Product Information

EPM9560ARC208-10

EPM9560ARC208-10 electronic component of Intel

Datasheet
CPLD MAX 9000 Family 12K Gates 560 Macro Cells 144.9MHz 5V 208-Pin RQFP

Manufacturer: Intel
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Price (USD)

60: USD 768.8577 ea
Line Total: USD 46131.46

0 - Global Stock
MOQ: 60  Multiples: 60
Pack Size: 60
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 09 May to Wed. 15 May

MOQ : 60
Multiples : 60
60 : USD 768.8577
100 : USD 640.7253
500 : USD 512.5803

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Number of Macrocells
Number of Logic Array Blocks - LABs
Maximum Operating Frequency
Number of I/Os
Operating Supply Voltage
Maximum Operating Temperature
Mounting Style
Package / Case
Memory Type
Packaging
Series
Brand
Number Of Gates
Propagation Delay - Max
Minimum Operating Temperature
Operating Supply Current
Factory Pack Quantity :
Supply Voltage - Max
Supply Voltage - Min
Tradename
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MAX 9000 Includes MAX 9000A Programmable Logic Device Family June 2003, ver. 6.5 Data Sheet High-performance CMOS EEPROM-based programmable logic Features... devices (PLDs) built on third-generation Multiple Array MatriX (MAX ) architecture 5.0-V in-system programmability (ISP) through built-in IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface Built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990 High-density erasable programmable logic device (EPLD) family ranging from 6,000 to 12,000 usable gates (see Table 1) 10-ns pin-to-pin logic delays with counter frequencies of up to 144 MHz Fully compliant with the peripheral component interconnect Special Interest Groups (PCI SIG) PCI Local Bus Specification, Revision 2.2 Dual-output macrocell for independent use of combinatorial and registered logic FastTrack Interconnect for fast, predictable interconnect delays Input/output registers with clear and clock enable on all I/O pins Programmable output slew-rate control to reduce switching noise MultiVolt I/O interface operation, allowing devices to interface with 3.3-V and 5.0-V devices Configurable expander product-term distribution allowing up to 32 product terms per macrocell Programmable power-saving mode for more than 50% power reduction in each macrocell Table 1. MAX 9000 Device Features Feature EPM9320 EPM9400 EPM9480 EPM9560 EPM9320A EPM9560A Usable gates 6,000 8,000 10,000 12,000 Flipflops 484 580 676 772 Macrocells 320 400 480 560 Logic array blocks (LABs) 20 25 30 35 Maximum user I/O pins 168 159 175 216 t (ns) 10 15 10 10 PD1 t (ns) 3.0 5 3.0 3.0 FSU t (ns) 4.5 7 4.8 4.8 FCO f (MHz) 144 118 144 144 CNT Altera Corporation 1 DS-M9000-6.5MAX 9000 Programmable Logic Device Family Data Sheet Programmable macrocell flipflops with individual clear, preset, ...and More clock, and clock enable controls Features Programmable security bit for protection of proprietary designs Software design support and automatic place-and-route provided by Alteras MAX+PLUS II development system on Windows-based PCs as well as Sun SPARCstation, HP 9000 Series 700/800, and IBM RISC System/6000 workstations Additional design entry and simulation support provided by EDIF 2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM), Verilog HDL, VHDL, and other interfaces to popular EDA tools from manufacturers such as Cadence, Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity, and VeriBest Programming support with Alteras Master Programming Unit TM TM (MPU), BitBlaster serial download cable, ByteBlaster parallel TM port download cable, and ByteBlasterMV parallel port download cable, as well as programming hardware from third-party manufacturers Offered in a variety of package options with 84 to 356 pins (see Table 2) Table 2. MAX 9000 Package Options & I/O Counts Note (1) Device 84-Pin 208-Pin 240-Pin 280-Pin 304-Pin 356-Pin PLCC RQFP RQFP PGA RQFP BGA EPM9320 60 (2) 132 168 168 EPM9320A 60 (2) 132 168 EPM9400 59 (2) 139 159 EPM9480 146 175 EPM9560 153 191 216 216 216 EPM9560A 153 191 216 Notes: (1) MAX 9000 device package types include plastic J-lead chip carrier (PLCC), power quad flat pack (RQFP), ceramic pin-grid array (PGA), and ball-grid array (BGA) packages. (2) Perform a complete thermal analysis before committing a design to this device package. See Application Note 74 (Evaluating Power for Altera Devices). 2 Altera Corporation

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ALTERA
Altera (part of the Intel Group)
Altera (VA)
Altera Corporation
INTEL (ALTERA)
Intel (CPU)
Intel (formerly Altera)
Intel / Altera
INTEL / LEVEL ONE

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