X-On Electronics has gained recognition as a prominent supplier of ISM43340-L77-TR Multiprotocol Modules across the USA, India, Europe, Australia, and various other global locations. ISM43340-L77-TR Multiprotocol Modules are a product manufactured by Inventek. We provide cost-effective solutions for Multiprotocol Modules, ensuring timely deliveries around the world.

ISM43340-L77-TR Inventek

ISM43340-L77-TR electronic component of Inventek
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Part No. ISM43340-L77-TR
Manufacturer: Inventek
Category: Multiprotocol Modules
Description: Multiprotocol Modules 802.11 a/b/g/n WiFi and BT 4.0 Combo Radio Only SiP. 13x14 mm LGA. Certified FCC/IC/CE
Datasheet: ISM43340-L77-TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1000: USD 16.6088 ea
Line Total: USD 16608.8 
Availability - 0
MOQ: 1000  Multiples: 1000
Pack Size: 1000
Availability Price Quantity
0
Ship by Wed. 14 May to Fri. 16 May
MOQ : 1000
Multiples : 1000
1000 : USD 16.6088

   
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We are delighted to provide the ISM43340-L77-TR from our Multiprotocol Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ISM43340-L77-TR and other electronic components in the Multiprotocol Modules category and beyond.

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ISM4334x Product Specification INVENTEK SYSTEMS ISM4334X-L77 Embedded SiP Module 802.11 a/b/g/n Bluetooth 4.0 & NFC Data Sheet DOC-DS-20072-3.2 Confidential Inventek Systems Page 1 ISM4334x Product Specification Table of Contents 1 PART NUMBER DETAIL DESCRIPTION .......................................................................... 3 1.1 Ordering Information ...................................................................................................... 3 2 OVERVIEW ........................................................................................................................... 3 3 FEATURES ............................................................................................................................ 4 3.1 Limitations ...................................................................................................................... 5 4 COMPLEMENTARY DOCUMENTATION ........................................................................ 5 4.1 Inventek Systems ............................................................................................................ 5 5 BLOCK DIAGRAM ............................................................................................................... 6 6 HOST INTERFACES ............................................................................................................. 6 6.1 UART Interface .............................................................................................................. 6 6.2 NFC Host Interfaces (ISM43341 only)........................................................................... 8 7 ELECTRICAL SPECIFICATIONS ....................................................................................... 8 7.1 Absolute Maximum Ratings ........................................................................................... 8 7.2 Environmental Ratings.................................................................................................... 9 7.3 Recommended Operating Conditions and DC Characteristics ....................................... 9 8 RF SPECIFICATIONS ........................................................................................................... 9 8.1 Bluetooth RF Specifications ........................................................................................... 9 8.2 WLAN RF Specifications ............................................................................................. 10 8.3 Environmental Specifications ....................................................................................... 13 9 PIN OUT AND DESCRIPTIONS ........................................................................................ 14 9.1 Module Pin-Out (1 of 2) ............................................................................................... 14 9.2 Module Pin-Out (2 of 2) ............................................................................................... 15 9.3 Recommended PCB Footprint (Bottom View) ............................................................. 16 9.4 Recommended PCB Footprint (Top View) .................................................................. 17 9.5 Detailed Pin Description ............................................................................................... 18 10 Product Compliance Considerations ..................................................................................... 20 11 Reflow Profile ....................................................................................................................... 21 12 Packaging Information .......................................................................................................... 22 12.1 MSL Level / Storage Condition .................................................................................... 22 12.2 Device baking requirements prior to assembly ............................................................. 23 13 REVISION CONTROL ........................................................................................................ 23 14 CONTACT INFORMATION ............................................................................................... 23 DOC-DS-20072-3.2 Confidential Inventek Systems Page 2

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
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