Product Information


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System-On-Modules - SOM Inforce 6560 SBC (Board Only) Snapdragon 660 processor,;Android OS, 3GB LPDDR4, 32GB eMMC Board Only. No MIPI-;DSI, Sensors, GbE, PoE Header and 3rd MIPI-CSI connector.
Manufacturer: Inforce Computing

Price (USD)

Availability Price Quantity
0 - Global Stock

MOQ : 1
Multiples : 1

Stock Image

Inforce Computing

1 : USD 362.1429

Inforce Computing
Product Category
System-On-Modules - SOM
Form Factor
50 Mm X 28 Mm
Processor Brand
Processor Type
Qualcomm Snapdragon 820
2.2 GHz
Memory Size
4 gb , 64 gb
Memory Type
Lpddr4, Ufs 2.0
Interface Type
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 70 C
50 Mm X 28 Mm
Inforce Computing
Minimum Operating Temperature
0 C
Product Type
System - On - Modules - Som
Factory Pack Quantity :
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Inforce 6601 Micro SOM Qualcomm Snapdragon 820 Processor-based Tiny System on Module 4K UHD HEVC Video and HDMI 2.0 Capable Micro Compute Power and Performance SOM for SWaP Constrained Embedded Applications Qualcomm Snapdragon 820 processor (APQ8096 SoC) Quad-core ARMv8 64-bit CPUs organized as two dual clusters viz., Gold@2.2GHz and Silver@1.6GHz each Adreno 530 GPU with 64 bit addressing and support for OpenGL ES 3.2, OpenCL 2.0, and Vulcan Hexagon 680 DSP with dual-Hexagon vector processor (HVX-512) @825MHz for ultra low-power audio and computer vision processing Dual 14-bit Spectra ISP with support for up to 1.2GPix/sec throughput with zero shutter lag The Inforce 6601 Micro SOM, powered by the next-gen ARMv8 Onboard LPDDR4 RAM, UFS Flash Memory, WiFi/BT, audio 64-bit quad-core Qualcomm Snapdragon 820 applications codec, power management and GPS processor (APQ8096), is suitable for several advanced embedded applications. The Inforce 6601 Micro SOM provides Complete 4K60 encode/decode system - 4k60 H.265/VP9 pin, electrical, connector, and form-factor compatibility across a decode with uncompressed 4K display wide product line of Micro SOMs that share a common carrier board design. The Inforce 6601 Micro SOM also comes with an optional EMI shielding for better RF noise protection, while also doubling up as a medium for heat spreading and dissipation to improve performance. Storage, Multimedia, and Connectivity 4GB LPDDR4@ 1866MHz 64GB UFS 2.0 gear 3 (1 lane) eMMC 5.1 (optional) 1x SD card SD3.0 interface with support up to HS400 H.264 playback and capture @4K60 H.265 playback @4K60 and capture @4K30 Hi-Fi Audio with codec support for MP3, AAC + eAAC, WMA 9/Pro, Dolby AC-3, eAC-3, DTS Dual 4-lane DSI DPHY 1.2 and HDMI 2.0 interfaces for touch Broad Application Space screen displays Supports the capture of up to 28 megapixels with zero shutter lag on MIPI-CSI BT 4.2 LE and dual band WLAN 2x2 MU-MIMO Flexible and Configurable I/O Interfaces Carrier Board For Inforce 6601 Micro SoM HDMI V2.0 Dual MIPI-DSI (4-lane) with touch 2x 4-lane MIPI-CSI 1xUSB 3.0; 1x USB 2.0 (Host/Device/OTG) 12x BLSPs for GPIO/UART/I2C/SPI 4x Lineout; 1x Headphone; 3x Mic-in; 1x SlimBUS 1x PCIe; 1x SDC 802.11ac 2X2 MU-MIMO 2.4/5GHz Wi-Fi & BT 4.2LE; 2x MHF4 *Not all interfaces can be used at the same time GPS/GNSS; 1x MHF4 GbE (on carrier) A mini-ITX carrier board (170 X170mm) expands the I/O and connectivity of the Inforce 6601 micro SOM. A full-edged fl development platform (Inforce 6601 Development Kit) Power, Mechanical and Environment inclusive of both is available. Power: +3.3V/6A Input Dimensions: 28mm x 50mm Ordering Information Operating Temp: 0C to 70C Weight: 11grams / 0.4Oz Storage Temp: -20C to 80C Part Number Description Available Relative Humidity: 5 to 95% non-condensing IFC6601-00-P3 Micro SOM (Android) Now RoHS and WEEE compliant IFC6601-10-P3 Micro SOM (Linux) Q2 2017 SYS6601-00-P3 Mini-ITX Dev. Kit (Android) Now Software SYS6601-10-P3 Mini-ITX Dev. Kit (Linux) Q2 2017 Android Marshmallow 6.0.1 BSP Debian Jessie (or higher) Linux BSP Inforce Embedded. Connected. Aware. Inforce Computing is a supplier of application-ready embedded hardware platforms in eco-aware, low-profile footprints, availabl e off -the-shelf to serve growing markets enabled by the next generation of connected devices. At Inforce, we are inspired by the inefl ction p oint in mobile and wireless technologies which is spawning innovative devices, content, and services. Together with silicon, software, and system partners, Inforce is pioneering products with an optimized delivery model for medical imaging, smart oceffi , hands -free computing, and robotics. 2017 Inforce Computing, Inc. All rights reserved. Product specicfi ations are subject to change without notice. Inforce Comp uting and the Inforce logo are registered trademarks of Inforce Computing, Inc. in the USA and other countries. All other trademarks and product information are the property of their respective owners. Global Sales & Support, Inforce Computing Inc., 48820 Kato Road Ste 600B, Fremont, CA 94538 USA. Phone: (510) 683-9999 | Email: 2017 Inforce Computing, Inc. Specifications subject to change without notice. Document Number: 002980 Rev A

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital: