25SMT-6110-03

GORE SMT EMI Gaskets and Grounding Pads Excellent electrical performance with SMT convenience GORE SMT EMI Gaskets and Grounding Pads combine unsurpassed conductivity with the convenience of SMT- compatible format. These conformable components are engineered to maintain consistent contact and low DC resistance. Unlike the traditional designs of pogo pins and universal clips that can easily break, the robust design of GORE SMT EMI Gaskets and Grounding Pads increase durability with large contact surfaces rather than single-point contacts. The unique construction of GORE SMT EMI Gaskets and Grounding Pads ensures that the device maintains signal integrity and reliable electrical performance in harsh environments. Because of their compatibility with SMT equipment for printed circuit board production, GORE SMT EMI Gaskets and Grounding Pads reduces total costs. Using these off-the-shelf components eliminates the need for custom designs that can Bene ts of GORE SMT EMI Gaskets increase engineering costs. Also, no secondary processing is and Grounding Pads required, which reduces equipment and labor costs during production. Using precise SMT equipment to incorporate Excellent shielding effectiveness and low DC resistance with conformable construction GORE SMT EMI Gaskets and Grounding Pads improves the consistency and repeatability of PCB assembly, thus Reliable electrical performance achieved through decreasing waste. consistent contact over time Reduced total costs versus custom options due to GORE SMT EMI Gaskets and Grounding Pads offer a full standard sizes and compatibility with SMT technology spectrum of working ranges, making them ideal for use as Increased design exibility with easily integrated grounding pads, EMI gaskets, and antenna contacts. The highly standard parts compressible SMT Supersoft Series delivers consistent electrical performance with minimal force required for initial conductivity. Consistent and repeatable assembly with parts that need no secondary processing The SMT GS5200 Series offers the highest conductivity under compression in Gores EMI shielding product line. In addition to Enhanced durability due to conformable material that maintains contact over time without compromising the these high-performance characteristics, GORE SMT EMI Gaskets integrity of the mating surface and Grounding Pads have been tested against a variety of Faster production times because of standard solder environmental standards (Table 1). process that requires no cure time Typical Applications Portable electronic devices such as smartphones and tablets GPS and handheld scanners/readers Gaming devices Personal computers and laptops Telecommunication infrastructure GORE SMT EMI Gaskets and Grounding Pads are covered by patent No. US 6,255,581 B1 and US 6,210,789 B1. Corresponding foreign patents issued. GORE SMT EMI Gaskets and Grounding Pads - SMT Supersoft Series is covered by patent No. US 6,255,581 B1 and US 7,129,421 B2. Corresponding foreign patents issued. PHASEFLEX GORE SMT EMI Gaskets and Grounding Pads MICROWAVE/RF TEST ASSEMBLIES Figure 1: Recommended Compressed Part Table 1: Environmental Properties Heights for SMT Supersoft Series Property Value 2.30 2.20 mm 1.8 N 2.20 2.10 Operating temperatures -55C to 125C 2.00 1.90 mm 3.6 N 1.90 RoHS Status* (lead, cadmium, hexavalent 1.80 Pass 1.70 chromium, mercury, bromine) 1.60 1.60 mm 6.2 N 1.48 mm 0.9 N 1.50 Flammability in accordance with UL 1.40 Pass 1.30 horizontal burn method 1.19 mm 2.3 N 1.20 1.10 *W. L. Gore & Associates declares that we do not intentionally add substances listed in EU Directive 2011/65/EU to GORE SMT EMI Gaskets and Grounding Pads. Independent lab tests have been 1.00 performed and results are available upon request. 0.90 0.9 mm 7.0 N 25SMT-6110-01 25SMT-6110-03 Selection Guidelines GORE SMT EMI Gaskets and Grounding Pads are engineered to survive multiple re ow processes. These gaskets and Figure 2: Recommended Service Heights for grounding pads maintain conductivity in a wide range of SMT GS5200 Series service heights (gap distances). The closure force requirements 1.25 and broad range of tolerance take-up in these materials results 1.22mm 26 psi 1.15 in multiple product options for some gap distances. Selecting 1.06mm the most suitable product for a given application depends on 1.05 516 psi the following: 0.95mm 0.95 903 psi Gap distance of interfacing surfaces 0.85 0.81mm 13 psi Required compression force to achieve the speci ed gap 0.75 distance 0.71mm 516 psi 0.66mm 0.65 19 psi Necessary DC resistance for grounding applications or 0.58mm 0.59mm 1807 psi 774 psi 0.55 shielding effectiveness for shielding applications at a 0.46mm 4 psi 0.54mm 2065 psi speci c gap distance 0.45 0.41mm 387 psi 0.39mm 2323 psi The recommended service height for the various products in 0.35 0.50mm Thk 0.72mm Thk 0.84mm Thk 1.30mm Thk GORE SMT EMI Gaskets and Grounding Pads differs because of their unique constructions (Figures 1 & 2). Page 2 Thickness (mm) Compressed Part Height (mm)