Accu-F / Accu-P Thin-Film Technology This accuracy sets apart these Thin-Film capacitors from THE IDEAL CAPACITOR ceramic capacitors so that the term Accu has been The non-ideal characteristics of a real capacitor can be employed as the designation for this series of devices, an ignored at low frequencies. Physical size imparts inductance abbreviation for accurate. to the capacitor and dielectric and metal electrodes result in resistive losses, but these often are of negligible effect on the circuit. At the very high frequencies of radio communication THIN-FILM TECHNOLOGY (>100MHz) and satellite systems (>1GHz), these effects Thin-film technology is commonly used in producing semi- 1 become important. Recognizing that a real capacitor will conductor devices. In the last two decades, this technology exhibit inductive and resistive impedances in addition to has developed tremendously, both in performance and in capacitance, the ideal capacitor for these high frequencies is process control. Todays techniques enable line definitions of an ultra low loss component which can be fully characterized below 1m, and the controlling of thickness of layers at 100 in all parameters with total repeatability from unit to unit. -2 (10 m). Applying this technology to the manufacture of Until recently, most high frequency/microwave capacitors capacitors has enabled the development of components were based on fired-ceramic (porcelain) technology. Layers where both electrical and physical properties can be tightly of ceramic dielectric material and metal alloy electrode paste controlled. are interleaved and then sintered in a high temperature oven. The thin-film production facilities at AVX consist of: This technology exhibits component variability in dielectric Class 1000 clean rooms, with working areas under quality (losses, dielectric constant and insulation resistance), laminar-flow hoods of class 100, (below 100 particles variability in electrode conductivity and variability in physical per cubic foot larger than 0.5m). size (affecting inductance). An alternate thin-film technology has been developed which virtually eliminates these vari- High vacuum metal deposition systems for high-purity ances. It is this technology which has been fully incorporated electrode construction. into Accu-F and Accu-P to provide high frequency capaci- Photolithography equipment for line definition down to tors exhibiting truly ideal characteristics. 2.0m accuracy. The main features of Accu-F and Accu-P may be summa- Plasma-enhanced CVD for various dielectric deposi- rized as follows: tions (CVD=Chemical Vapor Deposition). High purity of electrodes for very low and repeatable High accuracy, microprocessor-controlled dicing saws ESR. for chip separation. Highly pure, low-K dielectric for high breakdown field, High speed, high accuracy sorting to ensure strict high insulation resistance and low losses to frequencies tolerance adherence. above 40GHz. Very tight dimensional control for uniform inductance, unit to unit. Very tight capacitance tolerances for high frequency signal applications. TERMINATION ALUMINA SEAL ELECTRODE ELECTRODE DIELECTRIC ALUMINA ACCU-P CAPACITOR 6 Accu-F / Accu-P Thin-Film Chip Capacitors ACCU-F TECHNOLOGY ACCU-P TECHNOLOGY The use of very low-loss dielectric materials, silicon dioxide As in the Accu-F series the use of very low-loss dielectric and silicon oxynitride, in conjunction with highly conductive materials (silicon dioxide and silicon oxynitride) in conjunction electrode metals results in low ESR and high Q. These with highly conductive electrode metals results in low ESR and high-frequency characteristics change at a slower rate with high Q. At high frequency these characteristics change at increasing frequency than for ceramic microwave capacitors. a slower rate with increasing frequency than conventional ceramic microwave capacitors. Using thin-film technology, the Because of the thin-film technology, the above-mentioned above-mentioned frequency characteristics are obtained with- frequency characteristics are obtained without significant 1 out significant compromise of properties required for surface compromise of properties required for surface mounting. mounting. The use of high thermal conductivity materials The main Accu-F properties are: results in excellent RF power handling capabilities. Internationally agreed sizes with excellent dimensional The main Accu-P properties are: control. Enhanced RF power handling capability. Small size chip capacitors (0603) are available. Improved mechanical characteristics. Tight capacitance tolerances. Internationally agreed sizes with excellent dimensional control. Low ESR at VHF, UHF and microwave frequencies. Ultra Small size chip capacitors (0201) are available. High stability with respect to time, temperature, frequency Tight capacitance tolerances. and voltage variation. Low ESR at UHF, VHF, and microwave frequencies. Nickel/solder-coated terminations to provide excellent solderability and leach resistance. High-stability with respect to time, temperature, frequency and voltage variation. High temperature nickel/solder-coated terminations as stan- ACCU-F FEATURES dard to provide excellent solderability and leach resistance. Accu-F meets the fast-growing demand for low-loss (high-Q) capacitors for use in surface mount technology espe- ACCU-P FEATURES cially for the mobile communications market, such as cellular radio of 450 and 900 MHz, UHF walkie-talkies, UHF cordless Minimal batch to batch variability of parameters at high fre- telephones to 2.3 GHz, low noise blocks at 11-12.5 GHz and quency. for other VHF, UHF and microwave applications. The Accu-P has the same unique features as the Accu-F Accu-F is currently unique in its ability to offer very capacitor such as low ESR, high Q, availability of very low low capacitance values (0.1pF) and very tight capacitance capacitance values and very tight capacitance tolerances. tolerances (0.05pF). Typically Accu-F will be used in small The RF power handling capability of the Accu-P allows for signal applications in VCOs, matching networks, filters, etc. its usage in both small signal and RF power applications. Inspection test and quality control procedures in accordance Inspection, test and quality control procedures in accor- with ISO 9001, CECC, IECQ and USA MIL Standards yield dance with ISO 9001, CECC, IECQ and USA MIL Standards products of the highest quality. guarantee product of the highest quality. Hand soldering Accu-P : Due to their construction APPLICATIONS utilizing relatively high thermal conductivity materials, Cellular Communications Radar Systems Accu-Ps have become the preferred device in R & D labs CT2/PCN (Cordless Video Switching and production environments where hand soldering is used. Telephone/Personal Comm. Accu-Ps are available in all sizes and are electrically identi- Test & Measurements Networks) cal to their Accu-F counterparts. Filters Satellite TV VCOs Cable TV APPLICATIONS Matching Networks GPS (Global Positioning Systems) Cellular Communications Radar Systems Vehicle Location Systems CT2/PCN (Cordless Video Switching Vehicle Alarm Systems Telephone/Personal Comm. Test & Measurements APPROVALS Networks) Paging Filters Satellite TV ISO 9001 Military Communications VCO s Cable TV Matching Networks GPS (Global Positioning Systems) RF Amplifiers Vehicle Location Systems Vehicle Alarm Systems APPROVALS Paging ISO 9001 Military Communications 7