QSMP Evalkit QSMP Evalkit QS Family - QFN Style Solder-Down Computer-on-Modules Processor Industrial grade 650 MHz dual core ARM Cortex -A7 based STM32 MP157C Memory 512MB DDR3L 4GB eMMC Temperature -25C to 85C Size Baseboard: 60mm x 90mm QSMP: 27mm x 27mm x 2.3mm All 100 pins on 0.1 pitch solder pads TFT Display Connector QSCOM: QSMP-1570 Debug UART USB Power Supply USB Host SD-CARD Gb Ethernet Ka-Ro electronics GmbH - Pascalstr. 22, D-52076 Aachen, Germany - Tel.: +49 2408 1402-0 (FAX -10) www.karo-electronics.deQSMP Advanced Soldering QFN Style Computer On Module Using a large solder pad underneath the component has not Advantages only electrical and thermal advantages. This is also used to Defined Return Path hold the component at a defined height during soldering, without the solder being compressed by the weight, which The reason PCB layout becomes more and more important is could result in short circuits. because of the trend to faster, higher integrated, smaller formfactors, and lower power electronic circuits. The higher Standard Contact Assignments the switching frequencies are, the more radiation may occur on a PCB. With good layout, many EMI problems can be minimized to meet the required specifications. When a module or component is used in a design, the supplier specifies the basis for such a layout. Its not only the pinout which should lead to an easy wiring without the need for crossings. He has also provide a proper solution for the signal path back to the module. If this return path, mostly the ground plane, cannot be connected near the signal pin, the return current has to take another way and this may result in a loop area. The larger the area, the more radiation and EMI problems may occur. Ka-Ro QSCOM modules uses a large ground pad on the bottom side. With this a defined ground plane connection is available for all signals. In addition to have a good return path for all signals this large ground pad can be used for cooling. Easy Wiring - Even 2-layer printed circuit boards can be used. With a solid ground plane on the bottom layer, high speed signals can be routed on the top layer at a defined impedance. However, this is only possible if a peripheral or plug can be connected directly without crossing the routing. Refer to fanout examples at the end of this document. Ka-Ro electronics GmbH - Pascalstr. 22, D-52076 Aachen, Germany - Tel.: +49 2408 1402-0 (FAX -10) www.karo-electronics.de