The following document contains information on Cypress products. Although the document is marked with the name Broadcom, the company that originally developed the specification, Cypress will continue to offer these products to new and existing customers. CONTINUITY OF SPECIFICATIONS There is no change to this document as a result of offering the device as a Cypress product. Any changes that have been made are the result of normal document improvements and are noted in the document history page, where supported. Future revisions will occur when appropriate, and changes will be noted in a document history page. CONTINUITY OF ORDERING PART NUMBERS Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed in this document. FOR MORE INFORMATION Please visit our website at www.cypress.com or contact your local sales office for additional information about Cypress products and services. OUR CUSTOMERS Cypress is for true innovators in companies both large and small. Our customers are smart, aggressive, out-of-the-box thinkers who design and develop game-changing products that revolutionize their industries or create new industries with products and solutions that nobody ever thought of before. ABOUT CYPRESS Founded in 1982, Cypress is the leader in advanced embedded system solutions for the worlds most innovative automotive, industrial, home automation and appliances, consumer electronics and medical products. Cypresss programmable systems-on-chip, general-purpose microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance memories help engineers design differentiated products and get them to market first. Cypress is committed to providing customers with the best support and engineering resources on the planet enabling innovators and out-of-the-box thinkers to disrupt markets and create new product categories in record time. To learn more, go to www.cypress.com. Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 002-14888 Rev. *A Revised July 1, 2016 Data Sheet BCM20737S Bluetooth Low Energy System-in-Package (SiP) Module GENERAL DESCRIPTION FEATURES The BCM20737S is a compact, highly integrated Moisture Sensitivity Level (MSL) 3 compliant Bluetooth low energy (BLE) system-in-package (SiP) 6.5 mm 6.5 mm 1.2 mm Land Grid Array module. The BCM20737S SiP includes an embedded (LGA) 48-pin package BLE antenna, 24 MHz clock, and 512 Kb EEPROM, APPLICATIONS so only a minimal set of external components is needed to create a standalone BLE device. Profiles supported in ROM: Battery status The BCM20737S is designed to accelerate time to market. The Bluetooth stack and several application Blood pressure monitor profiles are built into the module, allowing customers Find me to focus on their core applications. To further reduce Heart rate monitor application development time, the BCM20737S Proximity includes integrated software support, with one-click Thermometer installation of the complete environment and a one- Weight scale click compile/build/link/load cycle. All this, coupled with an ultrasmall form factor and support for a wide Time voltage range, makes the BCM20737S well suited for Blood glucose monitor virtually any Bluetooth Smart application. Support for RSA security library FEATURES Support for LE Audio Support for pairing using NFC tags ARM Cortex-M3 microcontroller unit (MCU) Embedded 512 Kb EEPROM Additional profiles supported in RAM: Broadcom Serial Control (BSC), SPI, and UART Blood glucose monitor interfaces Temperature alarm FCC and CE compliant Location RoHS compliant, certified lead- and halogen-free Other custom profiles 20737S-DS101-R Corporate Headquarters: San Jose, CA April 10, 2016