SIM-ST-MFF2 Hologram

SIM-ST-MFF2 electronic component of Hologram
SIM-ST-MFF2 Hologram
SIM-ST-MFF2 SIM Cards
SIM-ST-MFF2  Embedded Solutions
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of SIM-ST-MFF2 SIM Cards across the USA, India, Europe, Australia, and various other global locations. SIM-ST-MFF2 SIM Cards are a product manufactured by Hologram. We provide cost-effective solutions for SIM Cards, ensuring timely deliveries around the world.

Part No. SIM-ST-MFF2
Manufacturer: Hologram
Category: SIM Cards
Description: SIM Cards GLOBAL EMBEDDED SIM CARD
Datasheet: SIM-ST-MFF2 Datasheet (PDF)
Price (USD)
N/A

Obsolete

Availability 0
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 7.2022
100$ 5.13
250$ 4.8276
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Description/Function
Dimensions
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Series
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the SIM-ST-MFF2 from our SIM Cards category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the SIM-ST-MFF2 and other electronic components in the SIM Cards category and beyond.

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Hardware Features Chip Type Industrial Grade Standard Grade Supplier Starchip Samsung Chip Codes SCM392G S3FS9FG Electrical Characteristics 1.6V to 5.5V 1.6V, 3V and 5V Operational Temperature Characteristics -40 to 105C -25 to 85C Memory Size available for program and data 136K/256K 340K/440K NVRAM characteristics Endurance cycles (min) 25 Min. 200MM read/write cycle Min. 500K read/write cycle Data retention (min) 25 25 Years 25 Years Vibration Passes JESD22-B103 Sector/Bank erase time 1.5ms/3ms 1.5ms/3ms Page write/erase time 1.5ms/0.4ms 1.5ms/0.4ms Software Features Platform Technology 2G/3G/4G/LTE 2G/3G/4G/LTE UICC Release 8 Release 8 Java Card 2.2.1 or higher 2.2.1 or higher Global Platform 2.2.1 2.2.1 Supported Applications SIM Release 4 Release 4 USIM Release 8 Release 8 ISIM Release 8 Release 8 HPSIM Release 8 OTA Capabilities Remote File Management Release 8 Release 8 Remote Applet Management Release 8 Release 8 SIM Card Physical Characteristics Embedded Form Factor (MFF2) Module Format MFF2 (QFN8) embedded. Size 6 x 5mm*, (height: 0.75-0.82mm) Standard TS 102.671 - standardized format Fitting Soldered to circuit board Transportation On trays/reels/boxes Technical Details (MFF2)SIM Card Physical Characteristics 2FF - Mini SIM 3FF - Micro SIM 4FF - Nano SIM Height: 25mm Height: 15mm Height: 12.3mm Width: 15mm Width: 12mm Width: 8.8mm Thickness: 0.76mm Thickness: 0.76mm Thickness: 0.67mm

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

8542.32.00 33 No ..Memory cards (other than ""smart"" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
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