement reduces noise effects because any noise Conductor Copper Alloy introduced by interference or crosstalk Contact: Au Plating (PAGOS) Plating appears in both signals (common-mode Au over Pd-Ni plating noise) and is ignored by differential Specifications Dimensions are in millimeters (inches) TM microGiGaCn fCn-260 (D) Series networking hubs incorporate many boards that receivers. With noise voltages less of a problem, must be interconnected via short-run cables. differential signals can use a small voltage swing These internal cables often have to transfer data at that switches between LOW and HIGH values speeds significantly higher than those of the actual extremely quickly --hence the appeal of differential network, so even today s 10/100-Mbit networks signals for high-speed networking and clustering. need high-speed internal interconnects with Differential connector characteristics can exceed excellent signal integrity. In addition, any system the requirements of upcoming 1-Gbit applications that uses an external fiber optic connector probably and extend to next-generation applications at requires an internal, board-to-board connector speeds upwards of 4.4 Gbps. As a result, system system that works at the highest possible speeds. and board vendors who adopt such a connector can Fiber optic and coax interconnect systems look forward to legacy usage that spans multiple obviously meet the internal performance product generations. requirements, but the cost is high. Differential The signal transmission path of connectors has interconnects meet both the performance and not always been a critical issue when choosing cost goals but until recently, no connectors were an interconnect method because the connector s available that provided high-density connections electrical signal path is short compared to cables at gigabit speeds. In addition, connector test or printed circuit board assemblies. In applications methodologies from the past cannot give utilizing high-frequency signals, however, reliable and repeatable results of the differential connectors can have a significant effect on signal connector s performance in high-speed systems. integrity. Connectors for high-speed applications Therefore, new test methodologies must be must be designed to achieve optimal performance developed based on the unique characteristics of through the minimization of crosstalk and these emerging high-speed applications. susceptibility to noise influences. High-speed differential interconnect Differential signal applications characterization The shift from mainframe environments to In the past, connector manufacturersde- networked client/server enterprises has made imbedde the connector from the test PCB s networks a critical bottleneck for improving system to show just the electrical characteristics of the performance. Emerging technologies such as connector and did not include any parasitic high-speed server farms, video conferencing, effects associated with solder joints on a through and greater use of graphical interfaces is pushing hole contact lead, or the effects of the contact networks toward performance of 1 Gbit/sec and post (compliant or non-compliant pin) in a plated higher. The IEEE 802 committee is releasing 1.028- through hole. While this test methodology was Gbit Ethernet standards to meet this requirement. acceptable for slower system speeds, today s differential interconnects demand much more One of the key challenges for switch, hub, video focused attention on system and board effects. equipment, and server manufacturers is to find a board-to-board connector system that allows The requirements for testing today s high-speed signals to transfer at gigabit speeds over an differential interconnects are demanding with affordable interconnect system that furnishes good reason. Connectors and other traditionally specific matched-impedance characteristics. electrically smal components are no longer small Applications such as servers are now moving when considering presently available signaling to extremely high-speed interfaces (often technologies with 100ps risetimes and multi-gigabit based on Fibre Channel) between computer data rates. Among these requirements are very backplanes and disk subsystems that require well-designed test boards needed for accurate advance interconnects between boards. Similarly, measurement and characterization. This data is Specifications 2 Dimensions are in millimeters (inches)