10/28/2017 Intel XWAY PHY11G Gigabit PHY Product Specifications Intel XWAY PHY11G Gigabit PHY Ordering and spec information Specifications Intel XWAY PHY11G PEF7071 Gigabit PHY Ordering and Compliance Spec Code SLLHU Ordering and spec information Ordering Code PEF7071VV16 Trade compliance information Step A6 PCN/MDDS Information RCP 1.04 Intel XWAY PHY11G PEF7072 Gigabit PHY Spec Code SLLHN Ordering Code PEF7072HLV16 Step A6 RCP 1.15 Trade compliance information ECCN 5A991 CCATS NA US HTS 8542390001 PCN/MDDS Information SLLHU 947046 PCN MDDS SLLHN 947047 PCN All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is providedas-i and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems. Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction. Refer to Datasheet for formal definitions of product properties and features. Announced SKUs are not yet available. Please refer to the Launch Date for market availability. Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update. This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration. Conflict free and conflict-free means DRC conflict free, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the termconflict-fre in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers. See 10/28/2017 Intel XWAY PHY11G Gigabit PHY Product Specifications Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information. The Recommended Customer Price (RCP) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. For benchmarking data see