Product Information

ISM43340-L77-TR

ISM43340-L77-TR electronic component of Inventek

Datasheet
Multiprotocol Modules 802.11 a/b/g/n WiFi and BT 4.0 Combo Radio Only SiP. 13x14 mm LGA. Certified FCC/IC/CE

Manufacturer: Inventek
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1000: USD 16.7843 ea
Line Total: USD 16784.3

0 - Global Stock
MOQ: 1000  Multiples: 1000
Pack Size: 1000
Availability Price Quantity
0 - Global Stock


Ships to you between Thu. 02 May to Mon. 06 May

MOQ : 1000
Multiples : 1000
1000 : USD 16.6088

     
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RoHS - XON
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ISM4334x Product Specification INVENTEK SYSTEMS ISM4334X-L77 Embedded SiP Module 802.11 a/b/g/n Bluetooth 4.0 & NFC Data Sheet DOC-DS-20072-3.2 Confidential Inventek Systems Page 1 ISM4334x Product Specification Table of Contents 1 PART NUMBER DETAIL DESCRIPTION .......................................................................... 3 1.1 Ordering Information ...................................................................................................... 3 2 OVERVIEW ........................................................................................................................... 3 3 FEATURES ............................................................................................................................ 4 3.1 Limitations ...................................................................................................................... 5 4 COMPLEMENTARY DOCUMENTATION ........................................................................ 5 4.1 Inventek Systems ............................................................................................................ 5 5 BLOCK DIAGRAM ............................................................................................................... 6 6 HOST INTERFACES ............................................................................................................. 6 6.1 UART Interface .............................................................................................................. 6 6.2 NFC Host Interfaces (ISM43341 only)........................................................................... 8 7 ELECTRICAL SPECIFICATIONS ....................................................................................... 8 7.1 Absolute Maximum Ratings ........................................................................................... 8 7.2 Environmental Ratings.................................................................................................... 9 7.3 Recommended Operating Conditions and DC Characteristics ....................................... 9 8 RF SPECIFICATIONS ........................................................................................................... 9 8.1 Bluetooth RF Specifications ........................................................................................... 9 8.2 WLAN RF Specifications ............................................................................................. 10 8.3 Environmental Specifications ....................................................................................... 13 9 PIN OUT AND DESCRIPTIONS ........................................................................................ 14 9.1 Module Pin-Out (1 of 2) ............................................................................................... 14 9.2 Module Pin-Out (2 of 2) ............................................................................................... 15 9.3 Recommended PCB Footprint (Bottom View) ............................................................. 16 9.4 Recommended PCB Footprint (Top View) .................................................................. 17 9.5 Detailed Pin Description ............................................................................................... 18 10 Product Compliance Considerations ..................................................................................... 20 11 Reflow Profile ....................................................................................................................... 21 12 Packaging Information .......................................................................................................... 22 12.1 MSL Level / Storage Condition .................................................................................... 22 12.2 Device baking requirements prior to assembly ............................................................. 23 13 REVISION CONTROL ........................................................................................................ 23 14 CONTACT INFORMATION ............................................................................................... 23 DOC-DS-20072-3.2 Confidential Inventek Systems Page 2

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
Inventek
Inventek Systems
IT4

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